# Analog & Interface

PackageDescription:
Single-Channel High-Power High-Frequency SCALE-2 Driver Core, Pitch 2.54mm, Body  L 73.66mm x W 43.94mm, H 7mm

Part Description:
Single-Channel High-Power High-Frequency SCALE-2 Driver Core


PackageDescription:
Dual-Channel SCALE™-2 Driver Core, Body 45x34.29mm (Pin 2.54mm)


PackageDescription:
Dual-Channel SCALE™-2 Driver Core, Body 45x34.29mm (Pin 5.84mm)


Part Description:
Dual-Channel SCALE™-2 Driver Core, Increased EMI Capability, SSD


PackageDescription:
Dual-Channel High-Power High-Frequency SCALE-2 Driver Core

Part Description:
Dual-Channel High-Power High-Frequency SCALE-2 Driver Core


PackageDescription:
SOIC 8, Pitch 1.27mm - Body 4x5mm, IPC Medium Density

Part Description:
50 MBd(max) Monolithic CMOS Manchester Encoder


Part Description:
10 MBd Monolithic CMOS Manchester Decoders


Part Description:
20 MBd Monolithic CMOS Manchester Decoders


PackageDescription:
QFN, 0.50mm pitch, Square; 24 Pin, 4.00mm L X 4.00mm W X 1.49mm H body (w/Pullback Leads, Thermal Tab 1.4 X 1.4mm),  IPC Medium Density

Part Description:
VersaClock® 5 Low Power Programmable Clock Generator with Integrated Crystal


PackageDescription:
SOP, 0.65mm pitch; 8 pin, 4.40mm W X 3.00mm L X 1.20mm H body, IPC Medium Density

Part Description:
1.8V to 3.3V 1:2 LVCMOS High Performance Clock Buffer Family


PackageDescription:
QFN, 0.40mm Pitch, Square; 16 Pin, 2.50mm L X 2.50mm W X 0.55mm H body, IPC Medium Density

Part Description:
1.8V to 3.3V 1:8 LVCMOS High Performance Clock Buffer Family


PackageDescription:
SOP, 0.65mm Pitch; 16 Pin, 4.40mm W X 5.00mm L X 1.20mm H body, IPC Medium Density


PackageDescription:
QFN, 0.50mm Pitch, Square; 48 Pin, 7.00mm L X 7.00mm W X 0.90mm H Body (W/Thermal Tab 5.80mm X 5.80mm), IPC Medium Density

Part Description:
Freescale P10XX and P20XX System Clock with Selectable DDR Frequency


Part Description:
1-to-1 2.5V, 3.3V Differential-to-LVCMOS/LVTTL Translator


PackageDescription:
QFN, 0.50mm Pitch, Square; 4 Pin X 4 Pin, 3mm X 3mm X 1mm H Body (w/thermal tab 1.80 X 1.80mm),  IPC Medium Density


PackageDescription:
QFP, 0.50mm Pitch, Rect.; 128 Pin, 20.00mm L X 14.00mm W X 3.40mm H body, IPC Medium Density

Part Description:
Integrated 10/100/1000 Ultra Gigabit Ethernet Transceiver


PackageDescription:
BGA, 1.00mm Pitch, Rect.; 117 Pin, 9 columns X 13 rows, 10.00mm L X 14.00mm W X 1.54mm H Body, IPC Medium Density


PackageDescription:
QFN, 0.50mm Pitch, Square; 64 Pin, 9.00mm L X 9.00mm W X 1.00mm H Body (5.41mm X 6.45mm Thermal Tab), IPC Medium Density

Part Description:
Integrated 10/100/1000 Alaska® Gigabit Ethernet Transceiver


PackageDescription:
QFN, 0.50mm Pitch, Square; 56 Pin, 8.00mm L X 8.00mm W X 1.00mm H Body (4.37mm X 4.37mm Thermal Tab), IPC Medium Density

Part Description:
Alaska Integrated 10/100/1000 Mbps Energy Efficient Ethernet Transceiver


PackageDescription:
QFN, 0.40mm Pitch, Square; 25 Pin X 25 pin, 12.00mm X 12.00mm (w/thermal tab 6.9mm X 6.9mm)

Part Description:
16-Port, Bi-directional M-LVDS Clock Cross-Point Switch


PackageDescription:
GPS Receiver Module, SiRFstarIV, Mini Outline With Antenna

Part Description:
GPS Receiver Module, SiRFstarIV, Mini Outline With Antenna


PackageDescription:
SOIC 20, Pitch 1.27mm - Body 7.5x12.8mm, IPC Medium Density


PackageDescription:
DIL-32 Anybus®-IC™ Module for Fieldbus and Ethernet, Row Spacing 15.24mm; Pitch 2.54mm, Body 41.6 x 21.1mm

Part Description:
DIL-32 Anybus®-IC™ Module for Fieldbus and Ethernet


PackageDescription:
QFP, 0.50mm Pitch, Square, 48 Pin, 7.00mm L X 7.00mm W X 1.60mm H Body, IPC Medium Density

Part Description:
Variable Resolution, 10-Bit to 16-Bit R/D Converter with Reference Oscillator


PackageDescription:
Side-Brazed Ceramic Dual In-Line Package (SBDIP) 40 Leads, Row Spacing 15.24mm; Pitch 2.54 mm

Part Description:
Variable Resolution, Monolithic Resolver-to-Digital Converter


PackageDescription:
PLCC, 1.27mm Pitch, Square; 20 Pin, 8.97mm L X 8.97mm W X 4.57mm H Body, IPC Medium Density

Part Description:
Low Cost, Complete 12-Bit Resolver-to-Digital Converter


PackageDescription:
BGA, 1.00mm Pitch, Square; 144 pin, 12 columns X 12 rows, 13.00mm L X 13.00mm W X 1.60mm H Body, IPC Medium Density

Part Description:
CMOS Low Power, Quad Channel, 12 Bit, 40MS/S Pipelined ADC for Applications in Particle Physics Calorimetry


PackageDescription:
SOT, 0.65mm pitch; 8 pin, 1.625mm W X 2.90mm L X 1.45mm H body, IPC Medium Density

Part Description:
2.7 V to 5.5 V, Fully Accurate 16-Bit VOUT nanoDAC™ with SPI Interface


PackageDescription:
SOIC, 1.27mm Pitch; 24 Pin,7.50mm W X 15.40mm L X 2.65mm H Body, IPC Medium Density


PackageDescription:
DIP 8 Leads, Row Spacing 7.62 mm; Pitch 2.54 mm

Part Description:
50k Ohms, 128 Position, Increment/Decrement Digital Potentiometer


PackageDescription:
SOP, 0.65mm Pitch; 16 Pin, 4.40mm W X 5.00mm L X 1.20mm H Body IPC Medium Density

Part Description:
Nonvolatile Memory, 1024-Position, 10k Digital Potentiometer


Part Description:
Nonvolatile Memory, 1024-Position, 100k Digital Potentiometer


PackageDescription:
SOP, 14-Leads, Body 5.1x4.5mm (max), Pitch 0.65mm, IPC Medium Density

Part Description:
Dual 256-Position I2C Nonvolatile Memory, 50k Digital Potentiometers


PackageDescription:
SOP, 20-Leads, Body 6.5x4.4mm, Pitch 0.65mm, IPC Medium Density

Part Description:
Quad 256-Position I2C Nonvolatile Memory, 10k Digital Potentiometer


PackageDescription:
TSSOP, 10-Leads, Body 3.2x3.2mm (max), Pitch 0.50mm, IPC Medium Density

Part Description:
Nonvolatile, I2C-Compatible 256-Position, 50k Digital Potentiometer


PackageDescription:
DIP; 16 Leads; Row Spacing 7.62 mm; Pitch 2.54 mm


Part Description:
1024-Position, Digital Potentiometers with Maximum ±1% R-Tolerance Error and 20 Time Programmable Memory


PackageDescription:
SOP, 0.65mm, Pitch; 8 Pin, 3.0mm W X 3.0mm L X 1.10mm H Body, IPC Medium Density

Part Description:
2.7V to 5.5V, 140 uA, Rail-to-Rail Output 8-Bit DAC


Part Description:
2.5V to 5.5V, 500 uA Quad Voltage Output 12-Bit DAC


Part Description:
2.5V to 5.5V Octal Voltage Output 12-Bit DAC


Part Description:
2.5V to 5.5V, 115uA Parallel Interface Single Voltage-Output 8-Bit DAC


Part Description:
2.5 V to 5.5 V, 250 uA, 2-Wire Interface, Dual Voltage Output, 12-Bit DAC


PackageDescription:
SOP, 0.50mm pitch; 38 pin, 4.40mm W X 9.70mm L X 1.20mm H body, IPC Medium Density

Part Description:
2.5 V to 5.5 V, Parallel Interface Octal Voltage Output 12-Bit DAC


PackageDescription:
DIP 14 Leads, Row Spacing 7.62 mm; Pitch 2.54 mm

Part Description:
Monolithic Laser Trimmed Four-Quadrant Multiplier Divider


PackageDescription:
QFN, 0.50mm Pitch, Square; 56 Pin, 8.00mm L X 8.00mm W X 1.00mm H body (6.1mm X 6.1mm Thermal tab), IPC Medium Density

Part Description:
8-Channel, 16-Bit, Serial Input, Voltage Output DAC


PackageDescription:
QFN, 0.50mm Pitch, Square; 64 Pin, 9.00mm L X 9.00mm W X 1.00mm H Body (7.25 X 7.25mm Thermal Tab), IPC Medium Density

Part Description:
40-Channel, 16-Bit, Serial Input, Voltage Output DAC


Part Description:
32-Channel, 14-Bit, Serial Input, Voltage Output Digital-to-Analog Converter


PackageDescription:
QFP, 0.65mm Pitch, Square, 13 pin X 13 Pin, 12.00mm X 12.00mm X 1.60mm Body, IPC Medium Density

Part Description:
16-Channel, 5V, Serial Input, Single-Supply, 14-bit Voltage Output


PackageDescription:
BGA, 1.00mm Pitch, Square; 74 Pin, 11 Columns X 11 Rows, 12.00mm X 12.00mm X 1.70mm H

Part Description:
0.5 Ohm Output Impedance, 20V Output Voltage Span, 32-Channel, 14-Bit Voltage-Output DAC


Part Description:
500 Ohm Output Impedance, 10V Output Voltage Span, 32-Channel, 14-Bit Voltage-Output DAC


PackageDescription:
BGA, 1.00mm Pitch, Square;124 Pin,14 Columns X 14 Rows, 15.00mm X 15.00mm X 1.70mm H

Part Description:
32-Channel, 14-Bit DAC with Full-Scale Output Voltage Programmable from 50V to 200V


Part Description:
2.7 V to 5.5 V, Serial-Input, Voltage Output, Unbuffered 16-Bit DAC


Part Description:
Dual, Current-Output, Serial-Input, INL ±2 LSB, DNL ±1 LSB, 16-Bit DAC


Part Description:
Dual-Current Output, Parallel Input, 16-Bit Multiplying DAC with 4-Quadrant Resistors


PackageDescription:
SOP, 0.65mm Pitch; 16 Pin, 5.30mm W X 6.20mm L X 2.00mm H Body, IPC Medium Density

Part Description:
True Accuracy, 16-Bit ±12V/±15V, Serial Input Voltage Output DAC


PackageDescription:
BGA, 0.8mm Pitch, Square;80 Pin, 12 Columns X 12 Rows, 10.00mm X 10.00mm X 1.50mm H

Part Description:
16 Input, 16 Output Analog I/O Port With Integrated Amplifiers


PackageDescription:
SOT363, SC70-6, SOT, 0.65mm Pitch, 6 pin, 1.25mm W X 2.00mm L X 1.10mm H, IPC Medium Density

Part Description:
2.7V to 5.5V, <100 uA, 10-Bit nanoDAC, With I2C®-Compatible Interface


Part Description:
2.7V to 5.5V, <100 uA, 12-Bit nanoDAC, With I2C®-Compatible Interface


Part Description:
Dual, 12-Bit nanoDACs® with 5 ppm/°C On-Chip Reference, I2C Interface


Part Description:
Octal, 12-Bit SPI Voltage Output denseDAC with 5 ppm/°C On-Chip Reference


PackageDescription:
SOT363, 0.65mm pitch; 6 pin, 1.40mm W X 2.15mm L, IPC Medium Density

Part Description:
2.7V to 5.5V, <100 uA, 14-Bit nanoDAC, SPI Interface


PackageDescription:
SOIC,1.27mm, Pitch;28 Pin, 7.50mm W X 17.90mm L X 2.65mm H body, IPC Medium Density


Part Description:
Single, 16-Bit nanoDAC with 1.25V, 5ppm/°C On-Chip Reference


Part Description:
Single, 16-Bit nanoDAC with 2.5V, 5ppm/°C On-Chip Reference


Part Description:
Single, 16-Bit nanoDAC with 2.5V, 5ppm/°C On-Chip Reference, Power-On Reset to Code : Midscale


Part Description:
2.7V to 5.5V, 250uA, Rail-to-Rail Output 16-Bit nanoDAC


Part Description:
Quad, 16-Bit DAC with 5 ppm/°C On-Chip Reference, I2C Interface


Part Description:
Quad, 16-Bit DAC with 1.25V 5ppm/°C On-Chip Reference


Part Description:
Octal, 16-Bit, SPI Voltage Output denseDAC with 5ppm/°C, On-Chip Reference


PackageDescription:
QFN, 0.50mm Pitch, Square; 16 Pin, 3.00mm L X 3.00mm W X 0.80mm H Body (w/Thermal Tab 1.75 X 1.75mm),  IPC Medium Density

Part Description:
Quad, 16-Bit nanoDAC+ with SPI Interface


PackageDescription:
SOP, 0.65mm, Pitch; 24 Pin , 4.40mm W X 7.80mm L X 1.20mm H Body (w/Thermal tab 3.25x5.02mm), IPC Medium Density

Part Description:
Complete, Quad, 16-Bit Serial Input Unipolar/Bipolar Voltage Outputs DAC


Part Description:
16-Bit, Bipolar/Unipolar Voltage Output DACs with 2 ppm/°C Reference


PackageDescription:
QFP, 0.80mm Pitch, Square; 32 Pin, 7.00mm L X 7.00mm W X 1.20mm H Body, IPC Medium Density

Part Description:
Complete Quad, 16-Bit, High Accuracy, Serial Input, Bipolar Voltage Output DAC (INL: ±2 LSB Max)


PackageDescription:
QFN, 0.50mm Pitch, Rect.; 24 Pin, 5.00mm L X 4.00mm W X 1.00mm H Body (w/Thermal Tab 2.75 X 3.75mm),  IPC Medium Density

Part Description:
System Ready, 18-Bit ±1 LSB INL, Voltage Output DAC


Part Description:
True 18-Bit, ±0.5 LSB INL, ±0.5 LSB DNL, Voltage Output DAC


Part Description:
1 ppm 20-Bit, ±1 LSB INL, Voltage Output DAC


PackageDescription:
DIP 20 Leads, Row Spacing 7.62 mm; Pitch 2.54 mm


PackageDescription:
Side-Brazed Ceramic Dual In-Line Package (SBDIP) 14 Leads, Row Spacing 7.62 mm; Pitch 2.54 mm

Part Description:
Internally Trimmed Precision IC Multiplier


PackageDescription:
SOP, 0.65mm Pitch; 24 Pin, 4.40mm W X 5.00mm L X 1.20mm H Body IPC Medium Density

Part Description:
32-Bit, 10 kSPS, Sigma-Delta ADC with 100us Settling and True Rail-to-Rail Buffers


PackageDescription:
QFN, 0.50mm Pitch, Square; 32 Pin, 5.00mm L X 5.00mm W X 0.80mm H body (w/thermal tab 3.65 X 3.65mm),  IPC Medium Density

Part Description:
8-Channel, 4.8 kHz, Ultralow Noise, 24-Bit Sigma-Delta ADC with PGA


PackageDescription:
DIP 18 Leads, Row Spacing 7.62 mm; Pitch 2.54 mm


PackageDescription:
QFN, 0.50mm Pitch, Square; 20 Pin, 4.00mm L X 4.00mm W X 0.80mm H Body (w/Thermal Tab 2.75 X 2.75mm),  IPC Medium Density

Part Description:
8-Channel, I2C, 12-Bit SAR ADC with Temperature Sensor


Part Description:
500 kSPS, 8-Channel, Software-Selectable, True Bipolar Input, 12-Bit Plus Sign ADC


Part Description:
Differential Input, Dual, Simultaneaous Sampling, 4.2 MSPS, 14-bit, SAR ADC


Part Description:
Low Cost, Low Power, True RMS-to-DC Converter


PackageDescription:
SOT23, 6-Leads, Body 1.6x3.0mm, Pitch 0.95mm, IPC Medium Density


Part Description:
2.35V to 5.25V, 1 MSPS, 10-Bit ADC  (INL: ±0.5 LSB Max)


PackageDescription:
SOP, 0.65mm Pitch; 28 Pin, 4.40mm W X 9.70mm L X 1.20mm H body, IPC Medium Density

Part Description:
16-Channel, 1 MSPS, 12-Bit ADC With Sequencer


PackageDescription:
QFP, 0.50mm Pitch, Square; 64 Pin, 10.0mm L X 10.0mm W X 1.60mm H Body, IPC Medium Density

Part Description:
8-Channel DAS with 16-Bit, Bipolar Simultaneous Sampling ADC


Part Description:
6-Channel DAS with 16-Bit, Bipolar Simultaneous Sampling ADC


PackageDescription:
28 Leads Dual In-Line Package, Row Spacing 15.24mm; Pitch 2.54mm

Part Description:
16/18-Bit Self Calibrating Serial/Byte DACPORT


PackageDescription:
QFP, 0.50mm pitch, Square, 12 pin X 12 pin, 7.00mm X 7.00mm X 1.60mm Body,  IPC Medium Density

Part Description:
16-Bit, 250 kSPS, Unipolar/Bipolar Programmable Input PulSAR® ADC


PackageDescription:
QFN, (MO-220-VHHD-4) 0.50mm pitch,square; 8 pin X 8 pin, 5mm X 5mm X 1.00mm H body (w/thermal tab 3.25 X 3.25mm),  IPC Medium Density


Part Description:
16-Bit, 10 MSPS, PulSAR Differential ADC


PackageDescription:
QFN, 0.50mm Pitch, Square; 48 Pin, 7.00mm L X 7.00mm W X 1mm H body (W/Thermal Tab 5.25mm X 5.25mm), IPC Medium Density

Part Description:
18-Bit, 670 kSPS, Differential Programmable Input PulSAR® ADC


PackageDescription:
QFP, 0.50mm pitch, Square, 12 pin X 12 pin, 7.00mm X 7.00mm X 1.60mm Body, IPC Medium Density


Part Description:
16-Bit, 100 kSPS, Single-Ended,  PulSAR ADC


Part Description:
16-Bit, 100 kSPS PulSAR®, Differential ADC


Part Description:
16-Bit, 1.5 LSB INL, 500 kSPS PulSAR Differential ADC


Part Description:
18-Bit, 1.5 LSB INL, 250 kSPS PulSAR Differential ADC


PackageDescription:
QFP, 0.50mm pitch, Square; 16 pin X 16 pin, 10.00mm X 10.00mm X 1.20mm H body (w/thermal tab 6 X 6 mm), IPC Medium Density

Part Description:
2.5MSPS, 24-Bit, 100dB Sigma-Delta ADC With On-Chip Buffer


Part Description:
8-Channel, Low Noise, Low Powe, 16-Bit Sigma-Delta ADC with On-Chip In-Amp


PackageDescription:
SOIC 16, Pitch 1.27mm - Body 4x10mm, IPC Medium Density

Part Description:
2.7 V to 5.5 V, 200 kSPS 8-Bit Sampling ADC


Part Description:
Complete Very High Speed Sample-and-Hold Amplifier


Part Description:
2.7V to 5.25V, Micro Power, 8-Channel, 125 kSPS, 12-Bit ADC


Part Description:
8-Channel, 625 kSPS, 12-Bit Parallel ADCs with a Sequencer


PackageDescription:
QFN, (MO-220-WHHD-4) 0.50mm pitch,square; 8 pin X 8 pin, 5mm X 5mm X 0.80mm H body (w/thermal tab 3.25 X 3.25mm),  IPC Medium Density


PackageDescription:
QFN, 0.50mm Pitch, Square; 20 pin, 4.00mm L X 4.00mm W X 1.00mm H body (w/thermal tab 2.65 X 2.65mm),  IPC Medium Density


Part Description:
4-Channel, 12-Bit ADC with I2C-Compatible Interface


Part Description:
±0.5 LSB, 8-Channel, 10-Bit ADC With Standard And fast I2C-Compatible Interface


Part Description:
±0.5 LSB, 8-Channel, 10-Bit ADC With Standard, Fast, And High Speed I2C-Compatible Interface


Part Description:
250MHz, 10ns Switching Multiplexers With Amplifier


Part Description:
5MHz–400MHz 100dB High Precision Limiting-Logarithmic Amplifier


PackageDescription:
SON (DFN), 0.50mm pitch, 8 pin, 2mm X 3mm X 1mm H body (w/thermal tab 0.6 X 1.89mm),  IPC Medium Density

Part Description:
1MHz to 10GHz, 55 Db Logarithmic Detector/Controller


PackageDescription:
QFN, 0.65mm pitch,square; 4 pin X 4 pin, 4mm X 4mm X 1mm H body (w/thermal tab 2.25 X 2.25mm),  IPC Medium Density

Part Description:
1MHz to 8GHz, 70 dB Logarithmic Detector/Controller


PackageDescription:
SOP, 0.65mm Pitch; 16 Pin, 4.40mm W X 5.00mm L X 1.05mm H body (w/thermal tab 3.00mm X 3.00mm), IPC Medium Density


Part Description:
250 MHz, Voltage Output, 4-Quadrant Multiplier


PackageDescription:
QFN, 0.65mm Pitch, Square; 16 Pin, 4.00mm L X 4.00mm W X 0.80mm H Body (w/Thermal tab 2.4 X 2.4mm),  IPC Medium Density


PackageDescription:
SOIC 14, Pitch 1.27mm - Body 4x8.75mm, IPC Medium Density


PackageDescription:
QFN, 0.50mm pitch, Square; 22 pin X 22 pin, 12.00mm X 12.00mm (W/Thermal Tab 7.55mm X 7.55mm), IPC Medium Density

Part Description:
Quad, 16-Bit, 2.4 GSPS, TxDAC+® Digital-to-Analog Converter


Part Description:
12-Bit, 40 MSPS, 3V Analog-to-Digital Converter


PackageDescription:
QFN, 0.50mm Pitch, Square; 64 Pin, 9.00mm L X 9.00mm W X 1.00mm H Body (7.55 X 7.55mm Thermal Tab), IPC Medium Density

Part Description:
Octal, 14-Bit, 50 MSPS, Serial LVDS, 1.8 V Analog-to-Digital Converter


PackageDescription:
QFN, 0.50mm Pitch, Square; 48 Pin, 7.00mm L X 7.00mm W X 1.00mm H body (W/Thermal Tab 5.65mm X 5.65mm), IPC Medium Density

Part Description:
16-Bit, 125 MSPS, 1.8 V Analog-to-Digital Converter


PackageDescription:
BGA, 0.80mm Pitch, Square; 196 Pin, 14 Columns X 14 Rows, 12.00mm X 12.00mm X 1.27mm H

Part Description:
Integrated, Dual RF Transceiver with Observation Path


PackageDescription:
QFP, 0.50mm pitch, Square; 100 pin, 14.00mm L X 14.00mm W X 1.20mm H body (w/thermal tab 9.5mm x 9.5mm), IPC Medium Density


PackageDescription:
QFN,0.50mm pitch, square; 64 pin, 9.00mm L X 9.00mm W X 1.00mm H body (6.35mm X 6.35mm thermal tab), IPC Medium Density

Part Description:
Octal, 12-Bit, 40 MSPS, Serial LVDS, 1.8V Analog-to-Digital Converter


PackageDescription:
QFN, 0.50mm Pitch, Square; 8 Pin X 8 Pin, 5mm X 5mm X 1.00mm H Body (w/Thermal Tab 3.75 X 3.75mm),  IPC Medium Density

Part Description:
Single, 14-Bit, 170 MSPS, LVDS Interface, 1.8 V Analog-to-Digital Converter


PackageDescription:
QFN,0.50mm pitch,square;64 pin,9.QFN,0.50mm pitch,square;56 pin,8.00mm L X 8.00mm W X 0.80mm H body (6.7mm X 6.7mm thermal tab), IPC Medium Density

Part Description:
Quad, 16-Bit, 125 MSPS, JESD204B, 1.8V Analog-to-Digital Converter


Part Description:
12-Bit, 210 MSPS TxDAC® Digital-to- Analog Converter


Part Description:
Dual 14-Bit, 125 MSPS Dual TxDAC+ Digital-to-Analog Converter


Part Description:
16-Bit, 100 kSPS BiCMOS Analog-To-Digital Converter


PackageDescription:
SOIC, 1.27mm pitch; 20 pin, 7.50mm W X 12.80mm L X 2.65mm H body, IPC Medium Density


Part Description:
20mW Power, 2.3V to 5.5V, 75MHz Complete DDS


PackageDescription:
SOP, 0.65mm Pitch; 28 Pin, 5.30mm W X 10.20mm L X 2.00mm H Body, IPC Medium Density


PackageDescription:
QFP, 0.50mm pitch, Square; 100 pin, 14.00mm L X 14.00mm W X 1.20mm H body (w/thermal tab), IPC Medium Density

Part Description:
1 GSPS, 14-Bit, 3.3 V CMOS Direct Digital Synthesizer


PackageDescription:
QFN, 0.50mm Pitch, Square; 64 Pin, 9.00mm L X 9.00mm W X 1.00mm H Body (5.36mm X 5.36mm Thermal Tab), IPC Medium Density

Part Description:
1 GSPS Direct Digital Synthetizer with 14-Bit DAC


PackageDescription:
QFN, 0.50mm Pitch, Square 40 pin, 6.00mm L X 6.00mm W X 1.00mm H body (w/thermal tab 4.7mm x 4.7mm), IPC Medium Density

Part Description:
16-Bit, 1 MSPS, 8-Channel Data Acquisition System


PackageDescription:
QFP, 0.50mm Pitch, Square; 128 Pin, 20.00mm X 20.00mm (w/thermal Tab 5.1mm X 5.1mm), IPC Medium Density

Part Description:
Low Power, 8-Bit, Dual 1.0 GSPS or Single 2.0 GSPS Analog-to-Digital Converter


Part Description:
12-Bit, 50 kSPS to 200 kSPS, Differential Input, Micro Power Sampling Analog-to-Digital Converter


Part Description:
2 Channel, 200 ksps to 500 ksps 12-Bit Analog-to-Digital Converter


Part Description:
2 Channel, 500 ksps to 1 Msps 12-Bit Analog-to-Digital Converter


PackageDescription:
SOP, 0.65mm pitch; 16 pin, 4.40mm W X 5.00mm L X 1.20mm H body IPC Medium Density

Part Description:
8-Channel, 500-ksps to 1-Msps, 12-Bit Analog-to-Digital Converter


PackageDescription:
MINI-CIRCUITS CD542 Case, 2.54mm pitch; 6 pin, 5.59mm W X 7.87mm L

Part Description:
50 Ohms, 5 To 100MHz, 15.5dB Directional Coupler


PackageDescription:
SOP, 0.50mm Pitch; 10 pin, 3.00mm W X 3.00mm L X 1.09mm H body, IPC Medium Density

Part Description:
16-Bit, 50 to 250 kSPS, Differential Input, MicroPower ADC


PackageDescription:
QFN, 0.50mm pitch, square; 17 pin X 17 pin, 10.00mm X 10.00mm, IPC Medium Density

Part Description:
Dual Channel, 16-Bit, 160 MSPS Analog-to-Digital Converter with DDR LVDS Outputs


Part Description:
50 Ohms, 5 To 100MHz, Directional Coupler


PackageDescription:
QFN, 0.50mm pitch,square; 4 pin X 4 pin, 3mm X 3mm X 0.80mm H body (w/thermal tab 1.65 X 1.65mm),  IPC Medium Density

Part Description:
2.5V to 3.3V, 2 Outputs,  Ultrafast SiGe ECL Clock/Data Buffers


PackageDescription:
QFN, 0.50mm Pitch, Square; 4 Pin X 4 Pin, 3mm X 3mm X 0.80mm H Body (w/Thermal tab 1.60 X 1.60mm),  IPC Medium Density

Part Description:
2.5V/3.3V, Four LVPECL Outputs, SiGe Clock Fanout Buffer


PackageDescription:
QFN, 0.50mm Pitch, Square; 24 Pin, 4.00mm L X 4.00mm W X 0.80mm H Body (w/Thermal Tab 2.45 x 2.45mm), IPC Medium Density

Part Description:
3.3V, Six LVPECL Outputs, SiGe Clock Fanout Buffer


PackageDescription:
QFN, 0.50mm Pitch, Square; 8 Pin X 8 Pin, 5mm X 5mm X 1.00mm H body (w/thermal tab 2.85 X 2.85mm),  IPC Medium Density

Part Description:
Two Selectable Inputs, 8 LVPECL Outputs, SiGe Clock Fanout Buffer


PackageDescription:
QFN, 0.50mm Pitch, Square; 40 Pin, 6.00mm L X 6.00mm W X 1.00mm H Body (W/Thermal Tab 3.05mm X 3.05mm), IPC Medium Density

Part Description:
Two Selectable Inputs, 10 LVPECL Outputs, SiGe Clock Fanout Buffer


PackageDescription:
QFN, 0.50mm Pitch, Square; 40 Pin, 6.00mm L X 6.00mm W X 0.80mm H Body (w/Thermal Tab 3.05 x 3.05mm), IPC Medium Density

Part Description:
Two Selectable Inputs, 12 LVPECL Outputs, SiGe Clock Fanout Buffer


PackageDescription:
QFN, 0.50mm Pitch, Square; 20 pin, 4.00mm L X 4.00mm W X 1.00mm H body (w/thermal tab 2.25 X 2.25mm),  IPC Medium Density


Part Description:
6.2 GHz Fractional-N Frequency Synthesizer


PackageDescription:
QFN, 0.50mm Pitch, Square; 6 pin X 6 pin, 4mm X 4mm body (w/thermal tab 2.65 X 2.65 mm), IPC Medium Density

Part Description:
Direct Modulation/Waveform Generating, 6.1 GHz Fractional-N Frequency Synthesizer


Part Description:
Wideband Synthesizer with Integrated VCO


Part Description:
Low Capacitance, Low Charge Injection, ±15 V/+12 V, 4:1 iCMOS Multiplexer


Part Description:
Low Capacitance, Low Charge Injection, ±15V/+12V iCMOS iCMOS Quad SPST Switches (Normally Closed)


Part Description:
Low Capacitance, Low Charge Injection, ±15V/+12V iCMOS iCMOS Quad SPST Switches (Normally Open)


PackageDescription:
SON (DFN), 0.50mm pitch, 8 pin, 2mm X 3mm X 0.8mm H body (w/thermal tab 1.90 X 1.75mm),  IPC Medium Density

Part Description:
1 Ohm ON Resistance, ±15 V/+12 V/±5 V, iCMOS SPST Switches (Normaly Open)


Part Description:
1 Ohm ON Resistance, ±15 V/+12 V/±5 V, iCMOS SPST Switches (Normaly Close)


Part Description:
Dual 4-Channel ±15V/+12V/±5V iCMOS Multiplexer


PackageDescription:
SOP, 0.65mm Pitch; 24 Pin, 4.40mm W X 7.80mm L X 1.20mm H Body, IPC Medium Density

Part Description:
9.5 Ohm ON Resistance, ±15 V/+12 V/±5 V iCMOS,  Serially-Controlled Octal SPST Switches


Part Description:
2.1 Ohm On Resistance, ±15 V/+12 V/±5 V  iCMOS SPDT Switch


PackageDescription:
SON, 0.50mm Pitch; 10 Pin, 3.00mm W X 3.00mm L X 0.80mm H body (w/thermal tab 1.75 X 2.48 mm), IPC Medium Density

Part Description:
2.1 Ohms On Resistance iCMOS Dual SPST Switches (Normally Open)


Part Description:
2.1 Ohms On Resistance iCMOS Dual SPST Switches (Normally Closed)


Part Description:
Serially Controlled, ±15 V/+12 V/±5 V, 8-Channel iCMOS Multiplexer/Matrix Switches


Part Description:
Serially Controlled, ±15 V/+12 V/±5 V, 4-Channel iCMOS Multiplexer/Matrix Switches


Part Description:
1 Ohm Typical On Resistance, +3.3 V, ±5 V, +12 V Quad SPST Switches (Normally Closed)


Part Description:
LC2MOS ±15V Quad SPST Switches (Normally Open)


Part Description:
LC2MOS Quad SPST Switches (Normally Open)


Part Description:
LC2MOS ±15V Quad SPST Switches (Normally Close)


Part Description:
I2C CMOS 8×8 Unbuffered Analog Switch Array with Dual/Single Supplies


Part Description:
2.5 V/3.3 V, 8-Bit, 2-Port Level Translating, Bus Switch


Part Description:
2.5V/3.3V, 16-Bit, 2-Port Level Translating, Bus Switch


Part Description:
Low Voltage, 1.15V to 5.5V, Single-Channel Bidirectional Logic Level Translator


Part Description:
Low Voltage, 1.15V to 5.5V, 8-Channel Bidirectional Logic Level Translator


PackageDescription:
PLCC, 1.27mm pitch, square; 7 pin X 7 pin, 11.50mm L X 11.50mm W X 4.57mm H body, IPC Medium Density

Part Description:
LC2MOS 16-Channel High Performance Analog Multiplexer


Part Description:
LC2MOS ± 15 V,Dual 8 Channel, High Performance Analog Multiplexer


Part Description:
LC2MOS ± 15 V, Dual 8 Channel, High Performance Analog Multiplexer


Part Description:
Precision Quad SPST Switches (2 Normally Open + 2 Normally Close)


Part Description:
LC2MOS Precision Single SPDT Analog Switches


Part Description:
LC2MOS 5 Ohms RON SPST Switches (2 Normally closed + 2 Normally Open)


Part Description:
LC2MOS 5 Ohms RON Quad SPST Switches (Normally Open)


PackageDescription:
SOP, 0.65mm pitch; 8 pin,3.00mm W X 3.00mm L X 1.09mm H bodyI, PC Medium Density


Part Description:
High Voltage Latch-Up Proof, Dual SPDT Switches


Part Description:
High Voltage Latch-Up Proof, 4-Channel Multiplexer


Part Description:
High Voltage Latch-Up Proof, 8-Channel Multiplexer


Part Description:
High Voltage Latch-Up Proof, Dual 4-Channel Multiplexer


Part Description:
High Voltage Latch-Up Proof, Single SPDT Switch


Part Description:
2 ON Resistance, CMOS, ±5 V/+5 V Single SPST Switches  (Normally Open)


Part Description:
LC2MOS, 3V/5V, 4 Channel High Performance Analog Multiplexer


Part Description:
1pC Charge Injection, 100pA Leakage, CMOS, ±5V/+5V/+3V, Quad SPST Switches


Part Description:
1pC Charge Injection, 100pA Leakage, CMOS, ±5V/+5V/+3V Dual SPDT Switch


Part Description:
+3V/+5V/±5V CMOS 4-Channel Analog Multiplexer


Part Description:
CMOS, Low Voltage 2.5 Ohms, 4-Channel Analog Multiplexer


Part Description:
CMOS, 1.8V to 5.5V/±2.5V, 3 Ohm, 8-Channel Analog Multiplexer


Part Description:
Low Voltage Quad SPST Switches (2 Normally Closed + 2 Normally Open)


Part Description:
CMOS, Low Voltage SPI Serially Controlled, Octal SPST Switches


Part Description:
CMOS, Low Voltage I2C Serially Controlled, Octal SPST Switches


PackageDescription:
QFP, 0.50mm Pitch, Square, 48 Pin, 7.00mm L X 7.00mm W X 1.20mm H Body, IPC Medium Density

Part Description:
Dual 16-Channel, Serially Controlled 4 Ohms +1.8V to +5.5V,  ±2.5V Analog Multiplexer


Part Description:
Dual 16-Channel, 4 Ohms +1.8V to +5.5V,  ±2.5V Analog Multiplexer


Part Description:
32-Channel, Serially Controlled 4 Ohms +1.8V to +5.5V,  ±2.5V Analog Multiplexer


Part Description:
32-Channel, 4 Ohm +1.8V to +5.5V,  ±2.5V Analog Multiplexer


Part Description:
CMOS, 2.5 Ohms Low Voltage, Triple SPDT Switch


Part Description:
CMOS, 2.5 Ohms Low Voltage, Quad SPDT Switch


Part Description:
CMOS, Low Voltage, 3-Wire Serially-Controlled, 8-Channel Matrix Switches


PackageDescription:
SOP, 0.635mm pitch; 16 pin, 3.9mm W X 4.9mm L X 1.75mm H Body, IPC Medium Density

Part Description:
Low Voltage, 400 MHz, Quad 2:1 Mux with 3ns Switching Time


Part Description:
CMOS 3 V/5 V, Wide Bandwidth Quad 2:1 Multiplexer/Demultiplexers


Part Description:
CMOS 1.8 V to 5.5 V, 2.5 Ohm SPDT Switch


Part Description:
CMOS 1.8 V to 5.5 V, <0.4 Ohm SPST Switches (Normally Open)


Part Description:
CMOS 1.8 V to 5.5 V, <0.4 Ohm SPST Switches (Normally Closed)


PackageDescription:
QFN,0.50mm pitch,square;6 pin X 6 pin,4.0mm X 4.0mm X 1.00mm H body (w/thermal tab 2.65 X 2.65mm),  IPC Medium Density

Part Description:
400 MHz to 6 GHz Broadband Quadrature Modulator


Part Description:
DC to 6 GHz Envelope and TruPwr RMS Detector


PackageDescription:
QFN,0.50mm pitch,square; 4 pin X 4 pin, 3mm X 3mm X 1.00mm H body (w/thermal tab 1.65 X 1.65mm),  IPC Medium Density

Part Description:
1MHz to 4GHz, 80dB Logarithmic Detector/Controller


Part Description:
1MHz to 10GHz, 62dB Logarithmic Detector/Controller


Part Description:
DC to 6 GHz, 45 dB TruPwr Detector With Envelope Threshold Detection


Part Description:
0.8% Accurate Quad Voltage Monitor And Sequencer


PackageDescription:
SOIC, 1.27mm pitch; 16 pin, 7.50mm W X 10.4mm L X 2.65mm H body, IPC Medium Density

Part Description:
High Speed, ESD-Protected, Half-Duplex iCoupler Isolated RS-485 Transceiver


Part Description:
High Speed, ESD-Protected, Half-/Full-Duplex iCoupler Isolated RS-485 Transceiver


Part Description:
Isolated, Single-Channel RS-232 Line Driver/Receiver


Part Description:
3.3V, 250kbps, Full-Duplex RS-485/RS-422 Transceiver


Part Description:
3.3V, 10Mbps Full-Duplex RS-485/RS-422 Transceiver


PackageDescription:
SOT, 0.95mm pitch; 5 pin, 1.60mm W X 2.90mm L X 1.45mm H body, IPC Medium Density

Part Description:
4.63V Supervisory Circuits with Watchdog and Manual Reset


PackageDescription:
SC70-4, SOT, 0.65mm Pitch, 4 pin, 1.25mm W X 2.00mm L X 1.10mm H, IPC Medium Density

Part Description:
4.38V Supervisory Circuits with Manual Reset


Part Description:
3.08V Supervisory Circuits with Manual Reset


Part Description:
Continuous Rate 10 Mb/s to 675 Mb/s Clock And Data Recovery IC With Integrated Limiting Amplifier


PackageDescription:
QFN,0.50mm pitch,square;64 pin,9.00mm L X 9.00mm W X 1.00mm H body (6.15mm X 6.15mm thermal tab), IPC Medium Density

Part Description:
4.25Gbps, 8 × 8, Asynchronous Crosspoint Switch


PackageDescription:
BGA, 1.27mm Pitch, Square; 352 Pin, 26 Columns X 26 Rows, 35.00mm X 35.00mm X 1.70mm H

Part Description:
X-Stream 4.25 Gbps 40 × 40 Digital Crosspoint Switch


PackageDescription:
SOP, 0.65mm Pitch; 20 pin, 5.30mm W X 7.20mm L X 2.00mm H body, IPC Medium Density

Part Description:
3.75kV RMS, 600Mbps, Dual-Channel LVDS Isolators


PackageDescription:
SOIC, 1.27mm Pitch; 20 Pin, 7.50mm W X 12.80mm L X 2.65mm H Body, IPC Medium Density

Part Description:
5kV RMS, 600Mbps, Dual-Channel LVDS Isolators


Part Description:
Single, 3V, CMOS, LVDS, High Speed Differential Driver


Part Description:
Single, 3V, CMOS, LVDS, Differential Line Receiver


Part Description:
3V LVDS Quad CMOS Differential Line Receiver


PackageDescription:
MINI-CIRCUITS CD636 Case, 2.54mm pitch; 6 pin, 5.59mm W X 7.87mm L

Part Description:
2 Way-0°, 50 Ohms, 1 to 650MHz, Power Splitter/Combiner


Part Description:
2 Way-90°, 50 Ohms, 150 to 250MHz, Power Splitter/Combiner


PackageDescription:
QFN, 0.50mm Pitch, Square; 40 Pin, 6.00mm L X 6.00mm W X 0.80mm H body (w/Thermal Tab 4.55 x 4.55mm), IPC Medium Density

Part Description:
Wideband Quadrature Modulator with Integrated Fractional-N PLL and VCOs


PackageDescription:
QFN, 10-Leads, Body 1.5x2mm (max), Pitch 0.50mm, IPC Medium Density

Part Description:
Ultra-Small, Low-Power, 4 Channels 12-Bit Analog-to-Digital Converter with Internal Reference


Part Description:
Ultra-Small, Low-Power, 4 Channels 16-Bit Analog-to-Digital Converter with Internal Reference


Part Description:
Single Channel, 5V, 16kSPS, SPI, 24-Bit Analog-to Digital Converter


PackageDescription:
SOIC, 1.27mm Pitch; 18 Pin, 7.50mm W X 11.55mm L X 2.65mm H Body, IPC Medium Density


Part Description:
24-Bit Analog-to-Digital Converter for Temperature Sensors


Part Description:
24-Bit, 20kHz, Low-Power Analog-to-Digital Converter


PackageDescription:
SOP, 0.635mm Pitch; 20 Pin, 3.90mm W X 8.65mm L X 1.75mm H Body, IPC Medium Density

Part Description:
24-Bit, 20-kHz, Low Power Analog-to Digital Converter


Part Description:
24-Bit, Wide Bandwidth Analog-to-Digital Converter


PackageDescription:
QFP, 0.50mm Pitch, Square; 64 Pin, 10.0mm L X 10.0mm W X 1.20mm H body (W/Thermal Tab 7.00mm X 7.00mm), IPC Medium Density

Part Description:
Quad, Simultaneous Sampling, 24-Bit Analog-to-Digital Converters


Part Description:
Octal, Simultaneous Sampling, 24-Bit Analog-to-Digital Converters


Part Description:
High Resolution 24-Bit Analog-to Digital Converter


PackageDescription:
QFP, 0.50mm Pitch, Square; 80 Pin, 12.0mm L X 12.0mm W X 1.20mm H body, IPC Medium Density

Part Description:
Octal Channel 12-Bit, 80 MSPS High-SNR and Low-Power ADC


PackageDescription:
QFN, 0.50mm Pitch, Square; 64 Pin, 9.00mm L X 9.00mm W X 1.00mm H Body (7.35 X 7.35mm Thermal Tab), IPC Medium Density


Part Description:
Low-Power, 12-Bit, 1MHz, Single, Unipolar Input, Analog-To-Digital Converters With Serial Interface


Part Description:
Low-Power, 16-Bit, Sampling CMOS Analog-to-Digital Converter


PackageDescription:
QFP, 0.50mm Pitch, Square; 32 Pin, 5.00mm L X 5.00mm W X 1.20mm H Body, IPC Medium Density

Part Description:
12-Bit, 500kSPS, 8-Channel, Parallel Output ADC


PackageDescription:
QFN, 0.50mm Pitch, Square; 16 Pin, 3.00mm L X 3.00mm W X 0.80mm H Body (w/Thermal Tab 1.80 X 1.80mm),  IPC Medium Density

Part Description:
14-Bit, 2 MSPS, Dual-Channel, Differential/Single-Ended, Ultralow-Power Analog-to-Digital Converters


PackageDescription:
QFP, 0.50mm Pitch, Square, 48 Pin, 7.00mm L X 7.00mm W X 1.20mm H Body (W/Thermal Tab 4.80mm X 4.80mm), IPC Medium Density

Part Description:
12-Bit, 80MHz Sampling Analog-To-Digital Converter


Part Description:
16-Bit, High-Speed, 2.7V To 5.5V MicroPower Sampling, Analog-To-Digital Converter


Part Description:
18-Bit 1-MSPS Differential Input, Micropower Sampling Analog-to-Digital Converter


Part Description:
18-Bit, 1.25-MSPS, Differential Input, Micropower Sampling Analog-to-Digital Converter


Part Description:
16-Bit 40KSPS Analog-to-Digital Converter w/Internal Reference and Parallel/Serial Interface


PackageDescription:
SOIC 20, Pitch 1.27mm - Body 7.5x13mm, IPC Medium Density

Part Description:
16-Bit 250kHz CMOS Analog-to-Digital Converter with Serial Interface 2.5V Internal Reference


PackageDescription:
SOIC 16, Pitch 1.27mm - Body 7.5x10.3mm, IPC Medium Density

Part Description:
12-Bit, 40-kSPS, Low Power Sampling ADC with Internal Reference and Serial Interface


Part Description:
14-Bit, 600kSPS (PAR) or 450kSPS (SER), Eight-Channel, Simultaneous Sampling ADC


Part Description:
16-Bit, 630kSPS (PAR) or 450kSPS (SER), Six-Channel, Simultaneous Sampling ADC


Part Description:
16-Bit, 500-kSPS, 8-Channel, Simultaneous-Sampling ADC With Bipolar Inputs on a Single Supply


PackageDescription:
QFN, 0.50mm Pitch, Square; 24 Pin, 4.00mm L X 4.00mm W X 1.00mm H body(w/thermal tab 2.8 X 2.8mm), IPC Medium Density

Part Description:
12-Bit, 1MSPS, 4-Channel, Bipolar-Input, SAR Analog-to-Digital Converter with Software-Selectable Ranges


Part Description:
Temperature Sensor Hub and Fan Controller


PackageDescription:
QFP, 0.65mm Pitch, Square; 52 Pin, 10.0mm L X 10.0mm W X 2.45mm H body, IPC Medium Density

Part Description:
Precision Analog Microcontroller: 1.3MIPS 8052 MCU + 8kB Flash + 8-Ch 12-Bit ADC + Dual 12-Bit DAC


Part Description:
MicroConverter®, Small Package 12-Bit ADC with Embedded Flash MCU


Part Description:
Precision Analog Microcontroller: 1.3MIPS 8052 MCU + 62kB Flash + 8-Ch 12-Bit ADC + Dual 12-Bit DAC


Part Description:
Precision Analog Microcontroller: 1MIPS 8052 MCU + 62kB Flash + 16/24-Bit ADC + 12-Bit DAC


Part Description:
MicroConverter® Multichannel 5V 24-Bit ADCs with Embedded 32 Kb Flash and Single-Cycle MCU


Part Description:
Quad-Channel Digital Isolator (2/2 Channel Directionality)


Part Description:
3.0kV RMS/3.75kV RMS Quad Digital Isolator


PackageDescription:
SOIC,1.27mm Pitch;16 Pin,7.50mm W X 12.75mm L X 2.64mm H Body, IPC Medium Density

Part Description:
Robust 5.0 kVrms Six Channel Digital Isolator with Fail-Safe (Output State Low) & 3 Reverse Channels


Part Description:
Robust 5.0 kVrms Six Channel Digital Isolator with Fail-Safe (Output State High) & 3 Reverse Channels


Part Description:
Full/Low Speed 2.5 kV USB Digital Isolator


Part Description:
Isolated Precision Half-Bridge Driver, 4A Output


Part Description:
Triple-Channel Digital Isolators Enhanced System-Level ESD Reliability


Part Description:
Quad-Channel, Digital Isolators, Enhanced System-Level ESD Reliability


Part Description:
Quad-Channel, Digital Isolators, Enhanced System-Level ESD Reliability (Enhanced Product Version)


Part Description:
Quad-Channel, High Speed Digital Isolator


PackageDescription:
QFP, 0.50mm Pitch, Square; 64 Pin, 10.0mm L X 10.0mm W X 1.60mm H body (W/Thermal Tab 5.10mm X 5.10mm), IPC Medium Density


PackageDescription:
QFN, 0.50mm Pitch, Square; 40 Pin, 6.00mm L X 6.00mm W X 0.80mm H body (w/Thermal Tab 4.25 x 4.25mm), IPC Medium Density

Part Description:
Integrated, Multichannel ADC and DAC for Analog Monitoring & Control


PackageDescription:
SOT363, 0.65mm pitch; 6 pin, 1.25mm W X 2mm L, IPC Medium Density


PackageDescription:
SOP, 0.65mm Pitch; 28 pin, 5.30mm W X 10.20mm L X 2.00mm H body, IPC Medium Density

Part Description:
Single-Phase High-Performance Wide-Span, Energy Metering IC


PackageDescription:
INFINEON PG-SOT343-4, SOT343, 1.30mm Pitch; 4 Pin,1.25mm W X 2.00mm L X 1.10mm H body, IPC Medium Density


PackageDescription:
TEXAS Case Style RHL (S-PVQFN-N20), QFN, 0.50mm Pitch, Rectangular; 20 Pin, 4.50mm L X 3.50mm W X 1mm H body (w/thermal tab 3.05 X 2.05mm)

Part Description:
Li-Ion Charger with Dynamic Power-Path Management, Output regulated to 4.4V


Part Description:
Single Chip Switchmode Li-Ion and Li-Polymer Charge Management IC with Enhanced EMI Performance


PackageDescription:
SON, 0.50mm Pitch; 8 Pin, 2.00mm W X 2.00mm L X 0.80mm H body (w/thermal tab 1.0 X 1.7 mm), IPC Medium Density

Part Description:
Overvoltage Protection for 2-Series to 4-Series Cell Li-Ion Batteries with External Delay Capacitor


Part Description:
Smart Four Channel Highside Power Switch


PackageDescription:
QFN, 0.50mm Pitch, Rect.; 20 Pin, 2.50mm L X 4.50mm W X 1.00mm H Body (w/Thermal Tab 1.15 X 3.15mm),  IPC Medium Density

Part Description:
3.3V, 2 Differential Channel, 2 : 1 Multiplexer/Demultiplexer Switch


PackageDescription:
QFN, 0.50mm Pitch, Square; 40 pin, 6.00mm L X 6.00mm W X 1.00mm H body (W/Thermal Tab 4.60mm x 4.60mm), IPC Medium Density

Part Description:
2.4GHz Bluetooth Low Energy System-on-Chip Solution With 256 KB of Flash Memory


PackageDescription:
OCPP Open Cavity Plastic Package QFP, 0.50mm Pitch, Square; 100 Pin,14.00mm L X 14.00mm W X 2.00mm H Body, IPC Medium Density

Part Description:
Transimpedance Amplifier for VFE Upgrade CMS-ECAL


PackageDescription:
QFN, 0.50mm Pitch, Square; 24 Pin, 4.00mm L X 4.00mm W X 1.00mm H body (w/thermal tab 2.60 X 2.60mm),  IPC Medium Density

Part Description:
Unique 24-bit Chip Identifier Readable Via I2C, Pin Compatible With DCU2


PackageDescription:
QFN, 0.50mm Pitch, Square; 6 Pin X 6 Pin, 4mm X 4mm Body (w/Thermal tab 2.3 X 2.3 mm), IPC Medium Density


PackageDescription:
BGA, 0.80mm Pitch, Square; 196 Pin, 14 Columns X 14 Rows, 12.00mm X 12.00mm X 1.70mm H

Part Description:
The Slow Control Adapter ASIC for the GigaBit Transceiver ASIC (GBT)


PackageDescription:
BGA, 0.80mm Pitch, Square; 400 Pin, 20 Columns X 20 Rows, 17.00mm X 17.00mm X 3.56mm H


PackageDescription:
BGA, 1.50mm Pitch, Square; 225 Pin, 15 Columns X 15 Rows, 27.00mm X 27.00mm X 2.70mm H

Part Description:
High Performance Time to Digital Converter (HPTDC)


PackageDescription:
Ultra Fast Low Power Pre-Amplifier Discriminator

Part Description:
Ultra Fast Low Power Pre-Amplifier Discriminator


PackageDescription:
BGA, 0.50mm Pitch, Rectangular; 118 Pin, 10 Columns X 12 Rows, 5.00mm X 6.00mm X 0.52mm H

Part Description:
Multi Channel Readout ASIC for Analogue SiPMs Sensors


PackageDescription:
QFN, 0.50mm Pitch, Square; 28 Pin, 5.00mm L X 5.00mm W X 1.0mm H Body (w/thermal tab 3.8 X 3.8mm)

Part Description:
Quartz Crystal Based Phase-Locked Loop (QPLL) for Jitter Filtering Application in LHC


PackageDescription:
CQFJ (Ceramic Quad Flat J Lead), 1.27mm Pitch, Square; 44 Pin, 16.548mm L X 16.548mm W X 2.87mm H Body, IPC Medium Density

Part Description:
Four Channels Synchronous Charge to Frequency Converter (CFC) Current Digitiser or Recycling Integrator (CERN ASIC)


PackageDescription:
SON, 0.50mm Pitch; 16 Pin, 1.35mm W  X 3.3mm L X 0.55mm H body, (w/Thermal Tab 0.5 X 3 mm), IPC Medium Density

Part Description:
EMI Filter for T-Flash/MicroSD Interface


PackageDescription:
QFN, 0.50mm Pitch, Square; 28 pin, 5.00mm L X 5.00mm W X 1.00mm H body (w/thermal tab 3.35 X 3.35mm),  IPC Medium Density


PackageDescription:
QFN, 0.50mm Pitch, Square; 6 Pin X 6 Pin, 4mm X 4mm Body (w/Thermal Tab 2.80 X 2.80 mm), IPC Medium Density


PackageDescription:
QFN, (MO-220-VHHD-4) 0.50mm pitch,square; 8 pin X 8 pin, 5mm X 5mm X 1.00mm H body (w/thermal tab 3.8 X 3.8mm),  IPC Medium Density

Part Description:
8 Channel Differential Line Receiver (ASIC)


PackageDescription:
MINI-CIRCUITS DG1293 Case, 0.65mm Pitch, Square; 4 Pin X 4 Pin, 4mm X 4mm Body (w/Thermal Tab 2.34 X 2.34mm)

Part Description:
Absorptive SPDT RF Switch with Internal Driver, 50 Ohms, 500 to 6000MHz


PackageDescription:
QFN, 0.40mm Pitch, Square; 64 Pin, 8.00mm L X 8.00mm W X 1.00mm H body (W/Thermal Tab 5.20mm X 5.20mm), IPC Medium Density


PackageDescription:
Marki microwave EZ Style Doubler Outline, 15.24mm L X 8.13mm W X 4.3mm H Body

Part Description:
Frequency Doubler - Input 2.0 to 10.0 GHz, Output 4.0 to 20.0 GHz


PackageDescription:
SOP, 0.635mm pitch; 16 pin, 3.9mm W X 4.895mm L X 1.75mm H Body, IPC Medium Density

Part Description:
20-Bit Delta-Sigma Low Power Digital-To-Analog Converter


Part Description:
1.8V to 5.5V, 80uA, 8-Bit, Low-Power, Single-Channel, DAC


Part Description:
INL ±0.25 LSB, DNL ±0.25 LSB, 8-Bit, Octal-Channel, Ultra-Low Glitch, Voltage Output, Two-Wire Interface DAC


Part Description:
+2.7 V to +5.5 V, I2C Interface (Receive Only), Voltage Output, 12-Bit Digital-To-Analog Converter


Part Description:
Quad, 12-Bit, Low-Power, Voltage Output, I2C Interface Digital-To-Analog Converter


Part Description:
12-Bit, Octal-Channel, Ultra-Low Glitch, Voltage Output, Two-Wire Interface Digital-To-Analog Converters


Part Description:
Dual, 12-Bit Serial Input Digital-To-Analog Converter


Part Description:
Quad, Serial Input, 12-Bit, Voltage Output DAC


Part Description:
Quad, 12-Bit, High-Accuracy, ±16V Output, Serial Input Digital-to-Analog Converter


Part Description:
12-Bit, Serial Input, Multiplying Digital-to-Analog Converter


Part Description:
12-Bit, Parallel Input, Multiplying Digital-to-Analog Converter


Part Description:
1.8V to 5.5V, 80uA, 14-Bit, Low-Power, Single-Channel, DAC


Part Description:
2.0V to 5.5V, 80uA, 16-Bit, Low-Power, Single-Channel, Digital-to-Analog Converter


PackageDescription:
QFP, 0.50mm Pitch, Square;16 pin X 16 pin, 10.00mm X 10.00mm X 1.20mm H body, IPC Medium Density

Part Description:
Octal, 16-Bit, Low-Power, High-Voltage Output, Serial Input Digital-to-Analog Converter


Part Description:
Octal 8-Bit CMOS Digital-to-Analog Converter


PackageDescription:
SSOP 28, 0.65mm Pitch, Body 10.5mm L X 8.2mm W X 2mm H, IPC Medium Density

Part Description:
16-Bit, Parallel Input Multiplying Digital-to-Analog Converter


Part Description:
INL ±2 LSB, DNL ±1 LSB, 16-Bit, Ultra-Low Power, Voltage-Output DAC


Part Description:
INL ±1 LSB, DNL ±1 LSB, 16-Bit, Ultra-Low Power, Voltage-Output DAC


Part Description:
INL ±4 LSB, DNL ±1 LSB, 16-Bit, Ultra-Low Power, Voltage-Output DAC


Part Description:
16-Bit, Ultra-Low Power, Voltage-Output Digital-to-Analog Converter


PackageDescription:
TEXAS Case Style RGY(S-PVQFN-N14), QFN, 0.50mm Pitch, Square; 14 Pin, 3.5mm L X 3.5mm W X 1.00mm H body (w/thermal tab 2.15 X 2.15mm)


Part Description:
14-Bit, 165MSPS SpeedPlus(TM) DAC Scalable Current Outputs Between 2mA to 20mA


PackageDescription:
QFN,0.50mm pitch,square;6 pin X 6 pin,4.15mm X 4.15mm X 1.00mm H body (w/thermal tab 2.55 X 2.55mm), IPC Medium Density

Part Description:
18-Bit, Single-Channel, Low-Noise, Voltage-Output DAC


PackageDescription:
MINI-CIRCUITS DG983-2 Case, 0.50mm Pitch, Square; 5 Pin X 5 Pin, 4mm X 4mm Body (w/Thermal Tab 2.31 X 2.31mm)

Part Description:
Digital Step Attenuator, 50 Ohms, 0 to 31.5dB, 0.5dB Step, 6-Bit Serial Control Interface


PackageDescription:
MINI-CIRCUITS DG983-1 Case, 0.50mm Pitch, Square; 5 Pin X 5 Pin, 4mm X 4mm Body (w/Thermal Tab 2.21 X 2.21mm)

Part Description:
6 Bit, Parallel Control Interface, Dual Supply Voltage, 50 Ohms, DC-2400MHz, 31.5dB Digital Step (0.5dB) Attenuator


PackageDescription:
MINI-CIRCUITS Case Style AT1642 - Body 4.22X3.81mm

Part Description:
50Ohm, 50 to 2000MHz, 17dB Directional Coupler


Part Description:
Dual Current Input 20-Bit, Analog-To-Digital Converter


PackageDescription:
BGA, 0.80mm Pitch, Square; 100 Pin, 10 Columns X 10 Rows, 9.00mm X 9.00mm X 1.50mm H


PackageDescription:
IXYS DIRECT ENERGY INC (DEI) case DEIC420

Part Description:
20 Ampere Low-Side Ultrafast RF MOSFET Driver


Part Description:
16-Channel High-Performance CMOS Analog Multiplexer


Part Description:
8-Channel High-Performance CMOS Analog Multiplexers


Part Description:
Dual 4-Channel High-Performance CMOS Analog Multiplexer


Part Description:
Monolithic Quad SPST, CMOS Analog Switches  (Normally Open)


Part Description:
Improved, Quad,  SPST Analog Switches (Normally Open)


PackageDescription:
SOP, 0.65mm pitch; 16 pin, 4.40mm W X 5.00mm L X 1.10mm H body IPC Medium Density

Part Description:
Improved, Quad SPST Analog Switches (2 Normally Open + 2 Normally Close)


Part Description:
35 Ohm, SPST/SPDT, +3V Logic-Compatible Analog SPDT Switches


Part Description:
Improved Quad SPST Analog Switches (Normally Open)


Part Description:
0.5 pC Charge Injection, 100 pA Leakage, CMOS, ±5V/+5V/+3V Dual SPDT Switch


PackageDescription:
QFP, 0.50mm Pitch, Square; 48 Pin, 7.00mm L X 7.00mm W X 1.60mm H Body, IPC Medium Density

Part Description:
PHYTER™ QFP Single Port 10/100Mb/s Ethernet Physical Layer Transceiver


PackageDescription:
QFN, 0.50mm Pitch, Square; 48 Pin, 7.00mm L X 7.00mm W X 1mm H body (W/Thermal Tab 4.2mm X 4.2mm), IPC Medium Density

Part Description:
Robust, High Immunity, Small Form Factor 10/100/1000 Ethernet Physical Layer Transceiver


Part Description:
Robust, High Immunity 10/100/1000 Ethernet Physical Layer Transceiver


PackageDescription:
SOP, 0.50mm Pitch; 56 Pin,6.10mm W X 14.00mm L X 1.20mm H Body (w/Termal Tab  3.61 X 6.35mm), IPC Medium Density

Part Description:
Three-Phase Gate Driver With Dual Current Shunt Amplifiers and Buck Regulator


Part Description:
2.0A Unipolar Stepper Motor or 1A Quad Solenoid/Relay Driver (PWM Ctrl)


PackageDescription:
SOP, 0.65mm pitch; 16 pin, 4.40mm W X 5.00mm L X 1.20mm H body (w/thermal tab 2.46mm X 3.4mm), IPC Medium Density


PackageDescription:
QFN, 0.50mm Pitch, Square; 6 Pin X 6 Pin, 4mm X 4mm Body (w/Thermal Tab 2.70 X 2.70 mm), IPC Medium Density

Part Description:
Ultra Low Power 10.3 Gbps 1-Lane Repeater with Input Equalization and Output De-Emphasis


PackageDescription:
QFN, 0.50mm Pitch, Square; 48 Pin, 7.00mm L X 7.00mm W X 0.80mm H body (W/Thermal Tab 5.25mm X 5.25mm), IPC Medium Density

Part Description:
Low Power Quad Channel Repeater with 10.3125 Gbps Equalizer and De-Emphasis Driver


Part Description:
3.3V 5-Tap Economy Timing Element (500ns Delay Line)


Part Description:
8.5 to 11.3 Gbps Quad Channel Retimer with Adaptive EQ, CDR and DFE


Part Description:
8.5 to 11.3 Gbps Quad Channel Retimer with Adaptive EQ and CDR


Part Description:
1.8V, I2C, 32-Bit Binary Counter Watchdog RTC with Trickle Charger and Reset Input/Output


Part Description:
3.3V, I2C, 32-Bit Binary Counter Watchdog RTC with Trickle Charger and Reset Input/Output


PackageDescription:
TO-92 (TO-226),  Pitch 1.27mm, Flat Index, 3 In-Line, Axial Leads, Body Dia. 5.3mm, Leads Dia. 0.5mm (max)


PackageDescription:
BGA, 1.00mm pitch, square; 16 pin, 4 columns X 4 rows, 4.00mm X 4.00mm

Part Description:
Dual, Temperature-Controlled Resistors with Internally Calibrated Monitors and Password Protection


Part Description:
Quad High Speed Differential Line Driver


Part Description:
3V Enhanced CMOS Quad Differential Line Receiver


Part Description:
Differential CMOS Line Driver and Receiver Pair


Part Description:
Dual Low Voltage Differential Signaling (LVDS) Driver


Part Description:
Dual Low Voltage Differential Signaling (LVDS) Receiver


Part Description:
4-Channel LVDS Buffer/Repeater With Pre-Emphasis


PackageDescription:
SOT23 5, Pitch 0.95mm - Body 1.67x2.99mm, IPC Medium Density

Part Description:
3V LVDS Single High Speed Differential Driver


Part Description:
Automotive LVDS Dual Differential Driver


Part Description:
3V LVDS Quad CMOS Differential Line Driver


PackageDescription:
QFN, 0.50mm Pitch, Square; 32 Pin, 5.00mm L X 5.00mm W X 0.80mm H Body (W/Thermal Tab 3.20mm X 3.20mm),  IPC Medium Density


PackageDescription:
QFP, 0.50mm Pitch, Square; 64 Pin, 10.0mm L X 10.0mm W X 1.20mm H body, IPC Medium Density

Part Description:
20-50 MHz 32-Bit Channel Link II Serializer


Part Description:
20-50 MHz 32-Bit Channel Link II Deserializer


PackageDescription:
BGA,1.00mm pitch,square;196 pin,14 columns X 14 rows,15.00mm X 15.00mm X 1.47mm H


Part Description:
High Performance Pin Driver, PowerFet Drivers


Part Description:
High Speed, Dual Channel Power Non-Inverting MOSFET Drivers


PackageDescription:
QFN, 0.65mm Pitch, Square; 16 Pin, 4.00mm L X 4.00mm W X 0.95mm H Body (w/Thermal tab 2.15 X 2.15mm), IPC Medium Density


PackageDescription:
BGA, 0.80mm Pitch, Square; 400 Pin, 20 Columns X 20 Rows, 17.00mm X 17.00mm X 1.60mm H


PackageDescription:
SON, 0.50mm Pitch; 8 Pin, 2.00mm W X 2.00mm L X 1.00mm H body (w/thermal tab 0.85 X 1.65 mm), IPC Medium Density

Part Description:
High Reliability SPST Absorptive RF Switch with Kz


PackageDescription:
QFN, 0.65mm Pitch, Square; 16 Pin, 4mm X 4mm X 1mm H body (w/thermal tab 2.8 X 2.8mm),  IPC Medium Density

Part Description:
High Reliability SP2T Absorptive RF Switch


Part Description:
Single 9A High-Speed, Low-Side Gate Driver


PackageDescription:
Case FLSM1600, 40.64mm L X 8.13mm W X 2.794mm H Body

Part Description:
8.9-10.2GHz Microwave Surface Mount Band Pass Filter


PackageDescription:
Marki microwave Case FLSM1000, 25.4mm L X 8.13mm W X 2.794mm H Body

Part Description:
11.35-12.95GHz Microwave Surface Mount Band Pass Filter


PackageDescription:
SOP, 0.50mm Pitch; 8 pin, 2.30mm W X 2.00mm L X 0.90mm H body, PC Medium Density


Manufacturer:
FUTURE TECHNOLOGY DEVICES INTERNATIONAL (FTDI)


Part Description:
Dual High Speed USB to Multipurpose UART/FIFO IC


PackageDescription:
QFN, 0.50mm Pitch, Square;64 Pin,9.00mm L X 9.00mm W X 1.00mm H Body (4.45 X 4.45mm Thermal Tab), IPC Medium Density

Part Description:
Dual High Speed USB To Multipurpose UART/FIFO IC


PackageDescription:
QFP, 0.80mm Pitch, Square; 32 Pin, 7.00mm L X 7.00mm W X 1.60mm H Body, IPC Medium Density


PackageDescription:
QFN, 0.50mm Pitch, Square; 32 Pin, 5.00mm L X 5.00mm W X 1.00mm H body (w/Pullback Leads, Thermal Tab 3.3 X 3.3mm),  IPC Medium Density


PackageDescription:
QFN, 0.50mm Pitch, Square; 32 Pin, 5.00mm L X 5.00mm W X 1.00mm H body (w/Pullback Leads, Thermal Tab 3.65 X 3.65mm),  IPC Medium Density


Part Description:
Quad High Speed USB to Multipurpose UART/MPSSE IC


PackageDescription:
QFN, 0.50mm Pitch, Rect. 16 Pin, 2.50mm L X 3.50mm W X 0.80mm H Body (w/Thermal Tab 1.00 X 1.90mm),  IPC Medium Density

Part Description:
4-Bit Low-Voltage Dual-Supply Signal Translator with Configurable Voltage Supplies and Signal Levels and 3-STATE Outputs and Independent Direction Controls


PackageDescription:
PQFN, 16-Leads, Body 3x3mm, Pitch 0.50mm, IPC Medium Density

Part Description:
±2g/±4g/±8g, Low g, 14-Bit Digital Accelerometer


PackageDescription:
SON (DFN), 0.50mm Pitch; 6 Pin, 1.50mm W X 1.50mm L X 0.50mm H body (w/thermal tab 0.65 X 1.15mm),  IPC Medium Density


Part Description:
Broadband Linear Gain Block, 0.05 to 8.0 GHz


PackageDescription:
QFN, 0.50mm Pitch, Square; 4 pin X 4 pin, 3mm X 3mm X 0.85mm H body (w/thermal tab 1.5 X 1.5mm), IPC Medium Density

Part Description:
31.5dBm Power-LNA, Tunning Range:  0.1-3.8GHz


PackageDescription:
QFN, 0.40mm Pitch, Rect., Pin 1 on Short Dimension; 40 Pin, 4.00mm L X 6.00mm W X 1.00mm H Body (w/Thermal Tab 3.70 X 1.68 mm), IPC Medium Density


PackageDescription:
QFN, 0.65mm Pitch, Square; 16 Pin, 4.00mm L X 4.00mm W X 0.90mm H body (w/Thermal tab 2.86 X 2.86mm), IPC Medium Density


PackageDescription:
SOP, 24-Leads, Body 7.9x4.5mm (max), Pitch 0.65mm, IPC Medium Density

Part Description:
10-Bit Bidirectional Low Voltage Translator


PackageDescription:
MACOM Case Style FP-3 - Body W 15.9 x L 15.9 H 3.8mm


Part Description:
0.1 MHz to 500 MHz Clock Generator with Integer N PLL


PackageDescription:
SOP, 8-Leads, Body 3x3mm (max), Pitch 0.65mm, IPC Medium Density


PackageDescription:
QFN, 0.50mm Pitch, Square; 24 Pin, 4.00mm L X 4.00mm W X 0.80mm H Body (w/thermal Tab 2.95 X 2.95 mm), IPC Medium Density

Part Description:
DC to 12GHz GaAs MMIC SPDT Non-Reflective Switch


PackageDescription:
QFN, 0.50mm Pitch, Square; 12 Pin, 3mm X 3mm X 0.92mm H Body (With Pullback Leads,Thermal Tab 1.65 X 1.65mm), IPC Medium Density

Part Description:
GaAs MMIC Fundamental Mixer, 14 to 26GHz


PackageDescription:
SOP, 0.635mm, Pitch; 16 Pin, 3.90mm W X 4.90mm L X 1.75mm H Body (w/thermal Tab 1.8mm X 2.4 mm), IPC Medium Density

Part Description:
DC to 4GHz, 1dB LSB GaAs MMIC 5-bit Digital Attenuator


PackageDescription:
QFN, 0.65mm pitch,square; 4 pin X 4 pin, 4mm X 4mm X 1mm H body (w/thermal tab 2.55 X 2.55mm),  IPC Medium Density

Part Description:
DC-4GHz High Isolation SPDT Non-Reflective Switch


PackageDescription:
SOIC 8, Pitch 1.27mm - Body 3.9x4.9mm, (w/thermal tab 2.41mm X 2.79mm), IPC Medium Density

Part Description:
SMT GaAs HBT MMIC Divide-by-8, DC to 12GHz


PackageDescription:
SOP, 0.635mm, Pitch; 16 Pin,3.90mm W X 4.90mm L X 1.75mm H Body (w/thermal Tab 1.8mm X 2.4 mm), IPC Medium Density

Part Description:
Digital Phase-Frequency Detector SMT, 0.01 to 1.3GHz


Part Description:
2.8GHz Integer-N Synthesizer (N = 2 - 32)


PackageDescription:
QFN, 0.50mm Pitch, Square; 24 Pin, 4.00mm L X 4.00mm W X 1.00mm H Body (w/thermal Tab 2.95 X 2.95mm), IPC Medium Density

Part Description:
0.5 dB LSB GaAs MMIC 6-Bit Digital Positive Control Attenuator, DC To 3.8 GHz


PackageDescription:
0.50mm Pitch, Square; 8 Pin X 8 Pin, 5mm X 5mm X 1.00mm H Body (w/thermal Tab 3.95 X 3.95mm), IPC Medium Density

Part Description:
MMIC VCO With Half Frequency Output & Divider-by-4, 10.43 to 11.46GHz


Part Description:
MMIC VCO With Half Frequency Output & Divider-by-4, 9.5 to 10.8GHz


PackageDescription:
QFN, 0.50mm Pitch, Square; 4 Pin X 4 Pin, 3mm X 3mm X 1.00mm H Body (w/thermal Tab 1.95 X 1.95mm), IPC Medium Density

Part Description:
0.25dB LSB GaAs MMIC 5-BIT Digital Positive Control Attenuator, DC - 4 GHz


Part Description:
0.5dB LSB GaAs MMIC 6-bit Digital Serial Control Attenuator, DC to 4GHz


Part Description:
60dB, Logarithmic Detector/ Controller, 1 to 10GHz


PackageDescription:
QFN, 0.50mm Pitch, Square; 24 Pin,4.00mm L X 4.00mm W X 1.00mm H Body (w/thermal Tab 2.95 X 2.95mm), IPC Medium Density

Part Description:
GaAs MMIC SP4T Non-Reflective Switch, DC to 20GHz


Part Description:
7 GHz Integer N Synthesizer (N = 12 - 259)


PackageDescription:
QFN, 0.50mm Pitch, Square; 48 Pin, 7.00mm L X 7.00mm W X 1.00mm H Body (w/thermal Tab 5.65mm X 5.65mm), IPC Medium Density

Part Description:
High Performance, 3.2GHz, 14-Output Fanout Buffer


PackageDescription:
QFP, 0.50mm Pitch, Square; 17 pin X 17 Pin, 10.00mm X 10.00mm (W/Thermal Tab 6.4mm X 6.4mm), IPC Medium Density

Part Description:
High Performance, 3.2 GHz, 14-Output Jitter Attenuator with JESD204B


Part Description:
MMIC VCO With Half Frequency Output & Divider-by-16, 20.9 to 23.9GHz


PackageDescription:
SOP, 8-Leads, Body 3x3mm (max), Pitch 0.65mm, (w/thermal Tab 2 .41 X 1.78 mm), IPC Medium Density


Part Description:
0.25dB LSB GaAs MMIC 6-bit Digital Attenuator


PackageDescription:
QFN, 0.50mm Pitch, Square; 40 Pin, 4.00mm L X 4.00mm W X 1.00mm H Body (w/thermal Tab 2.95 X 2.95mm), IPC Medium Density

Part Description:
Fractional-N PLL With Integrated VCO, 25 to 3000MHz


Part Description:
Fractional-N PLL With Integrated VCO, 25 to 6000MHz


Part Description:
High Isolation SPDT Non-Reflective Switch SMT, DC - 6 GHz


PackageDescription:
Side-Brazed Ceramic Dual In-Line Package (SBDIP) 16 Leads, Row Spacing 7.62 mm; Pitch 2.54 mm

Part Description:
Radiation Hardened High Speed, Quad SPST CMOS Analog  Switch


Part Description:
Absorptive SPDT RF Switch with Internal Driver, 50 Ohms, DC-3000MHz


Part Description:
One Microamp Supply-Current, +3V to +5.5V, 250kbps, RS-232 Transmitter/Receiver


Part Description:
Dual 2:1 and 1:2 Differential-to-LVDS Multiplexer


PackageDescription:
SOP, 0.635mm Pitch; 24 Pin, 3.90mm W X 8.65mm L X 1.75mm H Body, IPC Medium Density

Part Description:
High-Speed CMOS 10-Bit Bus Switch With Flow-Through Pinout (QUICKSWITCH® Product)


Part Description:
QuickSwitch 2.5V / 3.3V Quad Active Low, High Bandwidth Bus Switch


Part Description:
2500VRMS Isolation, 150Mbps, 5V/3.3V, High Speed Digital Isolators


Part Description:
Current Shunt Monitor -16V to +80V Common-Mode Range


Part Description:
High-Side Measurement Current-Shunt Monitor With Open-Drain Comparator and Reference, Gain 20


Part Description:
Zero-Drift, Bi-Directional CURRENT/POWER MONITOR with I2C™ Interface


Part Description:
High-or Low Side Measurement, Bi-Directional Current/Power Monitor with I2C Interface


Part Description:
Voltage Output, Unidirectional Measurement Current-Shunt Monitor


PackageDescription:
QFN, 0.65mm Pitch, Square; 4 pin X 4 pin, 4mm X 4mm X 1mm H body (w/thermal Tab 2.25 X 2.25mm), IPC Medium Density

Part Description:
Triple-Channel, High-Side Measurement, Shunt and Bus Voltage Monitor With I2C and SMBUS-Compatible Interface


PackageDescription:
International Rectifier SIP-3 Package Outline

Part Description:
30A, 600V, Integrated Power Hybrid IC for High Voltage Motor Applications, iMOTION Series


Part Description:
Single 50k, 128-taps Low Voltage Digitally Controlled Potentiometer (XDCP)


PackageDescription:
INTERSIL Case Style L72.10x10E, QFN, 0.50mm Pitch, Square; 72 Pin, 10.00mm L X 10.00mm W X 1.00mm H body (w/ Thermal Tab 7.15 X 6mm)


PackageDescription:
SOIC, Pitch 1.27mm; 12 Pin of 28, 7.50mm W X 17.90mm L X 2.65mm H body, IPC Medium Density

Part Description:
Dual, Isolated, Bi-Directional Digital Coupler


PackageDescription:
SOIC 16, Pitch 1.27mm, Body 7.5x10.3mm, IPC Medium Density


PackageDescription:
SOIC 8, Pitch 1.27mm, Body 4x5mm, IPC Medium Density


Part Description:
Quad Channel (Two Channels in Each Direction), 150Mbps, Digital Isolator


Part Description:
High-Performance, 8000VPK Reinforced Triple Digital Isolator


Part Description:
High-Performance, 8000VPK Reinforced Quad-Channel Digital Isolator


Part Description:
In-System Programmable Power Supply Supervisor, Reset Generator and Sequencing Controller


PackageDescription:
SOT223, 2.30mm pitch; 3 pin, 3.70mm W X 6.70mm L, IPC Medium Density

Part Description:
0.2A Smart High-Side Power Switch for Industrial Applications One channel: 1 x 1 Ohm


PackageDescription:
MINI-CIRCUITS BH292 Case, 2.54mm Pitch, Body 8.64X7.49mm

Part Description:
50 Ohms, 5 To 400MHz, Directional Coupler


PackageDescription:
MINI-CIRCUITS MT1818 Case, Body 2.06mm L X 2.06mm W X 0.61mm H

Part Description:
SPDT RF Switch, 50 Ohms, 5 to 6000MHz, High Power 3W


PackageDescription:
MINI-CIRCUITS HV1195 Case, 1.27mm pitch; 8 pin, 4.57mm W X 5.08mm L

Part Description:
50 Ohms, 10 to 20GHz Frequency Multiplier


Part Description:
3.3V Single Power Supply 10/100BASE-TX/FX MII Physical Layer Transceiver


PackageDescription:
QFN, 0.40mm Pitch, Square; 64 Pin, 8.00mm L X 8.00mm W X 0.90mm H body (W/Thermal Tab 4.30mm X 4.30mm), IPC Medium Density

Part Description:
Integrated 4-Port 10/100 Managed Ethernet Switch with Gigabit RGMII/MII/RMII Interface


PackageDescription:
QFN, 0.40mm Pitch, Square; 64 Pin, 8.00mm L X 8.00mm W X 0.90mm H body (W/Thermal Tab 6.55mm X 6.55mm), IPC Medium Density

Part Description:
Gigabit Ethernet Transceiver With GMII / MII Support


PackageDescription:
QFN, 0.50mm Pitch, Square; 48 Pin, 7.00mm L X 7.00mm W X 0.90mm H Body (W/Thermal Tab 3.55mm X 3.55mm), IPC Medium Density

Part Description:
Gigabit Ethernet Transceiver With RGMII Support


PackageDescription:
ST Microelectronic  15 Leads MULTIWATT Vertical Case


PackageDescription:
SOIC 20, Pitch 1.27mm - Body 11x15.90mm (w/thermal tab 16x6.2mm), IPC Medium Density


PackageDescription:
QFN, 0.50mm Pitch,square; 8 pin X 8 pin, 5mm X 5mm X 1.00mm H body (w/thermal tab 3.40 X 3.40mm),  IPC Medium Density

Part Description:
Small Footprint MII/RMII 10/100 Ethernet Transceiver with HP Auto-MDIX and flexPWR® Technology


Part Description:
Small Footprint RMII 10/100 Ethernet Transceiver with HP Auto-MDIX


PackageDescription:
QFN, 0.50mm Pitch, Square; 56 Pin, 8.00mm L X 8.00mm W X 1.00mm H body (6.05mm X 6.05mm Thermal tab), IPC Medium Density

Part Description:
High-Performance 16-bit Non-PCI 10/100 Ethernet Controller with Variable Voltage I/O


PackageDescription:
QFN, 0.50mm Pitch, Square; 64 Pin, 9.00mm L X 9.00mm W X 1.00mm H Body (7.40 X 7.40mm Thermal Tab), IPC Medium Density

Part Description:
USB 2.0 Hub and 10/100 Ethernet Controller


Part Description:
Simple Power Sequencer, Power UP : 1 2 3, Power Down 3 2 1, Timing Designator 60ms


Part Description:
Simple Power Sequencer, Power UP : 1 2 3, Power Down 3 2 1, Timing Designator 2ms


Part Description:
Dual 40W Audio Power Amplifier with Mute


Part Description:
Half-Bridge Gate Driver With Programmable Dead-Time


PackageDescription:
SOP, 8-Leads, Body 3x3mm (max), Pitch 0.65mm, (w/thermal tab 2 .00 X 1.85 mm), IPC Medium Density


PackageDescription:
SOP, 0.65mm Pitch; 20 Pin, 4.40mm W X 6.50mm L X 1.20mm H body (w/thermal tab 2.74mm X 3.86mm  ), IPC Medium Density


Part Description:
Serial Interface System Hardware Monitor With Remote Diode Temperature Sensing


PackageDescription:
QFN, 0.50mm Pitch, Square; 32 Pin, 5.00mm L X 5.00mm W X 0.80mm H Body (W/Thermal Tab 3.20mm X 3.20mm), IPC Medium Density

Part Description:
Ultra-Low Jitter LVCMOS Fanout Buffer/Level Translator With Universal Input


Part Description:
Low Skew, 1-to-4 Multiplexed Differential/LVCMOS-to-LVCMOS/TTL Fanout Buffer


PackageDescription:
SON, 0.50mm Pitch; 14 Pin 4.00mm W X 4.00mm L X 0.080mm H body (w/thermal tab 2.7 X 3.1 mm), IPC Medium Density

Part Description:
Configurable AFE Potentiostat For Low-Power Chemical Sensing Applications


Part Description:
Configurable AFE For Low-Power Chemical-Sensing Applications


PackageDescription:
QFN, 0.50mm Pitch, Square; 36 Pin, 6.00mm L X 6.00mm W X 0.90mm H Body (w/thermal tab 4.7mm x 4.7mm), IPC Medium Density

Part Description:
Ultra-Low Noise PLLatinum Frequency Synthesizer with Integrated VCO


Part Description:
10MHz - 19GHz Wideband RF Synthesizer with Phase Synchronization and JESD204B Support


PackageDescription:
MINI-CIRCUITS QQQ569 Case, 2.54mm pitch; 6 pin, 9.91mm W X 7.87mm L

Part Description:
2 Way-0°, 50 Ohms, 10 to 1000MHz Power Splitter/Combiner


Part Description:
2 Channel Bidirectional Multi-Voltage Level Translator for Open-Drain and Push-Pull Application


Part Description:
8 Channel Bidirectional Multi-Voltage Level Translator for Open-Drain and Push-Pull Application


PackageDescription:
SOP, 0.65mm Pitch; 20 Pin, 4.40mm W X 6.50mm L X 1.10mm H body (w/thermal tab 3mm X 4.2mm  ), IPC Medium Density


PackageDescription:
SOP, 0.50mm, Pitch; 10 pin, 3.00mm W X 3.00mm L X 1.10mm H body (w/thermal tab  1.68 X 1.98 mm), IPC Medium Density

Part Description:
Boost, Flyback, SEPIC And Inverting Controller


Part Description:
15V Input to -18V to -2V 50mA Output, Voltage Converter with Shutdown


Part Description:
Single-Ended 8-Channel Analog Multiplexer with SMBus Interface


PackageDescription:
SOP, 0.50mm, Pitch; 10 Pin, 3.00mm W X 3.00mm L X 1.10mm H Body (w/Thermal Tab  1.93 X 2.16 mm), IPC Medium Density

Part Description:
Serial 12-Bit, 3Msps Simultaneous Sampling ADC with Shutdown


Part Description:
12-Bit, 800ksps Sampling ADC With Shutdown


Part Description:
Low Power 14-Bit, 400ksps Sampling ADC Converter with Serial I/O


Part Description:
16-Bit, 200ksps, Serial ADC With Multiple Input Ranges


Part Description:
16-Bit, 50Msps Differential Current Output DAC


Part Description:
Micropower Precision (3.3V, 2.5V and Adjustable) Triple Supply Monitors In 5-Lead SOT-23 Packages


PackageDescription:
SOP, 0.65mm pitch; 8 pin,3.00mm W X 3.00mm L X 1.10mm H body, IPC Medium Density

Part Description:
uPower, 3V, 16-Bit, 150ksps Single Channel ADC


PackageDescription:
BGA, 0.80mm Pitch, Rect.; 170 Pin, 10 Columns X 17 Rows, 9.00mm X 15.00mm X 1.69mm H, LTC DWG # 05-08-1890


PackageDescription:
QFN, 0.50mm Pitch, Rect.; 12 pin X 14 Pin, 7.00mm L X 8.00mm W X 0.80mm H body (W/Thermal Tab 6.55mm X 5.50mm), IPC Medium Density


PackageDescription:
QFN, 0.50mm Pitch, Square; 64 Pin, 9.00mm L X 9.00mm W X 0.80mm H body (7.25mm X 7.25mm Thermal Tab), IPC Medium Density


Part Description:
16-Bit, 1.5Msps/Ch, Octal Simultaneous Sampling ADC


Part Description:
18-Bit, 1Msps 8-Channel Differential ±10.24V Input SoftSpan ADC with Wide Input Common Mode Range


PackageDescription:
SOT, 0.65mm pitch; 8 pin, 1.625mm W X 2.90mm L X 1.00mm H body, IPC Medium Density


PackageDescription:
SOP, 0.50mm Pitch; 16 Pin, 3.00mm W X 4.039mm L X 1.10mm H Body, IPC Medium Density

Part Description:
20-Bit, 1Msps, Low Power SAR ADC with 0.5ppm INL


Part Description:
24-Bit, 1.5Msps/2Msps, Low Power SAR ADC with Integrated Digital Filter


PackageDescription:
SOP, 0.635mm pitch, 28 pin,3.99mm W X 10.00mm L X 1.75mm H body

Part Description:
16-Channel 24-Bit No Latency Delta Sigma ADC


Part Description:
24-Bit High Speed Differential Delta Sigma ADC with Selectable Speed/Resolution


PackageDescription:
SON, 0.50mm Pitch; 6 Pin,2.00mm W X 2.00mm L X 0.80mm H body (w/thermal tab 0.61 X 1.42 mm),  IPC Medium Density

Part Description:
Easy-to-Use, Ultra-Tiny 16-Bit Delta/Sigma ADC


PackageDescription:
SON, 0.50mm Pitch; 24 pin, 4.00mm W X 7.00mm L X 0.80mm H body (w/thermal tab 2.74 X 6.53 mm), IPC Medium Density

Part Description:
32-Bit Oversampling ADC with Configurable Digital Filter


PackageDescription:
QFN,0.50mm pitch,square; 4 pin X 4 pin, 3mm X 3mm X 0.80mm H body (w/thermal tab 1.55 X 1.55mm),  IPC Medium Density

Part Description:
Quad 8-Bit I2C VOUT DACs With 10ppm/°C Reference


Part Description:
Octal 8-Bit I2C VOUT DACs With 10ppm/°C Reference


Part Description:
16-Channel 16-Bit ±10V VOUT SoftSpan DAC with 10ppm/°C Max Reference


Part Description:
18-Bit SoftSpan IOUT DAC with Parallel I/O


PackageDescription:
QFN, 0.50mm pitch, Rectangular, 5 pin X 7 pin, 4mm X 5mm body (w/thermal tab 2.75 X 3.75 mm), IPC Medium Density

Part Description:
Single-Bus RS485/RS232 Multiprotocol Transceiver with Switchable Termination


Part Description:
Precision Triple/Dual Input UV, OV and Negative Voltage Monitor


PackageDescription:
SOP, 0.635mm Pitch; 16 pin, 3.9mm W X 4.9mm L X 1.75mm H Body, IPC Medium Density

Part Description:
Quad Under-Voltage/Over-Voltage Positive/Negative Voltage Monitor


Part Description:
Voltage Supervisor with 27 Selectable Thresholds and Watchdog Timer


Part Description:
Configurable 4- and 6-Supply Monitors with Watchdog Timer


PackageDescription:
SON, (DFN) 0.50mm Pitch; 8 pin,3.00mm W X 3.00mm L X 0.80mm H body (w/thermal tab 1.75 X 2.48 mm), IPC Medium Density

Part Description:
Multicell Battery Gas Gauge with Temperature, Voltage and Current Measurement


Part Description:
Dual I2C Power Supply Monitor and Margining Controller


Part Description:
4-Channel PMBus Power System Manager Featuring Accurate Input Current and Energy Measurement


Part Description:
8-Channel PMBus Power System Manager Featuring Accurate Output Voltage Measurement


Part Description:
Multi-Sensor High Accuracy Digital Temperature Measurement System With EEPROM


Part Description:
Quad I2C Voltage, Current and Temperature Monitor


Part Description:
60V, 250mA Linear Charger with Low Quiescent Current


PackageDescription:
SOP, 12-Leads, Body 4.14x3.1mm (max), Pitch 0.65mm, IPC Medium Density


PackageDescription:
SON, 0.50mm Pitch; 16 Pin, 3.00mm W X 5.00mm L X 0.80mm H Body (w/thermal tab 1.75 X4.5mm), IPC Medium Density


Part Description:
Low Voltage Ideal Diode Controller with Monitoring


Part Description:
Negative Voltage Diode-OR Controller and Monitor


Part Description:
Ideal Diode Controller with Reverse Input Protection


Part Description:
Overvoltage, Undervoltage and Reverse Supply Protection Controller


PackageDescription:
SOT23, 0.95mm pitch; 5 pin, 1.625mm W X 2.9mm L, IPC Medium Density


PackageDescription:
SOT23, 0.95mm pitch; 6 pin, 1.625mm W X 2.90mm L X 1.00mm H body, IPC Medium Density

Part Description:
36V, Low Loss PowerPath Controller in ThinSOT


Part Description:
Dual 2.6A, 2.5V to 5.5V,  Ideal Diodes in 3mm×3mm DFN


Part Description:
Precision 300MHz to 7GHz RF Detector with Gain and Offset Adjustment


PackageDescription:
QFN,0.50mm pitch,square; 4 pin X 4 pin, 3mm X 3mm X 0.80mm H Body (w/thermal tab 1.55 X 1.55mm),  IPC Medium Density

Part Description:
UltraFast 7ns Response Time 15GHz RF Power Detector with Comparator


PackageDescription:
QFN, 0.50mm Pitch, Rect.; 48 Pin, 9.00mm L X 5.00mm W X 0.80mm H Body (w/Thermal Tab 3.73 X 7.72mm)

Part Description:
1.4GHz Low Phase Noise, Low Jitter PLL with Clock Distribution


PackageDescription:
QFN,0.50mm pitch,square; 6 pin X 12 pin, 4mm X 7mm X 0.80mm H Body (w/thermal tab 2.7 X 5.7mm),  IPC Medium Density

Part Description:
Low Phase Noise, Triple Output Clock Distribution Divider/Driver


PackageDescription:
SON, 0.45mm Pitch; 12 Pin, 3.00mm W X 3.00mm L X 0.80mm H Body (w/Thermal tab 1.75 x 2.48mm), IPC Medium Density

Part Description:
Low Phase Noise, Dual Output Buffer/Driver/Logic Converter, LVPECL Logic Outputs


Part Description:
Low Phase Noise, Dual Output Buffer/Driver/Logic Converter, LVDS Logic Outputs


Part Description:
Low Phase Noise, Dual Output Buffer/Driver/Logic Converter, CMOS Logic, In-Phase Outputs


PackageDescription:
BGA, 1.27mm Pitch, Rect.;32 Pin,8 Columns X 11 Rows, 11.25mm X 15.00mm X 3.62mm H

Part Description:
Complete Isolated RS485/RS422 uModule Transceiver + Power


PackageDescription:
Marki microwave EZ Style Mixer Outline, 15.24mm L X 8.13mm W X 4.3mm H Body

Part Description:
Double-Balanced Frequency Mixer - LO/RF 6.0 to 16.0GHz, IF DC to 4.0GHz


PackageDescription:
QFN, 0.50mm Pitch, Square; 24 Pin, 4.00mm L X 4.00mm W X 1.00mm H body (w/Thermal Tab 2.55 X 2.55mm), IPC Medium Density

Part Description:
Digital Attenuator, 6-Bit, Serial/Parallel Control, 31.5dB, 0.7-6.0GHz


PackageDescription:
QFN, 0.50mm Pitch, Square; 32 Pin, 6.00mm L X 4.00mm W X 1.00mm H body (w/Thermal Tab 4.8 X 2.8mm), IPC Medium Density

Part Description:
Digital Attenuator, 50-dB, 6-Bit, TTL Driver, DC - 2.4 GHz


PackageDescription:
SON, 0.40mm Pitch, 6 Pins, 1.50mm W  X 1.20mm L X 0.80mm Height, (w/Thermal Tab 0.57 X 0.95 mm), IPC Medium Density

Part Description:
Temperature Compensated Directional RMS Power Detector, 2-6 GHz


PackageDescription:
MACOM Case Style SM-87 - Body W 6.35 x L 8.20 H 4.85mm

Part Description:
5 to 2500 MHz E-Series Surface Mount Mixer


PackageDescription:
QFN, 0.50mm Pitch, Square; 12 Pin, 3.00mm L X 3.00mm W X 1.00mm H Body (w/Thermal Tab 1.25 X 1.25mm), IPC Medium Density

Part Description:
High Power GaAs DPDT Diversity Switch DC-4.0 GHz


PackageDescription:
SOP, 0.50mm Pitch; 38 Pin, 4.40mm W X 9.70mm L X 1.10mm H Body, IPC Medium Density

Part Description:
24-Bit, 4-Channel, Simultaneous-Sampling, Cascadable, Sigma-Delta ADC


PackageDescription:
QFN, 0.50mm Pitch, Square; 56 pin, 8.00mm L X 8.00mm W X 0.80mm H Body (W/Thermal Tab 6.70mm X 6.70mm), IPC Medium Density


PackageDescription:
QFP, 0.50mm Pitch, Square; 64 Pin, 10.0mm L X 10.0mm W X 1.20mm H body (W/Thermal Tab 7.70mm X 7.70mm), IPC Medium Density


Part Description:
16-Bit, +5V, 200ksps ADC with 10uA Shutdown


PackageDescription:
QFN, 0.50mm Pitch, Square; 28 Pin, 5.00mm L X 5.00mm W X 0.80mm H Body (W/Thermal Tab 3.35mm X 3.35mm), IPC Medium Density

Part Description:
500ksps, Low-Power, Serial 12-Bit, 4-Channel ADC


Part Description:
500ksps, Low-Power, Serial 12-Bit, 8-Channel ADC


Part Description:
500ksps, Low-Power, Serial 10-Bit, 4-Channel ADC


Part Description:
500ksps, Low-Power, Serial 10-Bit, 8-Channel ADC


PackageDescription:
SON, 0.50mm Pitch; 12 Pin, 3.00mm W  X 3.00mm L X 0.80mm H body, (w/Thermal Tab 1.8 X 2.6 mm), IPC Medium Density

Part Description:
16-Bit, 500ksps/250ksps, ±5V SAR ADCs with Internal Reference


Part Description:
2.7V to 3.6V Low-Power, 4-Channel, I2C, 10-Bit ADCs in Ultra-Small Package


PackageDescription:
QFN, 0.50mm Pitch, Square; 20 Pin, 4.00mm L X 4.00mm W X 0.80mm H Body (W/Thermal Tab 2.80mm X 2.80mm), IPC Medium Density

Part Description:
20-Bit, 1.6Msps, Low-Power, Fully Differential SAR ADC


Part Description:
2.7V to 3.6V, Low-Power, 12 Input Channels, 2-Wire Serial, 12-Bit ADCs


PackageDescription:
QFN, 0.65mm Pitch, Square; 16 Pin, 4.00mm L X 4.00mm W X 0.80mm H Body (W/Thermal Tab 2.25mm X 2.25mm), IPC Medium Density


PackageDescription:
SON, 0.40mm Pitch; 14 Pin, 3.00mm W X 3.00mm L X 0.80mm H Body (w/Thermal Tab1.8mm x 2.4mm)

Part Description:
16Mbps Full Duplex RS-485 Transceivers with Low-Voltage Logic Interface


Part Description:
+2.7V, Low-Power, 2-Channel, 108ksps,  Serial 12-Bit ADCs in 8-Pin μMAX


Part Description:
Complete, Isolated RS-485/RS-422 Data Interface


Part Description:
±15kV ESD-Protected, Isolated RS-485/RS-422 Data Interface


Part Description:
InTune Automatically Compensated Digital PoL Controller with Driver and PMBus Telemetry


PackageDescription:
QFN, 0.50mm Pitch, Square; 40 Pin, 6.00mm L X 6.00mm W X 0.80mm H Body (W/Thermal Tab 4.25mm x 4.25mm), IPC Medium Density

Part Description:
6A Digital PoL DC-DC Converter with InTune Automatic Compensation


PackageDescription:
QFN, 0.50mm Pitch, Square; 24 Pin, 4.00mm L X 4.00mm W X 0.80mm H Body (W/Thermal Tab 2.65mm X 2.65mm), IPC Medium Density


PackageDescription:
QFN, 0.40mm Pitch, Square; 28 Pin, 4.00mm L X 4.00mm W X 0.80mm H Body (w/Thermal Tab 2.7x2.7mm), IPC Medium Density

Part Description:
Voltage Monitors/Sequencer Circuits with Reverse-Sequencing Capability


Part Description:
4A Sink/Source Current, 12ns, Dual MOSFET Driver


PackageDescription:
QFN, 0.80mm Pitch, Square; 12 Pin, 4.00mm L X 4.00mm W X 0.80mm H Body (W/Thermal Tab 2.25mm X 2.25mm), IPC Medium Density

Part Description:
Digitally Controlled, 0.5% Accurate, Safest APD Bias Supply


Part Description:
LF-to-2.5GHz Dual Logarithmic Detector/Controller for Power, Gain, and VSWR Measurements


Part Description:
+5V, Dual Line RS-232 Transceivers with 0.1uF External Capacitors


Part Description:
Dual RS232 Driver/Reveiver (No External Caps, High Slew Rate)


PackageDescription:
QFN, 0.40mm Pitch, Square; 68 Pin, 8.00mm L X 8.00mm W X 0.80mm H Body (W/Thermal Tab 6.35mm X 6.35mm), IPC Medium Density


Part Description:
8th-Order, Lowpass, Elliptic Switched-Capacitor Filter


Part Description:
±15kV ESD-Protected, 3.3V Quad RS-422 Transmitter


Part Description:
+3.3V, 1Mbps, Low-Supply-Current CAN Transceiver


Part Description:
Precision, 8-Channel, High-Performance, CMOS Analog Multiplexer


Part Description:
±15kV ESD-Protected, 10Mbps, 3V, Low-Power Quad RS-422/RS-485 Receivers


Part Description:
10 Ohms Quad, SPST, CMOS Analog Switches (Normally Closed)


Part Description:
10 Ohms Quad, SPST, CMOS Analog Switches (Normally Open)


Part Description:
10 Ohms Quad, SPST, +3V Logic-Compatible Analog Switches (Normally Open)


PackageDescription:
QFN, 0.65mm pitch, Square; 20 pin, 5.00mm L X 5.00mm W X 0.80mm H Body (W/Thermal Tab 3.35mm X 3.35mm), IPC Medium Density


Part Description:
Precision, Single SPDT CMOS Analog Switch


Part Description:
3V To 5.5V Multichannel RS-232 Line Driver/Receiver With ±15kV IEC ESD Protection


Part Description:
Precision, Single-Supply, Dual SPST Analog Switches (Normally Open)


Part Description:
Quad, SPST, Utra-Low Leakage CMOS Analog Switches (Normally Open)


Part Description:
±15kV ESD-Protected 52Mbps, 3V to 5.5V, RS-485/RS-422 True Fail-Safe Receiver


PackageDescription:
QFN, 0.80mm Pitch, Square; 16 Pin, 5.00mm L X 5.00mm W X 0.80mm H Body (W/Thermal Tab 3.20mm X 3.20mm), IPC Medium Density

Part Description:
Ultra-Low Leakage Monolithic CMOS Analog Multiplexers


PackageDescription:
SOP, 0.65mm Pitch; 28 Pin, 5.29mm W X 10.20mm L X 1.99mm H Body, IPC Medium Density

Part Description:
16-Channel, Low-Leakage, CMOS Analog Multiplexer


Part Description:
16-Channel, Low-Leakage, CMOS Analog Multiplexers


PackageDescription:
SOP, 14-Leads, Body 4.4x5mm (max), Pitch 0.65mm, IPC Medium Density

Part Description:
±15kV ESD-Protected, 1µA, 16Mbps, Quad Low-Voltage Level Translators in UCSP


Part Description:
Dual 8-Channel, Low-Leakage, CMOS Analog Multiplexer


Part Description:
2.5V, ±15kV ESD-Protected RS-232 Transceivers for PDAs and Cell Phones


Part Description:
Dual 4-Channel, Low-Leakage, CMOS Analog Multiplexer


Part Description:
USB Peripheral Controller with SPI Interface


Part Description:
+5V, Fail-Safe, 20Mbps, Full Duplex Profibus RS-485/RS-422 Transceiver


Part Description:
3.3V-Powered, ±15kV ESD-Protected, 250 kbps and Slew-Rate-Limited True RS-485/RS-422 Transceiver


PackageDescription:
SOP, 0.635mm pitch; 16 pin, 3.9mm W X 4.89mm L body, IPC Medium Density

Part Description:
+5.5V, 125Mbps to 200Mbps Limiting Amplifier with Loss-of-Signal Detector


PackageDescription:
QFN, 0.50mm pitch, Square; 24 Pin, 4.00mm L X 4.00mm W X 0.80mm H Body (W/Thermal Tab 2.25mm X 2.25mm), IPC Medium Density

Part Description:
+3.3V, 622Mbps SDH/SONET Laser Driver with Current Monitors and APC


PackageDescription:
SOP, 0.635mm Pitch; 20 Pin, 3.90mm W X 8.65mm L X 1.73mm H Body, IPC Medium Density

Part Description:
622Mbps LAN/WAN Laser Driver with Automatic Power Control and Safety Shutdown


PackageDescription:
QFN, 0.50mm Pitch, Square; 20 Pin, 4.00mm L X 4.00mm W X 0.90mm H Body (w/Thermal Tab 2.25 X 2.25mm), IPC Medium Density

Part Description:
3.0V to 5.5V, 2.5Gbps VCSEL and Laser Driver


PackageDescription:
QFN, 0.50mm Pitch, Square; 20 Pin, 4.00mm L X 4.00mm W X 0.80mm H Body (w/Thermal Tab 2.25 X 2.25mm), IPC Medium Density


Part Description:
Low-Voltage, 3-Channel CMOS Analog Multiplexers/Switches


Part Description:
Current-Regulating Hot-Swap Controller with DualSpeed/BiLevel Fault Protection


Part Description:
High-Speed, 6A Single MOSFET Driver, Non-Inverting Outputs


Part Description:
Dual High-Speed 1.5A Noninverting MOSFET Drivers


Part Description:
Dual High-Speed 1.5A Inverting/Noninverting MOSFET Drivers


Part Description:
High-Speed, 6A Single MOSFET Driver, Inverting Outputs


Part Description:
Quad, Rail-to-Rail, Fault-Protected, SPST Analog Switches (2 Normally Open + 2 Normally Close)


Part Description:
Precision, 4-Channel Low-Voltage, CMOS Analog Multiplexer


Part Description:
Quad, Low-Voltage, SPST Analog Switches (4 Normally Open)


Part Description:
2 x SPST + 6 x SPDT, Serially Controlled, Clickless Audio/Video Switches


Part Description:
5 Ohms Quad SPST Analog Switches (Normally Open)


Part Description:
3.5 Ohms, Single 8:1 and Dual 4:1, Low-Voltage Analog Multiplexers


Part Description:
Low Voltage, 4 Ohm, Quad, SPST, CMOS Analog Switches (Normally Open)


Part Description:
50 OHM, Dual SPST Analog Switches in UCSP


Part Description:
16-Channel, Linear, High-Voltage Analog Switches


Part Description:
Pin-/Software-Compatible, Dual 16-Bit, Voltage-Output DAC


Part Description:
Low-Power, Low-Glitch, Octal 10-Bit Voltage-Output DAC With Serial Interface


Part Description:
+5V, Serial-Input, Voltage-Output, 16-Bit ±1LSB DAC


Part Description:
+5V, Serial-Input, Voltage-Output, 16-Bit ±2LSB DACs


Part Description:
+5V, Serial-Input, Voltage-Output, 16-Bit ±2LSB DAC


Part Description:
+3V, Serial-Input, Voltage-Output, 16-Bit ±2LSB DACs


Part Description:
10k, 10-Bit, Nonvolatile Linear-Taper Digital Potentiometer


Part Description:
50k, 10-Bit, Nonvolatile Linear-Taper Digital Potentiometer


Part Description:
10-Bit, Dual, Nonvolatile 10k Linear-Taper Digital Potentiometer (Two programmable voltage dividers)


Part Description:
10-Bit, Dual, Nonvolatile 50k Linear-Taper Digital Potentiometer (Two programmable voltage dividers)


Part Description:
10-Bit, Dual, Nonvolatile 10k Linear-Taper Digital Potentiometer (Two Variable Resistors)


Part Description:
10-Bit, Dual, Nonvolatile 50k Linear-Taper Digital Potentiometer (Two Variable Resistors)


Part Description:
10-Bit, Dual, Ultra-Low-Power, Voltage-Output DACs


Part Description:
Low-Cost, +5V, Serial-Input, Voltage-Output, 16-Bit DAC


PackageDescription:
QFN, 0.50mm Pitch, Square; 68 Pin, 10.0mm L X 10.0mm W X 1.00mm H Body (W/Thermal Tab 5.95mm X 5.95mm), IPC Medium Density

Part Description:
14-Bit, 600Msps, High-Dynamic-Performance DAC with LVDS Inputs


PackageDescription:
SOT143, 4-Leads, Body 3.0x2.6mm (max), Pitch 1.92mm, IPC Medium Density

Part Description:
1.665V Microprocessor Supervisory Reset Circuit with Edge-Triggered, One-Shot Manual Reset


Part Description:
Precision Temperature Monitor For DDR Memory Modules


Part Description:
2-Channel Temperature Monitor with Dual, Automatic, PWM Fan-Speed Controller


Part Description:
3.075V And 1.11V Threshold Voltage Ultra-Low-Voltage SOT23 Up Supervisory Circuit


Part Description:
±15kV ESD-Protected, Single CMOS Switch Debouncers


Part Description:
±15kV ESD-Protected, Octal, CMOS Switch Debouncers


PackageDescription:
SOP, 0.635mm Pitch; 16 Pin, 3.90mm W X 4.89mm L X 1.65mm H body (w/thermal tab 2.29mm X 3.3mm), IPC Medium Density

Part Description:
Serially Interfaced, +2.7V to +5.5V, 8-Digit 7 segment LED Display Driver


PackageDescription:
SOP, 0.80mm Pitch; 36 Pin, 7.50mm W X 15.375mm L X 2.65mm H Body, IPC Medium Density

Part Description:
2-Wire Interfaced, 2.7V to 5.5V LED Display Driver with I/O Expander and Key Scan


Part Description:
2-Wire-Interfaced, 2.5V to 5.5V, 28-Port I/O Expander


Part Description:
4-Wire-Interfaced, 2.5V to 5.5V, 28-Port I/O Expander


Part Description:
8th-Order, Lowpass, Elliptic, Switched-Capacitor Filter


PackageDescription:
SOP, 0.65mm Pitch; 28 Pin, 4.40mm W X 9.75mm L X 1.10mm H Body (Thermal tab 3.15 X 5.65mm), IPC Medium Density

Part Description:
Single-Channel Monochrome On-Screen Display with Integrated EEPROM


Part Description:
±5V, ±15V Dedicated Microprocessor Voltage Monitors


Part Description:
Isolated Transformer Driver for PCMCIA Applications


Part Description:
Current-Limited, High-Side P-Channel Switches with Thermal Shutdown


Part Description:
Single LVDS Line Receiver with Ultra-Low Pulse Skew


Part Description:
Quad LVDS Line Receivers with Integrated Termination and Flow-Through Pinout


PackageDescription:
QFN,0.50mm pitch,square; 4 pin X 4 pin, 3mm X 3mm X 0.80mm H body (w/thermal tab 1.25 X 1.25mm),  IPC Medium Density

Part Description:
Quad LVDS Line Receiver with Flow-Through Pinout and "In-Path" Fail-Safe


PackageDescription:
SON, 0.50mm Pitch; 8 Pin, 2.00mm W X 2.00mm L X 0.65mm H body (w/thermal tab 1.1 X 1.7 mm), IPC Medium Density


PackageDescription:
SOT, 0.95mm Pitch; 5 Pin,1.55mm W X 2.90mm L X 1.45mm H body, IPC Medium Density

Part Description:
Tiny 500mA, High-Speed Power MOSFET Drivers


Part Description:
Tiny 1.5A, High-Speed Power MOSFET Drivers


PackageDescription:
SOIC, 18-Leads, Body 13.9x7.6mm (max), Pitch 1.27mm, IPC Medium Density

Part Description:
8-Bit I/O Expander with Serial Interface


Part Description:
8-Bit I/O Expander with Open-Drain Outputs


Part Description:
16-Bit I/O Expander with I2C High-speed Serial Interface


Part Description:
16-bit I/O Port Expander With Serial Interface


PackageDescription:
QFN, 0.65mm pitch, square; 28 pin, 6.00mm L X 6.00mm W X 1.00mm H body (w/thermal tab 4.2mm x 4.2mm), IPC Medium Density


Part Description:
16-Bit I/O Expander with SPI High-speed Serial Interface


Part Description:
2.7V 4-Channel 12-Bit Analog-to-Digital Converter With SPI Serial Interface


Part Description:
12-Bit Dual Voltage Output Digital-to-Analog Converter With Internal VREF And SPI Interface


Part Description:
12-Bit Dual Voltage Output Digital-to-Analog Converter with Internal VREF and SPI Interface


PackageDescription:
SOT, 0.95mm, pitch; 3 pin,1.30mm W X 2.92mm L X 1.12mm H body, IPC Medium Density

Part Description:
3.075V Microcontroller Supervisory Circuit With Push-Pull Output


Part Description:
Adjustable Current Limiting Power Distribution Switches


Part Description:
Single-Channel Power Distribution Switch MM8®


PackageDescription:
SOIC, 1.27mm Pitch; 8 pin, 3.905mm W X 4.895mm L X 1.68mm H body (w/thermal tab 3.1mm X 2.4mm), IPC Medium Density

Part Description:
6A Peak Low-Side MOSFET Driver, Non-Inverting Outputs


PackageDescription:
DIP 24 Leads, Row Spacing 7.62mm; Pitch 2.54mm


Part Description:
2-Cell Li-Ion or Li-Polymer Switching Charger Compatible with 5V Input and Integrated, Bidirectional Charge/Discharge


PackageDescription:
MINIRF S-19 Case, Body 3.81mm L X 3.81mm W X 2.92mm H

Part Description:
2 Way-0°, 50 Ohms, 1 to 1000MHZ, Power Splitter


PackageDescription:
THORLABS MTD415T Case, 1.27mm pitch, 16 Pins, 21mm X 12.4mm X 3.10mm H Body

Part Description:
Miniature Temperature Controller, ±1.5 A, Compatible with 10 kΩ Thermistor


PackageDescription:
QFN,0.50mm pitch,square; 4 pin X 4 pin, 3mm X 3mm X 1.00mm H body (w/thermal tab 1.85 X 1.85mm),  IPC Medium Density

Part Description:
2.5 V/3.3 V/5.0 V Differential Data/Clock D Flip-Flop with Reset


Part Description:
3.3V, 2.5Gb/s Dual Any Level to LVDS Receiver/Driver/Buffer/Translator With Internal Input Termination


Part Description:
2.5V 1:2 AnyLevel Input to LVDS Fanout Buffer / Translator


Part Description:
2.5V/3.3V 3.0GHz Differential 1:4 LVPECL Fanout Buffer


PackageDescription:
QFN,0.50mm pitch,square; 8 pin X 8 pin, 5mm X 5mm X 1.00mm H body (w/thermal tab 3.25 X 3.25mm),  IPC Medium Density

Part Description:
2.5V/3.3V Differential 4:1 Mux to 1:2 CML Clock/Data Fanout/Translator


Part Description:
2.5V/3.3V 1:2 Differential LVPECL Clock / Data Fanout Buffer


Part Description:
3.3V 1:2 AnyLevel Input to LVDS Fanout Buffer / Translator


PackageDescription:
BGA 1mm, Pitch, Square 256 Pin, 16 Columns x 16 Rows, Body 17mm X 17mm X 2mm H


PackageDescription:
BGA, 0.40mm Pitch, Rect.; 62 Pin, 9 Columns X 9 Rows, 3.50mm X 3.83mm X 0.55mm H

Part Description:
ANT and ANT/Bluetooth Low Energy Multiprotocol SoC


PackageDescription:
QFN, 0.40mm Pitch, Square; 48 Pin, 6.00mm L X 6.00mm W X 0.90mm H body (W/Thermal Tab 4.70mm X 4.70mm), IPC Medium Density


PackageDescription:
NXP SOT1174-1, Plastic, Extremely Thin Quad Flat Package; No Leads; 12 Terminals; Body 1.70 x 2.00 x 0.50 mm

Part Description:
Dual Supply Translating Transceiver; Auto Direction Sensing; 3-State


PackageDescription:
BGA, 0.40mm Pitch, Rect, 20 Pin, 4 Columns X 5 Rows, 1.7mm X 2.1mm X 0.50mm H

Part Description:
SD 3.0-SDR104 Compliant Integrated Auto-Direction Control Memory Card Voltage Level Translator With EMI Filter And ESD Protection


Part Description:
Dual bidirectional bus buffer (I2C-bus and Other  Bus)


Part Description:
DC to 7000MHz,  1W, 50 Ohms, 0dB Fixed Attenuator


PackageDescription:
SUSUMU PAT0510S, 4 Pin Attenuator, Size 0402, L 1.00 x W 0.5 H 0.39mm

Part Description:
DC to 10GHz, 32mW, 50 Ohm, 0dB, Precision Chip Attenuator


Part Description:
DC to 10GHz, 32mW, 50 Ohm, 10dB, Precision Chip Attenuator


Part Description:
DC to 10GHz, 32mW, 50 Ohm, 1dB, Precision Chip Attenuator


Part Description:
DC to 10GHz, 32mW, 50 Ohm, 2dB, Precision Chip Attenuator


Part Description:
DC to 10GHz, 32mW, 50 Ohm, 3dB, Precision Chip Attenuator


Part Description:
DC to 10GHz, 32mW, 50 Ohm, 4dB, Precision Chip Attenuator


Part Description:
DC to 10GHz, 32mW, 50 Ohm, 5dB, Precision Chip Attenuator


Part Description:
DC to 10GHz, 32mW, 50 Ohm, 6dB, Precision Chip Attenuator


Part Description:
DC to 10GHz, 32mW, 50 Ohm, 7dB, Precision Chip Attenuator


Part Description:
DC to 10GHz, 32mW, 50 Ohm, 8dB, Precision Chip Attenuator


Part Description:
DC to 10GHz, 32mW, 50 Ohm, 9dB, Precision Chip Attenuator


Part Description:
DC to 7000MHz,  1W, 50 Ohms, 1dB Fixed Attenuator


Part Description:
DC to 7000MHz,  1W, 50 Ohms, 10dB Fixed Attenuator


Part Description:
DC to 7000MHz,  1W, 50 Ohms, 12dB Fixed Attenuator


PackageDescription:
SUSUMU PAT1220, 4 Pin Attenuator, Size 0805, L 2.00 x W 1.25 H 0.5mm

Part Description:
DC to 10GHz, 100mW, 50 Ohm, 0dB, Precision Chip Attenuator


Part Description:
DC to 10GHz, 100mW, 50 Ohm, 10dB, Precision Chip Attenuator


Part Description:
DC to 10GHz, 100mW, 50 Ohm, 1dB, Precision Chip Attenuator


Part Description:
DC to 10GHz, 100mW, 50 Ohm, 2dB, Precision Chip Attenuator


Part Description:
DC to 10GHz, 100mW, 50 Ohm, 3dB, Precision Chip Attenuator


Part Description:
DC to 10GHz, 100mW, 50 Ohm, 4dB, Precision Chip Attenuator


Part Description:
DC to 10GHz, 100mW, 50 Ohm, 5dB, Precision Chip Attenuator


Part Description:
DC to 10GHz, 100mW, 50 Ohm, 6dB, Precision Chip Attenuator


Part Description:
DC to 10GHz, 100mW, 50 Ohm, 7dB, Precision Chip Attenuator


Part Description:
DC to 10GHz, 100mW, 50 Ohm, 8dB, Precision Chip Attenuator


Part Description:
DC to 10GHz, 100mW, 50 Ohm, 9dB, Precision Chip Attenuator


Part Description:
DC to 7000MHz,  1W, 50 Ohms, 15dB Fixed Attenuator


Part Description:
DC to 7000MHz,  1W, 50 Ohms, 2dB Fixed Attenuator


Part Description:
DC to 7000MHz,  1W, 50 Ohms, 20dB Fixed Attenuator


Part Description:
DC to 7000MHz,  1W, 50 Ohms, 3dB Fixed Attenuator


Part Description:
DC to 7000MHz,  1W, 50 Ohms, 30dB Fixed Attenuator


Part Description:
DC to 7000MHz,  1W, 50 Ohms, 4dB Fixed Attenuator


Part Description:
DC to 7000MHz,  1W, 50 Ohms, 5dB Fixed Attenuator


Part Description:
DC to 7000MHz,  1W, 50 Ohms, 6dB Fixed Attenuator


Part Description:
DC to 7000MHz,  1W, 50 Ohms, 7dB Fixed Attenuator


Part Description:
DC to 7000MHz,  1W, 50 Ohms, 8dB Fixed Attenuator


Part Description:
DC to 7000MHz,  1W, 50 Ohms, 9dB Fixed Attenuator


PackageDescription:
SOP, 0.65mm, Pitch; 8 Pin, 2.80mm W X 2.95mm L X 1.30mm H Body, PC Medium Density

Part Description:
Dual Bidirectional I2C Bus And SMBus Voltage-Level Translator


PackageDescription:
SON, 0.35mm pitch, 8 pin, 1.4mm X 1mm X 0.4mm H body,  IPC Medium Density


Part Description:
8-Bit I2C-Bus and SMBus Low Power I/O Port with Interrupt


Part Description:
Remote 8-Bit I2C and SMBus Low-Power I/O Expander With Interrupt Output and Configuration Registers


PackageDescription:
SOP, 20-Leads, Body 6.6x4.5mm (max), Pitch 0.65mm, IPC Medium Density

Part Description:
4-Channel I2C-Bus Multiplexer with Interrupt Logic


PackageDescription:
TEXAS Case Style RGY (R-PVQFN–N20), QFN, 0.50mm Pitch, Rectangular; 20 Pin, 4.50mm L X 3.50mm W X 1mm H body (w/thermal tab 3.15 X 2.15mm)

Part Description:
Low Voltage 4-Channel I2C and SMBus Multiplexer With Interrupt Logic


PackageDescription:
QFN, 0.50mm Pitch, Square; 24 Pin, 4.00mm L X 4.00mm W X 1.00mm H body (w/thermal tab 2.2 X 2.2mm), IPC Medium Density

Part Description:
8-Channel I2C-Bus Multiplexer with Reset


PackageDescription:
SOIC 24, Pitch 1.27mm - Body 7.6x15.6mm, IPC Medium Density

Part Description:
Low Voltage 8-Channel I2C Switch With Reset


Part Description:
16-bit I2C-Bus LED Driver with Programmable Blink Rates


Part Description:
8-Bit I2C-Bus and SMBus I/O Port with Interrupt


PackageDescription:
QFN,0.50mm pitch,square;6 pin X 6 pin,4.10mm X 4.10mm body (w/thermal tab 2.25 X 2.25 mm), IPC Medium Density

Part Description:
Low-Voltage 16-Bit I2C-bus I/O Port With Interrupt and Weak Pull-Up


Part Description:
8-Bit I2C-bus and SMBus I/O Port with Reset


Part Description:
Remote 8-Bit I2C and SMBus Low-Power I/O Expander With Reset and Configuration Registers


PackageDescription:
SOP, 0.50mm Pitch; 56 Pin,6.10mm W X 14.00mm L X 1.20mm H Body, IPC Medium Density

Part Description:
40-bit Fm+ I2C-bus advanced I/O port with RESET/, OE/ and INT/


PackageDescription:
SOIC, 1.27mm Pitch; 20 Pin, 5.30mm W X 12.60mm L X 2.00mm H body, IPC Medium Density

Part Description:
BiCMOS Advanced Sign Magnitude 20-Bit Digital-to-Analog Converter


Part Description:
24-Bit, 192-kHz Sampling, Advanced Segment, Audio Stereo Digital-to-Analog Converter


PackageDescription:
Marki microwave BTSLM-PDLSM Style, 11.43mm L X 3.81mm W X 2.79mm H Body


PackageDescription:
LGA, 0.40mm pitch, 29 Pin, 4.00mm L X 4.00mm W X 1.00mm H body

Part Description:
50 Ohm, UltraCMOS® SP4T RF Switch 9 kHz–18 GHz


PackageDescription:
QFN, 0.50mm Pitch, Square; 24 Pin, 4.00mm L X 4.00mm W X 0.85mm H body(w/thermal tab 2.75 X 2.75mm), IPC Medium Density

Part Description:
50 Ohm 7-Bit RF Digital Step Attenuator (DSA)


PackageDescription:
QFN, 0.50mm Pitch, Rect.; 28 Pin, 3.50mm L X 5.50mm W X 0.85mm H Body (W/Thermal Tab 2.15mm X 4.15mm), IPC Medium Density

Part Description:
1.8V, 6.5 Gpbs SAS2, SATA3, XAU1, 2 Differential Channe, 2:1 Mux/DeMux Switch


PackageDescription:
QFN, 0.50mm Pitch, Rect.; 42 [in, 9.00mm L X 3.50mm W X 0.84mm H Body (w/Thermal Tab 2.15mm x 7.65mm),  IPC Medium Density

Part Description:
1.8V, PCI Express Gen2 Compliant, 4-Differential Channel, 2:1 Mux/DeMux Switch


PackageDescription:
PERICOM X2QFN Code XUA18, 0.40mm Pitch, Rect.; 18 Pin, 2mm L X 2mm W X 0.4mm H Body (W/Thermal Tab 0.9mm X 0.9mm)

Part Description:
3.3V, 1-12Gbps 1-Lane 2:1 Mux/De-Mux Switch


PackageDescription:
PERICOM TQFN Code ZBS20, 0.50mm Pitch, Rect.; 20 Pin, 2.50mm L X 4.50mm W X 1.00mm H Body (W/Thermal Tab 1.2mm X 3.2mm)


Part Description:
3.3V,  PCI Express 3.0, SAS, USB,  4-Differential Channel, 2:1 Mux/DeMux Switch


PackageDescription:
QFN, 0.50mm Pitch, Square; 24 Pin, 4.00mm L X 4.00mm W X 0.90mm H Body (w/Thermal Tab 2.55 X 2.55 mm), IPC Medium Density


PackageDescription:
PICOR QPI-5 LGA, 2.54mm pitch, Square; 16 pin, 25.3mm X 25.3mm X 4.98mm H

Part Description:
Picor QuietPower Active EMI Input Filter Module


PackageDescription:
QFP, 0.50mm Pitch, Square, 44 Pin, 7.00mm L X 7.00mm W X 1.60mm H Body, IPC Medium Density

Part Description:
Resistance & Pressure Bridge Front End (LQFP44 CERN ASIC)


PackageDescription:
PLCC, 1.27mm Pitch, Square; 44 Pin, 16.60mm L X 16.60mm W X 4.57mm H Body, IPC Medium Density

Part Description:
Resistance & Pressure Bridge Front End (PLCC44 CERN ASIC)


PackageDescription:
MINI-CIRCUITS GP731 Case, 8 Pin, 8.89mm W X 8.89mm L


PackageDescription:
HOPERF Case for RFN95W, 2mm Pitch, 16 Pin, 16.00mm L X 16.00mm W X 1.80mm H Body

Part Description:
868MHz, Low Power Long Range Transceiver Module


PackageDescription:
Hermetic Ceramic SOIC, 1.27mm Pitch; 24 Pin, 7.62mm W X 15.59mm L X 3.048mm H Body


PackageDescription:
MINI-CIRCUITS TT1224 Case, 6 pin, 6.35mm W X 7.87mm L

Part Description:
50 Ohms, 0.2 to 3000MHz, +12 to +33dBm Limiter


PackageDescription:
MICROCHIP RN2483A Case, 1.27mm Pitch, 47 Pin, 26.67mm L X 17.78mm W X 3.34mm H body

Part Description:
Low-Power Long Range LoRa® Technology Transceiver Module


PackageDescription:
MINI-CIRCUITS DV874 Case, 2.54mm pitch; 16 pins, Square Body 12.7mm W X 12.7mm L X 4.95mm H

Part Description:
10 to 2500MHz,  50 Ohms, Voltage Variable Attenuator


PackageDescription:
MINI-CIRCUITS TDZ943 Case, 10 pin,  7.62mm W X 6.35mm L

Part Description:
4 Way-0°, 50 Ohms, 5 to 1000MHz, Power Splitter/Combiner


PackageDescription:
BGA, 0.80mm pitch, square; 100 pin, 10 columns X 10 rows,10.00mm X 10.00mm X 1.50mm H

Part Description:
7-Port Multidrop IEEE 1149.1 (JTAG) Multiplexer


PackageDescription:
QFP, 0.50mm Pitch, Square; 100 Pin,14.00mm L X 14.00mm W X 1.20mm H Body, IPC Medium Density


PackageDescription:
SON, 0.50mm Pitch; 16 Pin, 5.00mm W X 5.00mm L X 0.80mm H body (w/thermal tab 3.70 X 4.10 mm), IPC Medium Density

Part Description:
Eight Input IEEE 1149.1 Analog Voltage Monitor


PackageDescription:
MINI-CIRCUITS YY161 Case, Body 19.05mm L X 9.65mm W X 7.11mm H

Part Description:
5 Way-0°, 50 Ohms, 2 to 200MHz, Power Splitter/Combiner


PackageDescription:
MINI-CIRCUITS BL301-1 Case, 2.54mm Pitch; Body 32mm L X 23.62mm W X 9.91mm H (w/Thermal Tab 29.59 X 14.48mm)

Part Description:
50 Ohms, 10dB Coupling, 50 to 6000MHz, Directional Coupler


PackageDescription:
QFN, 0.50mm Pitch, Square; 32 Pin, 5.00mm L X 5.00mm W X 1.00mm H Body (w/Thermal Tab 2.3mm X 2.3mm), IPC Medium Density

Part Description:
2 Input/6 Output, Low Jitter Universal Buffeur/Level Translator With 2:1 Input Mux And Individual Output Enable


PackageDescription:
QFN, 0.50mm Pitch, Square; 16 Pin, 3.00mm L X 3.00mm W X 0.90mm H Body (w/thermal tab 1.75mm x 1.75mm), IPC Medium Density


PackageDescription:
QFN, 0.50mm Pitch, Square; 44 Pin, 7.00mm L X 7.00mm W X 0.90mm H Body (w/Thermal Tab 2.95mm X 2.95mm), IPC Medium Density

Part Description:
2 Input/10 Output, Low Jitter Universal Buffer/Level Translator With 2:1 Input Mux (<1.25 GHZ)


PackageDescription:
QFN,0.50mm Pitch, Square; 44 Pin, 7.00mm L X 7.00mm W X 0.90mm H Body (W/Thermal Tab 5.3mm X 5.3mm), IPC Medium Density

Part Description:
Low-Jitter, 10 or 4-Output, Any-Frequency, Any-Output Clock Generator


Part Description:
2.5kV 150Mbps ISOpro Low Power Six-Channel Digital Isolator


Part Description:
2.5kV 150Mbps Low Power Single-Channel Digital Isolator


Part Description:
3.75kV 150Mbps Low Power Dual-Channel Digital Isolator


Part Description:
2.5kV 150Mbps Low Power Five-Channel Digital Isolator


Part Description:
2.5kV 150Mbps Low Power Six-Channel Digital Isolator


Part Description:
3.75kV 150Mbps Low Power Six-Channel Digital Isolator


Part Description:
Frequency Mixer - Level 13 (LO Power +13 dBm) 7300 to 20000MHz


PackageDescription:
QFN, (MO-220-VHHD-4) 0.50mm pitch,square; 8 pin X 8 pin, 5mm X 5mm X 0.9mm H body (w/thermal tab 3.2 X 3.2mm),  IPC Medium Density

Part Description:
0.01 - 4.0 GHz Seven-Bit Digital Attenuator with Serial and Parallel Drivers


PackageDescription:
SKY16602-632LF Case 4 Pins,  Body 2.3mm X 2.3mm X 0.6mm H

Part Description:
0.2 to 4.0 GHz, Low-Threshold PIN Diode Limiter


Part Description:
25Mbps Extended Common-Mode RS-485 Transceiver


Part Description:
20Mbps Low-power Half-duplex RS-485 Transceiver


Part Description:
10-MHz to 66-MHz, 1:10 LVDS Deserializer


Part Description:
High-Speed Differential Line Drivers And Receivers


Part Description:
Dual LVDS High-Speed Differential Receiver


PackageDescription:
SOP, 0.50mm pitch; 64 pin, 6.10mm W X 17.00mm L X 1.20mm H body IPC Medium Density

Part Description:
16 High-Speed Differential Line Receiver


PackageDescription:
SOP, 0.50mm pitch; 38 pin, 4.40mm W X 9.70mm L X 1.20mm H body IPC Medium Density


PackageDescription:
QFN, 10-Leads, Body 1.5x2mm, Pitch 0.50mm, IPC Medium Density

Part Description:
1.8V High-Speed Differential Line Receiver


Part Description:
2Gbps LVDS/LVPECL/CML to LVDS Translator/Repeater


Part Description:
Memory Stick™ INTERCONNECT Extender Chipset with LVDS One Driver Plus Four Receivers


Part Description:
Memory Stick™ INTERCONNECT Extender Chipset with LVDS Four Drivers Plus One Receiver


Part Description:
4-Channel Half-Duplex M-LVDS Line Transceiver


PackageDescription:
BGA, 0.80mm pitch, Rect.; 96 pin, 6 columns X 16 rows, 5.5mm X 13.5mm X 1.40mm H

Part Description:
32-Bit Bus Switch, 2.5/3.3V High Bandwidth


Part Description:
10-Bit FET Bus Switches Level Shifting 5V Bus Switch with -2V Undershoot Protection


Part Description:
Single-Pole Double-Throw (SPDT) Analog Switch 2:1 Analog Multiplexer/Demultiplexer


Part Description:
3.3V ABT Scan Test Device With 20-Bit Universal Bus Transceivers


Part Description:
3.3V ABT Scan Test Device With 18-Bit Transceivers and Registers


PackageDescription:
SOIC, 1.27mm Pitch; 16 Pin, 5.30mm W X 10.20mm L X 2.00mm H body, IPC Medium Density

Part Description:
High-current Transistor Array, Seven NPN Darlington Pairs, High Voltage Outputs


Part Description:
EIA/TIA-422-B Dual Differential Line Driver


Part Description:
RS-485 Low-Power Differential Line Driver And Receiver Pairs


Part Description:
16Mbps ±15kV ESD-Protected, Full Duplex, Failsafe RS-485/RS422 Transceivers, 3.3V


Part Description:
16Mbps ±15kV ESD-Protected, Half Duplex RS-485/RS422 Transceiver


Part Description:
±15kV ESD-Protected, Low Power  RS-485/RS-422 Transceiver


Part Description:
2.93V Reset Threshold Voltage Microprocessor Reset Circuit


PackageDescription:
QFN, 0.50mm Pitch, Square; 56 Pin, 8.00mm L X 8.00mm W X 1.00mm H body (5.60mm X 5.60mm Thermal tab), IPC Medium Density

Part Description:
8PSK/QPSK Low-Power 3.3V Dual Wide-Band Satellite Tuner IC


PackageDescription:
SOT353, SC70-5, SOT, 0.65mm Pitch, 5 pin, 1.25mm W X 2.00mm L X 1.10mm H, IPC Medium Density


Part Description:
Quad SPST (2 Normally closed + 2 Normally Open) JFET Analog Switch With Disable


Part Description:
Triple LVPECL-to-PECL or PECL-to-LVPECL Translator


PackageDescription:
SON, 0.50mm Pitch; 8 Pin, 2.00mm W X 2.00mm L X 0.90mm H body (w/thermal tab 0.7 X 1.3 mm), IPC Medium Density

Part Description:
Low Voltage 1.2V/1.8V CML Differential Line Driver/Receiver 3.2Gbps, 3.2GHz


PackageDescription:
QFN,0.50mm pitch,square; 4 pin X 4 pin, 3mm X 3mm X 0.9mm H body (w/thermal tab 1.6 X 1.6mm),  IPC Medium Density

Part Description:
Low Voltage 1.2V/1.8V/2.5V CML Dual Channel Buffer 4.5GHz/6.4Gbps with Equalization


Part Description:
7GHz 1:2 CML Fanout Buffer/Translator w/400mv CML Outputs and Internal Input Termination


Part Description:
10.7Gbps Differential CML 2:1 MUX with Internal Termination


Part Description:
10.7Gbps 2 x 2 Crosspoint Switch w/CML Outputs and Internal Termination


Part Description:
3.2Gbps Precision, LVDS Buffer with Internal Termination and Fail Safe Input


Part Description:
3.2Gbps Precision, 2:1 LVDS MUX With Internal Termination And Fail Safe Input


Part Description:
5V/3.3V 155Mbps Laser Diode Driver with Output Enable


PackageDescription:
QFN, 0.50mm Pitch, Square; 44 pin, 7.00mm L X 7.00mm W X 1.00mm H body (w/thermal tab 3.40 X 3.40mm),  IPC Medium Density

Part Description:
2.5V Low Jitter, Low Skew 1:12 LVDS Fanout Buffer with 2:1 Input MUX and Internal Termination


PackageDescription:
QFN, (MO-220-VHHD-4) 0.50mm pitch,square; 8 pin X 8 pin, 5mm X 5mm X 1.00mm H body (w/thermal tab 3.2 X 3.2mm),  IPC Medium Density

Part Description:
2.5V/3.3V 1.5GHz Precision LVPECL Programmable Delay


PackageDescription:
QFN, 0.50mm Pitch, Square; 24 Pin, 4.00mm L X 4.00mm W X 0.90mm H Body (w/Thermal Tab 2.75 X 2.75 mm), IPC Medium Density

Part Description:
Precision LVDS 2:1 Multiplexer with 1:2 Fanout and Internal Termination


Part Description:
3.3V, 3.2Gbps Dual, Differential 2:1 LVDS Multiplexer With Internal Termination


PackageDescription:
QFN,0.50mm pitch,square; 16 Pin, 3mm X 3mm X 0.9mm H body (w/thermal tab 1.6 X 1.6mm),  IPC Medium Density

Part Description:
2.5V, 2GHz Ultra-Precision 1:4 LVDS Fanout Buffer/Translator With Internal Termination


Part Description:
2.5V, 2GHz (3.2 Gbps) Ultra-Precision, Differential 1:2 LVDS Fanout Buffer With Internal Termination and Fail Safe Input


PackageDescription:
MINI-CIRCUITS AH202-1 Case, Body 12.7mm L X 9.65mm W X 6.35mm H

Part Description:
50Ohm, 50 to 1000MHz, 10W, 6dB Directional Coupler


PackageDescription:
MINI-CIRCUITS TTT167 Case, 6 pin, 9.65mm W X 12.7mm L

Part Description:
Frequency Mixer - Level 13 (LO Power +13 dBm) 40 to 2500MHz


Part Description:
2 Way-180°, 50 Ohms, 10 to 520MHz, High Power Splitter


PackageDescription:
DFN, 3-Leads, Body 6.5 x 4mm, BOURNS TBU-CA Series


Part Description:
1.5A Dual High-Speed Power MOSFET Driver


Part Description:
Low-Voltage 16-Bit I2C and SMBus I/O Expander with Voltage Translation


Part Description:
2-Bit Bidirectional 1-MHz, I2C Bus and SMBus Voltage-Level Translator With 8-kV HBM ESD


Part Description:
Low Voltage 16-Bit I2C and SMBus Low-Power I/O Expander With Interrupt Output, Reset Pin, Configuration Registers


PackageDescription:
QFN, 0.50mm Pitch, Square; 24 Pin, 4.00mm X 4.00mm X 0.80mm H Body (w/Thermal Tab 2.55 X 2.55 mm), IPC Medium Density


Part Description:
3.3V CAN Transceivers with CAN FD (Flexible Data Rate)


PackageDescription:
MINI-CIRCUITS Case Style DB1627 - Body 4.06X3.81mm

Part Description:
50 Ohm, 5 To 1000MHz, Directional Coupler


PackageDescription:
MINI-CIRCUITS Case Style DB714 - Body 4.06X3.81mm

Part Description:
50 Ohms, 5 To 2000MHz, Directional Coupler


PackageDescription:
QFP, 0.50mm Pitch, Square; 100 Pin, 14.0mm L X 14.0mm W X 1.20mm H body, IPC Medium Density

Part Description:
Multifunctional High-End Time-to-Digital Converter (4 different operation modes, 81 ps up to 10 ps resolution)


PackageDescription:
BGA, 0.65mm Pitch, Square; 120 Pin, 13 Columns X 13 Rows, 9.00mm X 9.00mm X 1.20mm H


Part Description:
Single Supply Voltage Supervisor for 5V Systems with Programmable Time Delay


Part Description:
8-Bit Analog-to-Digital Converter With Serial Control


Part Description:
8-Bit Analog-To-Digital Converter With Serial Control


PackageDescription:
SOP, 0.635mm Pitch; 48 Pin, 7.49mm W X 15.875mm L X 2.79mm H Body, IPC Medium Density


Part Description:
Low-Power 16-Channel Constant-Current LED Sink Driver


Part Description:
1.1V Supply Voltage Supervisors With Programmable Time Delay


Part Description:
4.55V Supply Voltage Supervisors With Programmable Time Delay & Push-Pull Outputs


Part Description:
2.93V Supply Voltage Supervisors With Programmable Time Delay


Part Description:
2.7V to 5.5V, Low-Power, 12-BIT, 200 kSPS, Serial DAC With Auto Power Down


PackageDescription:
BGA, 0.80mm Pitch, Square; 257 Pin, 17 Columns X 17 Rows,14.00mm X 14.00mm X 1.45mm H


PackageDescription:
Land Pattern for BGA257 Pins ARIES A7039-118-23 Socket, 0.80mm Pitch, 17 Columns X 17 Rows, Body 14.00mm X 14.00mm X 1.45mm H

Part Description:
ASIC for Reading SIPMs (To be Mount on ARIES A7039-118-23 Socket)


Part Description:
256-tap, 100k, Single Channel Potentiometer with SPI Interface


PackageDescription:
SOT, 0.95mm Pitch; 6 Pin, 1.60mm W X 2.90mm L X 1.10mm H Body, IPC Medium Density

Part Description:
Nano-power System Timer for Power Gating


PackageDescription:
BGA, 1.00mm Pitch, Square; 196 Pin, 14 Columns X 14 Rows, 15.00mm X 15.00mm X 1.81mm H

Part Description:
Single Chip Interface Solution for PROFINET IO Devices


PackageDescription:
BGA, 0.40mm Pitch, Rect.; 6 Pin, 2 Columns X 3 rows, 0.92mm X 1.42mm X 0.50mm H

Part Description:
3.6-V, 2-A, 18.3 mOhms On-Resistance Load Switch


Part Description:
Dual Hot-Swap Power Controller with Interdependent Circuit Breaker and Power-Good Reporting


Part Description:
3V to 20V, Integrated FET Hot Swap Controller


PackageDescription:
QFN, 0.50mm Pitch, Square; 32 Pin, 5mm X 5mm X 1.00mm H Body (w/thermal tab 3.45 X 3.45mm), IPC Medium Density

Part Description:
12V/3.3V Hot Swap and ORing Controller with I2C and Load Current Monitor for AdvancedMC


PackageDescription:
SOP, 0.65mm pitch; 16 pin, 4.40mm W X 5.00mm L X 1.20mm H body (w/thermal tab 2.66mm X 2.46mm), IPC Medium Density

Part Description:
60V, 2A Industrial eFuse With Integrated Reverse Input Polarity Protection


Part Description:
1.2V UltraLow Supply-Current/Supply-Voltage Supervisory Circuits


Part Description:
3.3V UltraLow Supply-Current/Supply-Voltage Supervisory Circuits


PackageDescription:
SOP,0.65mm,pitch; 8 pin,3.00mm W X 3.00mm L X 1.10mm H body (w/thermal tab 1.57 X 1.89 mm), IPC Medium Density


Part Description:
Window Comparator for Over- and Undervoltage Detection


Part Description:
1.8V High-Accuracy, Overvoltage and Undervoltage Monitor


Part Description:
3.3V High-Accuracy, Overvoltage and Undervoltage Monitor


Part Description:
Single Voltage Detector (1.226V Threshold Voltage)


Part Description:
Adjustable Low Quiescent Current, Programmable-Delay Supervisory Circuit


Part Description:
1.2V, Low Quiescent Current, Programmable-Delay Supervisory Circuit


Part Description:
1.8V, Low Quiescent Current, Programmable-Delay Supervisory Circuit


Part Description:
2.5V, Low Quiescent Current, Programmable-Delay Supervisory Circuit


Part Description:
3.3V, Low Quiescent Current, Programmable-Delay Supervisory Circuit


Part Description:
5V, Low Quiescent Current, Programmable-Delay Supervisory Circuit


Part Description:
Quad Supply Voltage Supervisors With Programmable Delay And Watchdog Timer


Part Description:
Quad Reset Supervisor With Manual Reset Input


Part Description:
Power Management IC for Li-Ion Powered Systems


PackageDescription:
TEXAS Case Style RSL, QFN, 0.40mm Pitch, Square; 48 Pin, 6.00mm L X 6.00mm W X 1.00mm H body (w/thermal tab 4.05 X 4.05mm)

Part Description:
Single-Chip PMIC For Battery-Powered System


Part Description:
±6V/+12V, 5 Ohm, Low Ron Single SPDT CMOS Analog Switch


Part Description:
Dual Supply, Low On-State Resistance SPST CMOS Analog Switches


PackageDescription:
SOP, 0.40mm Pitch; 16 Pin, 4.40mm W X 3.60mm L X 1.20mm H Body .IPC Medium Density

Part Description:
Dual SP4T Analog Switch / Multiplexer / Demultiplexer


PackageDescription:
QFN, 0.40mm Pitch, Square, 20 Pin, 3.00mm L X 3.00mm W X 0.80mm H body (w/thermal tab)

Part Description:
High-Speed Differential Crosspoint, 1:4 , 2 Channel 1:2 Differential Multiplexer and Demultiplexer, or Fan-Out Switch


PackageDescription:
SON, TEXAS DRC (S-PVSON-N10), 0.50mm Pitch, 10-pin, 3.00mm W  X 3.00mm L X 1.00mm Height, (w/thermal tab 1.65 X 2.40 mm)

Part Description:
High-Speed USB 2.0 (480-Mbps) 1:2 Multiplexer/Demultiplexer Switch With Single Enable


Part Description:
4-Bit Bidirectional Voltage-Level Translator with Automatic Direction Sensing and ±15kV ESD Protection


Part Description:
8-Bit Bidirectional Voltage-Level Translator with Automatic Direction Sensing and ±15kV ESD Protection


PackageDescription:
SON, TEXAS RUT (R-PUQFN-N12), 0.50mm Pitch, 12-pin, 1.70mm W  X 2.00mm L X 0.55mm Height

Part Description:
4-bit Bidirectional Auto-direction Sensing Translator with Fully Symmetric 0.9V to 3.6V Range


Part Description:
2-Bit Bidirectionnal Voltage-Level Translator for Open-Drain And Push-Pull Applications


Part Description:
4-Bit Bidirectional Voltage-Level Translator For Open-Drain And Push-Pull Applications


PackageDescription:
BGA, 0.40mm Pitch, Rect, 20 Pin, 4 Columns X 5 rows, 1.55mm X 1.95mm X 0.50mm H

Part Description:
MMC, SD Card, Memory Stick™ Voltage-Translation Transceiver and LDO Voltage Regulator with ESD Protection and EMI Filtering


PackageDescription:
QFN, 0.50mm Pitch, Square; 6 Pin X 6 Pin, 4mm X 4mm Body (w/Thermal Tab 2.55 X 2.55 mm), IPC Medium Density

Part Description:
SDIO Port Expander With Voltage-Level Translation


PackageDescription:
20 Leads Ceramic Dual In-Line Package, Row Spacing 7.62mm; Pitch 2.54mm


Part Description:
5V to 40V, 1.5A Source/Sink Drive, Complementary High Speed Power Driver


Part Description:
Single-Channel High-Speed Low-Side Gate Driver With Negative Input  Voltage Capability


Part Description:
Dual 5A High-Speed Low-Side Power MOSFET Driver (Non-Inverting Inputs)


Part Description:
Dual 5A High-Speed, Low-Side Power MOSFET Driver (Non-Inverting Inputs)


Part Description:
2.5A and 5A, 35Vmax VDD FET and IGBT Single-Gate Driver


Part Description:
Programmable Maximum Duty Cycle PWM Controller


Part Description:
BiCMOS Advanced Phase-Shift PWM Controller


Part Description:
BiCMOS Low-Power Current-Mode PWM Controller


PackageDescription:
QFN, 0.50mm Pitch, Square; 64 Pin, 9.00mm L X 9.00mm W X 1.00mm H Body (4.25 X 4.25mm Thermal Tab), IPC Medium Density

Part Description:
12-Rail Power Supply Sequencer and Monitor With ACPI Support


PackageDescription:
QFP, 0.50mm Pitch, Square, 80 Pin, 12.0mm L X 12.0mm  W X 1.20mm H Body, IPC Medium Density


Part Description:
7-Channel Relay and Inductive Load Sink Driver


Part Description:
High-Voltage, High-Current Darlington Transistor Array


PackageDescription:
QFN, (MO-220-VHHD-2) 0.50mm Pitch,square; 8 pin X 8 pin, 5mm X 5mm X 1.00mm H body (w/thermal tab 3.40 X 3.40mm),  IPC Medium Density

Part Description:
Highly Integrated, Full Featured Hi-Speed USB 2.0 ULPI Transceiver


Part Description:
Data Lines Protection, 2-Input Line Filter + ESD + Vbus


PackageDescription:
SOTFL (SOT666, SOT563), 0.50mm, Pitch; 6 Pin, 1.20mm W X 1.60mm L X 0.60mm H Body, IPC Medium Density

Part Description:
2 Data-Line Protection, Very Low Capacitance ESD Protection


Part Description:
Vinculum-II Embedded Dual USB Host Controller


PackageDescription:
QFP, 0.80mm Pitch, Square; 44 Pin, 10.0mm L X 10.0mm W X 2.45mm H body, IPC Medium Density


Part Description:
PROFIBUS-DP Slave Controller With Serial Interface


PackageDescription:
BGA, 1.00mm Pitch, Rect.; 117 pin, 13 Columns X 9 Rows, 14.00mm X 10.00mm X 1.70mm H

Part Description:
Single Port 10/100/1000BASE-T PHY and 1000BASE-X PHY with SGMII, SerDes, GMII, MII, TBI, RGMII / RTBI MAC Interfaces


PackageDescription:
QFP, 0.40mm Pitch, Square; 80 Pin, 10.0mm L X 10.0mm W X 1.60mm H body, IPC Medium Density

Part Description:
iEthernet W5100 Fast SPI Ethernet Controller


Part Description:
iEthernet W5500 TCP/IP Performance and High Speed SPI Ethernet Controller


PackageDescription:
Bluetooth Wireless Communications Module MITSUMI WML-C46AHR

Part Description:
Bluetooth Wireless Communications Module With Antenna


PackageDescription:
DIP; 16 Leads; Row Spacing 7.62 mm; Pitch 2.54 mmDIP; 16 Leads; Row Spacing 7.62 mm; Pitch 2.54 mm


PackageDescription:
SOP, 0.50mm, pitch; 10 pin, 3.00mm W X 3.00mm L X 1.10mm H body (w/thermal tab  1.57 X 1.88 mm), IPC Medium Density


PackageDescription:
MINI-CIRCUITS MC1630 Case, 0.65mm pitch, 6 pin, 2mm X 2mm X 0.85mm H body (w/thermal tab 0.65 X 1.25mm)

Part Description:
DC to 18GHz,  2W, 50 Ohms, 10dB Attenuator


Part Description:
DC to 18GHz, 1.8W, 50 Ohms, 12dB Attenuator


Part Description:
DC to 18GHz, 1.6W, 50 Ohms, 15dB Attenuator


Part Description:
DC to 18GHz, 1.5W, 50 Ohms, 20dB Attenuator


Part Description:
DC to 18GHz,  2W, 50 Ohms, 3dB Attenuator


Part Description:
DC to 18GHz,  1.3W, 50 Ohms, 30dB Attenuator


Part Description:
DC to 18GHz,  2W, 50 Ohms, 4dB Attenuator


Part Description:
DC to 18GHz,  2W, 50 Ohms, 6dB Attenuator


PackageDescription:
MINI-CIRCUITS CY353 Case, Body 82.3mm L X 38.1mm W X 15.75mm H

Part Description:
High Isolation Switch, 50 Ohms SPDT, TTL Driver, Reflective DC to 5GHz


PackageDescription:
MINI-CIRCUITS CY1481 Case, Body 82.3mm L X 38.1mm W X 17.53mm H


PackageDescription:
MINI-CIRCUITS ZZ1322 Case, Body 55.37mm L X 31.75mm W X 19.3mm H

Part Description:
Absorptive SPDT Solid State RF Switch, 500 to 6000MHz, With Bracket


# Bonding

Part Description:
5 Gbit/s Radiation-Hard Optical Receiver


Part Description:
Ultra-Low Picoammeter, Wide Dynamic Range Current To Frequency Converter For Radiation Monitoring


# Crystals & Oscillators

PackageDescription:
PLCC, 1.27mm Pitch, Square; 20 Pin, 8.97mm L X 8.97mm W X 4.57mm H Body, IPC Medium Density

Part Description:
2 kHz–20 kHz Programmable Sinusoidal Oscillator


PackageDescription:
TSSOP, 10-Leads, Body 3.2x3.2mm (max), Pitch 0.50mm, IPC Medium Density

Part Description:
5kHz to 20MHz Multiphase Oscillator with Spread Spectrum Frequency Modulation


PackageDescription:
SOT23, 0.95mm Pitch; 6 Pin, 1.625mm W X 2.90mm L X 1.00mm H body, IPC Medium Density

Part Description:
50kHz to 10MHz Resistor Set SOT-23 Oscillator with Spread Spectrum Modulation


Part Description:
3.81Hz to 1MHz TimerBlox: Voltage-Controlled Pulse Width Modulator (PWM)


PackageDescription:
SOIC, 1.27mm Pitch; 8 Pin,  4.00mm W X 5.00mm L X 1.75mm H body, IPC Medium Density

Part Description:
5V ECL Voltage Controlled Oscillator Amplifier


PackageDescription:
SOP, 0.65mm Pitch; 8 Pin, 3.00mm W X 3.00mm L X 1.10mm H body, IPC Medium Density


PackageDescription:
Oscillator Si514 Series, 6 pins, 3.2x5mm

Part Description:
0.1-170MHz 3.3V ±100ppm LVDS 0.1 to 170MHZ,  I2C Programmable XO, Si514 Series


PackageDescription:
LCC, 2.54mm Pitch, Square; 16 Pin, 12.7mm L X 12.7mm W X 4.00mm H Body, IPC Medium Density

Part Description:
Frequency Range 900 to 1200 MHz, Voltage Controlled Oscillator (VCO)


PackageDescription:
Configurable High Performance Crystal Oscillator ASGTX Series, SMD Oscillator, 6 pins, 9x7mm

Part Description:
3.3V, ±1ppm, -30°C..+70°C, LVDS Configurable High Performance Crystal Oscillator (ASGTX Series)


PackageDescription:
4 Pins, 3.2x2.5mm, Performance Plastic Package Ultra Miniature Pure Silicon Clock Oscillator, ASEMP Serie CMOS Version

Part Description:
±25ppm 15pF -40°C ..+85°C Tri-State Surface Mount CMOS Clock Oscillator (ASEMP Series)


PackageDescription:
SMD TCXO, Side Concave, 10 Pins, 5.00x7.00mm, TB Series

Part Description:
3.3V, ±1ppm, 15pF, 0 to 70°C, LVCMOS, Precision Tri-State Surface Mount VCTCXO, TB Series


PackageDescription:
Oscillator, Side Concave, 2.54mm Pitch, 6 Pins, 5.00mm L X 7.00mm W X 1.80mm H, CCLD-033 Series

Part Description:
3.3V, ± 50ppm, 0°C to +70°C, Surface Mount LVDS Clock Oscillator (CCLD-033 Series)


PackageDescription:
Oscillator, 5.08mm Pitch; 4 Pin, 14.2mm L X 9.14mm W X 5.3mm H, CVHD-950 Serie

Part Description:
3.3V, ±20ppm, 15pF, 0..70°C, CMOS Surface Mount Ultra-Low Noise Oscillator (CVHD-950 Series)


PackageDescription:
SMD Oscillator, Side Convave, 4 pins, 5.00x7.00mm SG-8002CA Serie

Part Description:
3.3V ±50ppm 15pF -40..85°C, Output Enable Function , Surface Mount Crystal Oscillator (SG-8002CA Series)


PackageDescription:
Oscillator, Side Concave, 5.08mm Pitch, 4 Pins, 5.00mm L X 7.00mm W X 1.40mm H, CFPS-73 Series

Part Description:
3.3V, ±50ppm, 15pF, 0..70°C, HCMOS Surface Mount Crystal Oscillator (CFPS-73 Series)


PackageDescription:
Oscillator, 7.62mm Pitch, 4 Pins, 12.5mm L X 19.8mm W X 5.2mm H, IQXT-100 Series

Part Description:
3.3V,  ±1ppm, 15pF, -40..85°C, HCMOS Surface Mount TCXO Temperature Compensated Crystal Oscillator (IQXT-100 Series)


PackageDescription:
Oscillator, 5 Leads, Body 27.2mm X 36.1mm, KVG Case Style BF9-IS-S-15

Part Description:
12V, -20°C to +70°C,  50 Ohm Sine Wave, Oven Controlled Crystal Oscillator OCXO


Part Description:
3.3V ±20ppm LVDS Crystal Oscillator (XO), Si531 Series


PackageDescription:
Si Time Oscillators, 4 Pin, Pitch 2.1mm, 3.2mm x 2.5mm x0.75mm

Part Description:
3.3V, ±0.1ppm, 12.5pF, 0..70°C, 3.2x2.5mm Surface Mount, High Frequency Stratum 3 MEMS VCTCXO (SiT5302 Series)


Part Description:
10-1000MHz 3.3V ±50ppm, Ultra-Low Jitter Programmable Oscillator With Internal EEPROM


Part Description:
10-160MHz 3.3V ±50ppm CMOS Any-Rate I2C Programmable XO Oscillator Si570 Series


Part Description:
10-280MHz 3.3V ±20ppm LVDS Any-Rate I2C Programmable XO Oscillator Si570 Series


Part Description:
10-280MHz 3.3V ±20ppm LVPECL, I2C Programmable VCXO Oscillator Si571 Series


Part Description:
10-810MHz 3.3V ±50ppm LVDS Any-Rate I2C Programmable XO Oscillator Si570 Series


PackageDescription:
5 Pins, 25.4mm x 22mm, SMD Oven Controlled Crystal Oscillator AICJY Series

Part Description:
CMOS 3.3V, ±10ppb, 15pF, -20°C ..+70°C, SMD Oven Controlled Crystal Oscillator (AICJY Series)


PackageDescription:
Oscillator DIP8, 4 Leads, Pitch 7.62 mm X 7.62mm; Body 12.7mm X 12.7mm

Part Description:
HCMOS/TTL 5.0V ±30ppm Oscillator (ACH Series)


PackageDescription:
SMD TCXO, Side Concave, 10 Pins, 5.00x7.00mm, D75 Series

Part Description:
3.3V, ±0.28ppm, 15pF, 0 to 70°C, LVCMOS, Precision Tri-State Surface Mount TCXO Temperature Compensated Crystal Oscillator, D75A Series


PackageDescription:
SMD VCTCXO, Side Concave, 6 Pins, 9.00x14.00mm, DOT050V Series

Part Description:
3.3V, ±0.05ppm, 15pF, 0 to 70°C, LVCMOS, Precision Surface Mount VCTCXO Temperature Compensated Crystal Oscillator, DOT050V Series


PackageDescription:
Oscillator DIP 14 Leads, Row Spacing 7.62 mm; Pitch 2.54mm

Part Description:
TTL 5.0V ±100ppm Oscillator (ECS-100 Series)


PackageDescription:
Oscillator, Side Concave, 5.08mm Pitch, 4 Pins, 5.00mm L X 7.00mm W X 1.40mm H, CFPS-72 Series

Part Description:
5V, ±50ppm, 50pF, 0..70°C, HCMOS/TTL Surface Mount Clock Oscillator (CFPS-72 Series)


Part Description:
3.3V, ±50ppm, 15pF, 0..70°C, HCMOS Surface Mount Clock Oscillator (CFPS-73 Series)


Part Description:
3.3V, ±50ppm, 50pF, -40°C to +85°C, HCMOS Surface Mount Clock Oscillator (CFPS-73 Series)


PackageDescription:
Oscillator, 5 Leads, Body 27.2mm X 36.1mm MORION Case Style MV209

Part Description:
12V, ±0.05ppm, -10..60°C, Low Noise, Double Oven Ultra Precision, Oven Controlled Crystal Oscillator OCXO


PackageDescription:
SMD Oscillator, Side Convave, 4 pins, 5.00x7.00mm 7W Serie

Part Description:
3.3V, ±25ppm, 30pF, -10 to 70°C, CMOS SMD Oscillator, Tight Stability (7W Series)


PackageDescription:
Onyx IV Crystal Oscillator, 5 Leads, Body 25.4mm X 25.4mm


PackageDescription:
SMD Oscillator, side convave, 4 pins, 5.00x7.00mm

Part Description:
HCMOS 3.3V ±20ppm 15pF -20°C ..+70°C Tri-State With Power Down Surface Mount HCMOS Clock Oscillator (ASV Series)


PackageDescription:
SMD Oscillator, Side Convave, 4 pins, 5x3.2mm FXO-HC52 Series

Part Description:
2.5V, ±50ppm, 15pF, -40 to 85°C Tri-State HCMOS Surface Mount Oscillator, FXO-HC52 Series


PackageDescription:
SMD Oscillator, Side Convave, 6 Pins, 5.00x7.00mm FXO-HC73 Serie

Part Description:
3.3V, ±50ppm, -40..85°C, XTREMELY Low Jitter HCMOS Oscillator with Tri-State Output, FXO-HC73 Series


PackageDescription:
SMD Oscillator, Side Convave, 6 pins, 5x7mm, Case 848AB-01

Part Description:
3.3V, ±50ppm, 7x5mm Surface Mount LVDS Voltage Controlled Oscillator VCXO, NBVSP Series


Part Description:
2.5V ±25ppm LVDS Crystal Oscillator (XO), Si510 Series


PackageDescription:
SiT3821 Oscillators Series, Version 7mmx5mm, Pitch 2.54mm; 6 Pin

Part Description:
3.3V, ±10ppm, -20..70°C, 7x5mm Surface Mount LVPECL High Performance Differential VCXO (SiT3821 Series)


PackageDescription:
Oscillator, J-lead; 5.08mm pitch; 4 pin, 14mm L X 8.65mm W X 4.70mm H, EPSON SG-8002JA Series

Part Description:
5V ±50ppm, 15pF  -20..70°C Surface Mount Crystal Oscillator (SG-8002JA Series)


PackageDescription:
SMD Oscillator, 10 Pins, 5x7x1.85mm CD10 Package

Part Description:
2.5V ±50ppm  Quad Default Frequency 187.5MHz, 150MHz, 300MHz, 300MHz, -40°C to +85°C, 5.5pF, LVDS Crystal Oscillator (XO)


PackageDescription:
CRYSTEK CVC055CL Case, 2.54mm pitch; 12 pins, Body 12.7mm W X 12.7mm L X 3.91mm H

Part Description:
150 to 200MHz, Voltage Controlled Oscillator (VCO)


Part Description:
3.3V ±20ppm LVDS Crystal Oscillator (XO), Si530 Series


PackageDescription:
SMD Oscillator, Side Convave, 6 pins, 5.00x7.00mm BJ Series

Part Description:
3.3V, ±50ppm, -40..85°C, 7x5mm Surface Mount LVPECL Voltage Controlled Oscillator VCXO (BJ Series)


PackageDescription:
SOIC 8, Pitch 1.27mm - Body 4x5mm, IPC Medium Density

Part Description:
16.2K-133.3MHZ, 5V, I2C Programmable Oscillator, DS1077 Series


Part Description:
TTL 5.0V ±100ppm Oscillator (F1100ELF Series)


PackageDescription:
SMD Oscillator, Side Convave, 4 pins, 5.00x7.00mm, VX3 Serie

Part Description:
3.3V, ±50ppm, 30pF, -10 to 70°C Tri-State Surface Mount Oscillator, VX3(3.3V) Tristate Function Series


PackageDescription:
Oscillator, 2.54mm pitch; 12 pins, Body 12.7mm W X 12.7mm L X 3.91mm H, CRYSTEK CVC055CX Case

Part Description:
1GHz, Voltage Controlled Oscillator (VCO)


PackageDescription:
Oscillator, 5.08mm Pitch; 4 Pin, 14.2mm L X 9.14mm W X 5.33mm H, CVCSO-914 Series

Part Description:
5V, ±100ppm, -20..70°C, Surface Mount Ultra-Low Phase Noise, True SineWave SAW VCSO (CVCSO-914 Series)


PackageDescription:
Oscillator, Corner Concave; 4 pin, 2.50mm L X 2.00mm W X 0.90mm H, EPSON SG-210STF Series

Part Description:
1.6V to 3.6V, ±50ppm, 15pF, -40 to 85°C, Stanby Function, Surface Mount CMOS Crystal Oscillator (SG-210STF Series)


Part Description:
5V ±100ppm 15pF -40..85°C, Output Enable Function , Surface Mount Crystal Oscillator (SG-8002CA Series)


PackageDescription:
4 Pins, 5x3.2mm, Performance Plastic Package Ultra Miniature Pure Silicon Clock Oscillator, ASFLMPC Series, CMOS Version

Part Description:
3.3V, ±25ppm, -20°C..+70°C Tri-State Surface Mount CMOS Clock Oscillator, ASFLMP Series


PackageDescription:
SMD Oscillator, side concave, 6 pins, 5.00x7.00mm, Pitch 2.54mm, EPSON EG-2102CA Serie

Part Description:
3.3V ±50ppm 0 to 70°C surface Mount Crystal Oscillator (EG-2102CA Series)


PackageDescription:
SMD Oscillator, side concave, 6 pins, 5.00x7.00mm, Pitch 2.54mm, EPSON EG-2121CA Serie

Part Description:
2.5V ±50ppm 0 to 70°C surface Mount Crystal Oscillator (EG-2121CA Series)


PackageDescription:
SiT9120 Oscillators Series, Version 7mmx5mm, Pitch 2.54mm; 6 Pin

Part Description:
2.5V, ±50ppm, -40..85°C, 7x5mm Surface Mount LVDS Differential Oscillator (SiT9120 Series)


PackageDescription:
Oscillator DIP8, 4 Leads, Pitch 7.62 mm X 7.62mm; Body 13.2mm X 13.2mm

Part Description:
Frequency Stability ±25ppm, 0..70°C, 5V HCMOS/TTL Clock Oscillator (IQXO-22 Series)


PackageDescription:
Oscillator, Corner Concave, 4.50mm Pitch, 4 Pins, 3.20mm L X 5.00mm W X 1.80mm H, CFPT-9301 Series

Part Description:
3.3V,  ±1ppm, 15pF, -40..85°C, HCMOS Surface Mount TCVCXO Temperature Compensated Voltage Controlled Oscillator (CFPT-9301 Series)


Part Description:
5V, ±50ppm, 50pF, 0..70°C, HCMOS Surface Mount Clock Oscillator (CFPS-72 Series)


Part Description:
3.3V, ±50ppm, 50pF, 0..70°C, HCMOS Surface Mount Clock Oscillator (CFPS-73 Series)


PackageDescription:
Oscillator, Side Concave, 5.08mm Pitch, 4 Pins, 5.00mm L X 7.00mm W X 2.00mm H, CFPT-126 Series

Part Description:
3.3V, ±0.5ppm, 15pF, -40..85°C HCMOS Surface Mount, TCVCXO Temperature Compensated Voltage Controlled Oscillator (CFPT-126 Series)


PackageDescription:
Oscillator, Corner Concave, 3.80mm Pitch, 4 Pins, 3.20mm L X 5.00mm W X 1.10mm H, CFPT-141 Series

Part Description:
3V, ±2.5ppm, 10pF, -30..85°C, Cliped Sine Wave Surface Mount, TCVCXO Temperature Compensated Voltage Controlled Oscillator (CFPT-141 Series)


PackageDescription:
Oscillator, Side Concave, 2.54mm Pitch, 6 Pins, 5.00mm L X 7.00mm W X 1.70mm H, CFPV-45 Series

Part Description:
3.3V, ±100ppm, 15pF, 0..70°C, HCMOS Tri-State Surface Mount, VCXO Voltage Controlled Oscillator (CFPV-45 Series)


PackageDescription:
Oscillator KT7050A Series, 10 pins, 5x7mm

Part Description:
3.3V, ± 0.28ppm, -40°C ..+85°C, Temperature Compensated Crystal Oscillator (TCXO)


PackageDescription:
SMD Oscillator, Corner Convave, 4 pins, 5x3.2mm

Part Description:
3V ±2.5ppm -30 to 75° Voltage Controlled Temperature Compensated Crystal Oscillator VM53S3 Series


PackageDescription:
Oscillator IVT3200C Serie, corner concave; 4 pin, 2.50mm L X 3.2mm W X 1.1mm H

Part Description:
11pF 3.3V ±1ppm Surface Mount TCXO Voltage Controlled Oscillator (IT3200C Series)


PackageDescription:
SMD Oscillator, 4 pins, 5 x 3.2mm, 7C Serie

Part Description:
CMOS 30pF 3.3V ±25ppm -10 to 75° SMD Oscillator (7C Series)


PackageDescription:
Oscillator, Corner Concave, 2.20mm Pitch, 4 Pins, 2.70mm L X 3.40mm W X 1.20mm H, CFPS-39 Series

Part Description:
3.3V, ±50ppm, 15pF, -40 to 85°C CMOS Surface Mount Clock Oscillator (CFPS-39 Series)


PackageDescription:
MICREL SMD Oscillator, QFN, 4 pins, 2.5mm x 2.0mm

Part Description:
1.8V-3.3V, ±50ppm, 15pF,-40..85°C, HCMOS/TTL Surface Mount Low-Power Precision CMOS Oscillator (DSC1001 Series)


Part Description:
1.8V-3.3V, ±10ppm, 15pF,-40..85°C, HCMOS/TTL Surface Mount Low-Power Precision CMOS Oscillator (DSC1001 Series)


PackageDescription:
Voltage Controlled Temperature Compensated Crystal Oscillator ASVTX-11  Series, SMD Oscillator, 4 pins, 3.2x2.5mm

Part Description:
3V ±2.5ppm Voltage Controlled Temperature Compensated Crystal Oscillator (ASVTX-11  Series)


Part Description:
3.3V, ±0.5ppm, 15pF, 0 to 70°C, LVCMOS, Precision Tri-State Surface Mount TCXO Temperature Compensated Crystal Oscillator, D75F Series


PackageDescription:
SMD VCTCXO, Side Concave, 10 Pins, 5.00x7.00mm, T Series

Part Description:
3.3V, ±0.28ppm, 15pF, -40°C to 85°C, LVCMOS,  Precision Tri-State Surface Mount VCTCXO, T Series


PackageDescription:
SMD Oscillator, 4 pins, 5 x 3.2mm, ECS-3525 Series

Part Description:
1.8V, ±50ppm, 15pF, -0 to 70°C, Surface Mount Clock Oscillator (ECS-3518/3525 Series)


Part Description:
2.5V, ±50ppm, 15pF, -0 to 70°C, Surface Mount Clock Oscillator (ECS-3518/3525 Series)


Part Description:
3.3V, ±50ppm, 15pF, -40 to 85°C, CMOS Surface Mount Clock Oscillator (CFPS-39 Series)


Part Description:
3V ±2.5ppm Voltage Controlled Temperature Compensated Crystal Oscillator VM53S3 Series


Part Description:
1.8V-3.3V, ±10ppm, 15pF,-40..105°C, HCMOS/TTL Surface Mount Low-Power Precision CMOS Oscillator (DSC1001 Series)


Part Description:
3V3 ±100ppm 50pF  Tri-State Surface Mount MOS Clock Oscillator (OT7 Series)


Part Description:
5V ±100ppm 50pF  Tri-State Surface Mount MOS Clock Oscillator (OT7 Series)


Part Description:
3.3V, ±25ppm, 15pF, -20..70°C, Surface Mount Crystal Oscillator


PackageDescription:
SMD Oscillator, side convave, 6 pins, 5.00x7.00mm

Part Description:
3.3V, ±25ppm, 15pF, -20..70°C,CMOS Ethernet VCXO


PackageDescription:
Oscillator, corner concave; 4 pin, 2.50mm L X 2.00mm W X 0.90mm H, IPC Medium Density

Part Description:
1.8V Surface Mount Crystal Oscillator With Standby Function (SG-210 Series)


PackageDescription:
Oscillator, J-lead; 5.08mm pitch; 4 pin, 14mm L X 8.65mm W X 4.70mm H

Part Description:
5V ±100ppm, 40pF  -20..70°C Surface Mount Crystal Oscillator (SG-615 Series)


PackageDescription:
Oscillator,side concave;5.08mm pitch;4 pin,5.00mm L X 7.00mm W X 1.40mm H, IPC Medium Density

Part Description:
CMOS 3.3V ±25ppm Real Time Oscillator (S7-32.768 KHz Series)


PackageDescription:
VSOJ, 0.65mm Pitch, 20 Pin, 7.00mm L X 5.4mm W X 1.5mm H Body

Part Description:
Low Current Consumption I2C-Bus Interface Real Time Clock Module (RTC - 8564 Series)


PackageDescription:
Oscillator, J-lead; 5.08mm pitch; 4 pin, 10.5mm L X 5.0mm W X 2.7mm H, EPSON SG-3030JC Series

Part Description:
3.3V, -120ppm/+10ppm , 15pF, -40..85°C, CMOS Surface Mount Crystal Oscillator SPXO, (SG-3030JC Series)


Part Description:
3.3V, ±0.5ppm, 15pF, -40..85°C, HCMOS Surface Mount, TCVCXO Temperature Compensated Voltage Controlled  Oscillator (CFPT-126 Series)


Part Description:
3.3V, ±100ppm, 15pF,  0..70°C, HCMOS Tri-State Surface Mount, VCXO Voltage Controlled Oscillator (CFPV-45 Series)


PackageDescription:
Oscillator, Side Concave; 5.08mm Pitch; 4 Pins, 5.00mm L X 7.00mm W X 1.40mm H, CFPS-32 Series

Part Description:
2.5V, ±50ppm, 15pF, -40 to 85°C, CMOS Surface Mount Clock Oscillator (CFPS-32 Series)


PackageDescription:
Oscillator, Side Concave, 2.54mm Pitch, 6 Pins, 5.00mm L X 7.00mm W X 1.70mm H CFPV-45 Series


Part Description:
1.8V, ±50ppm, 15pF, -20..70°C, 3.2x2.5mm Surface Mount LVCMOS/HCMOS Low Power Frequency Oscillator (SiT1602 Series)


Part Description:
3.3V, ±25ppm, -40..85°C, XTREMELY Low Jitter HCMOS Oscillator with Tri-State Output, FXO-HC73 Series

Status Comment:
Can be replaced by XLH736033.333000I from IDT


PackageDescription:
SMD Oscillator, Side Convave, 6 Pins, 5.00x7.00mm IDT XLH Series

Part Description:
3.3V, ±25ppm, -40 to +85°C, HCMOS Crystal Oscillator with Tri-State Output, XLH Series


Part Description:
3.3V, ±50ppm, 30pF, -10 to 70°C, CMOS SMD Oscillator (7W Series)


PackageDescription:
Oscillator, side concave; 2.54mm pitch; 4 pin, 3.20mm L X 5.00mm W X 1.10mm H, IPC Medium Density

Part Description:
5.0x3.2mm 3.3V ±50ppm Low Current SMD Oscillator (671 Series)


Part Description:
3.3V, ±20ppm, 50pF, -20..70°C, HCMOS Surface Mount Clock Oscillator (CFPS-73 Series)


Part Description:
3.3V, ±0.5ppm, 15pF, -40..85°C, HCMOS Surface Mount, TCVCXO Temperature Compensated Voltage Controlled  Ocillator (CFPT-126 Series)


Part Description:
HCCMOS 15pF 3.3V ±0.9ppm Surface Mount TCXO Voltage Controlled Oscillator (CFPT-125 Serie)


PackageDescription:
SMD Oscillator, Corner Convave, 4 pins, 5x3mm

Part Description:
HCCMOS 15pF 3.3V ±1ppm Surface Mount TCXO Voltage Controlled Oscillator (CFPT-9300 Series)


PackageDescription:
RFPO40 Case, SMD Oscillator, 4 pins, Body 9.7x7.5mm

Part Description:
3.3V, ±10ppb, -20..70°C, HCMOS Oven Controlled Crystal Oscillator with VCO, RFPO40 Series


Part Description:
40MHz 2.5V ±50ppm LVDS Crystal Oscillator (XO), Si510 Series


PackageDescription:
SMD Oscillator, 4 pins, 3.2 x 2.5mm, 7Q Series

Part Description:
1.8V ±2.0ppm (-30..85°C) SMD Temperatured Compensated Crystal Oscillator (7Q Seriess)


Part Description:
3.3V, ±50ppm, 15pF, -40..85°C, CMOS Surface Mount Clock Oscillator (CFPS-39 Series)


PackageDescription:
VCO, 5.08mm Pitch; 4 Pin, 5.08mm L X 7.5mm W X 2.5mm H

Part Description:
3.3V, Stability: +100ppm -150ppm, -20..70°C, Surface Mount True SineWave SAW Based VCSO


PackageDescription:
Oscillator, Side Concave; 2.54mm Pitch; 4 pin, 3.20mm L X 5.00mm W X 1.30mm H, IPC Medium Density

Part Description:
3.3V, ±50ppm, 30pF, -40..85°C, HCMOS/TTL Clock Oscillator, 636 Series


PackageDescription:
Oscillator, Corner Concave; 4 pin, 3.2mm L X 2.5mm W X 1.2mm H

Part Description:
3.3V ±100ppm 15pF -40..85°C Stanby Function , Surface Mount Crystal Oscillator (SG-310 Series)


PackageDescription:
Oscillator, Side Concave, 2.54mm Pitch, 4 Pins, 3.20mm L X 5.00mm W X 1.00mm H, CFPS-69 Series

Part Description:
3.3V, ±50ppm,  -40..85°C, CMOS Surface Mount Clock Oscillator, Low Current (CFPS-69 Series)


Part Description:
5V, ±100ppm, 15pF, -40..85°C Tri-State Surface Mount Oscillator (VX3 5.0V Series)


Part Description:
3.3V, ±30ppm, 15pF, -20..70°C, Surface Mount Crystal Oscillator


Part Description:
5V ±100ppm, 50pF, -20..70°C Surface Mount Crystal Oscillator (SG-615 Series)


PackageDescription:
Oscillator, side concave; 2.54mm pitch; 6 pin, 5.00mm L X 7.00mm W X 1.90mm H, IPC Medium Density

Part Description:
Stability: ± 35ppm, -40°C to +85°C, Programmable - High Performance SMD XO, LVDS Output, ASG-D Series


PackageDescription:
Oscillator,side concave; 1.27mm pitch; 6 pin,3.35mm L X 5.15mm W X 1.40mm H, IPC Medium Density

Part Description:
3.3V, ±25ppm, -40..85°C, LVDS Surface Mount Crystal Oscillator (FXO-LC53 Series)


PackageDescription:
Oscillator, 5.08mm Pitch; 4 Pin, 5.08mm L X 7.5mm W X 2.5mm H, CCHD-575 Serie

Part Description:
3.3V, ±20ppm, 15pF, -40..85°C, LVCMOS/LVTTL/HCMOS Surface Mount Clock Oscillator (SiT5003 Series)


Part Description:
3.3V, ±50ppm, 30pF, 0..70°C, HCMOS Surface Mount Clock Oscillator (CFPS-73 Series)


PackageDescription:
SiT5003AC Oscillator, Version 5.08mm Pitch; 4 Pin, 5.00mm L X 7.00mm W X 1mm H

Part Description:
2.5V, ±0.5ppm, 15pF, -20..70°C, LVCMOS/LVTTL/HCMOS Surface Mount Clock Oscillator (SiT5003 Series)


PackageDescription:
MINI-CIRCUITS CK1113 Case, 2.54mm pitch; 12 pins, Body 12.7mm W X 12.7mm X L 5.59 H

Part Description:
Ultra Low Noise 1000 MHz Voltage Controlled Oscillator (VCO)


PackageDescription:
MINI-CIRCUITS CK605 Case, 2.54mm pitch; 12 pins, Body 12.7mm W X 12.7mm L X 4.57mm H

Part Description:
Wide Band 1900 to 3700 MHz Voltage Controlled Oscillator (VCO)


PackageDescription:
4 Pins,  6mm L X 3.5mm H, SMD Low Profile Crystal, ABMM2 Serie

Part Description:
Tolerance: ±20ppm, -20°C to +70°C, 18pF, SMD Crystal, ABMM2 Series


PackageDescription:
HC49/4H SMX Case, SMD Cristal, Body 11.6x4.9mm

Part Description:
Tolerance:± 30ppm, Stability:± 50ppm, -10°C to +60°C, 16pF, Surface Mount Quartz Crystal, HC49/4HSMX Series


PackageDescription:
JAUCH SMU5 Crystal; 13.1mm L X 5mm W X 5.1mm H

Part Description:
Load capacitance 30pF, Stability (at 25 C) ± 30 ppm, Stability (at -20C to +70C) ± 50ppm, Surface Mount Quartz Crystal, SMU5 Series


PackageDescription:
4 Pins, SMD Crystal, Body 3.2x2.5mm, ABM8 Series

Part Description:
Tolerance: ± 20ppm, Stability: ± 50ppm, -40°C to +85°C, 18pF, Ceramic SMD Crystal, ABM8-166 Series


PackageDescription:
4 Pins, 2.5x3.2mm, SMD Sealing Crystal, CS Series

Part Description:
±100ppm 18pF -40°C to +85°C  4 Pins, 3.2x2.5X0.8mm, SMD Crystal Unit, CS-018 Series


Part Description:
±20ppm 18pF -40°C to +85°C  4 Pins, 3.2x2.5X0.8mm, SMD Crystal Unit, CS-018 Series


PackageDescription:
SMD Crystal Kyocera, 4 Pin, 3.2mm L X 2.5mm W X 1mm H

Part Description:
±50ppm, 15pF, Supply Voltage 3.3V, -40°C to +85°C, Surface Mount Clock Oscillator, KC3225A-C3 Series


Part Description:
Tolerance:± 20ppm, Stability:± 50ppm, -20°C to +70°C, 18pF, Ceramic SMD Crystal, ABM3B Series


PackageDescription:
2 Pins, 3.2x5mm, SMD Glass Seam Sealing Crystal, 7A Serie

Part Description:
Tolerance: ±30ppm, Stability: ±30ppm, -20°C to +70°C, 18pF, SMD Glass Seam Sealing Crystal, 7A Series


PackageDescription:
4 Pins, 2.5x3.2mm, SMD Sealing Crystal, 7M Serie

Part Description:
±30ppm 18pF -20°C to +70°C  4 Pins, 3.2x2.5X0.8mm, SMD Sealing Crystal, 7M Series


PackageDescription:
2 Pins, 8x3.7mm, Inverted Mesa AT-Cut Crystal

Part Description:
Tolerance: ± 18ppm, 0°C to +60°C, 5.5pF,  Surface Mount Inverted Mesa AT-Cut Crystal , CC1F-T1A Series


PackageDescription:
Oscillator FA-20H Series, Corner Concave; 4 pin, 2mm L X 2.5mm W X 0.55mm H

Part Description:
Tolerance: ±10ppm, Stability: ±12ppm, -20°C to +75°C, 9pF, SMD Crystal, FA-20H Series


Part Description:
Tolerance: ± 30ppm, Stability: ± 50ppm, -10°C to +60°C, 16pF, Surface Mount Quartz Crystal, HC49/4HSMX Series


Part Description:
Tolerance: ± 20ppm, Stability: ± 50ppm, -20°C to +70°C, 18pF, Ceramic SMD Crystal, ABM3B Series


PackageDescription:
HC-49/U Leaded Cristal, Body 11.05x4.8mm; Pitch 4.88mm

Part Description:
±30ppm Quartz Crystal Resonator, HC-49/U Type


PackageDescription:
CITIZEN HCM49 Case, SMD Cristal, Body 11.4 x 4.7mm

Part Description:
Tolerance:± 30ppm, Stability: ± 50ppm, -10°C to +60°C, 18pF, AT-CUT Crystal Unit, HCM49 Series


PackageDescription:
Crystal TSX-3225 Serie, Corner Concave; 4 pin, 2.50mm L X 3.2mm W X 0.6mm H

Part Description:
Tolerance ±10 ppm,  Stability:± 15ppm, -40°C to 85°C, 9pF, Surface Mount Quartz Crystal, TX-3225 Series


PackageDescription:
4 Pins, 2.5x3.2mm, SMD Sealing Crystal, PERICOM FL Series

Part Description:
Tolerance: ±30ppm, Stability: ±30ppm, -20°C to +70°C, 18pF, SMD Seam Sealing Crystal, FL Series


PackageDescription:
EPSON Crystal; 12.7mm L X 5.08mm W X 4.6mm H

Part Description:
Tolerance:± 50ppm, Stability: ± 30ppm, -20°C to +70°C, 18pF, Surface Mount Quartz Crystal, MA-506 Series


PackageDescription:
SMD Crystal, Body 11.40mm L X 4.70mm W X 4.20mm H, HC/49US (AT49) ALBS Series

Part Description:
Tolerance: ± 20ppm, Stability: ± 50ppm, -20°C to +70°C, 18pF, 40 Ohms ESR, Low Profile Surface Mount Microprocessor Crystal, ABLS Series


Part Description:
Tolerance ±10 ppm,  Stability:± 10ppm, -20°C to 75°C, 9pF, Surface Mount Quartz Crystal, TX-3225 Series


PackageDescription:
4 Pins, SMD Crystal, Body 2.5x3.2mm, NX3225GA Series

Part Description:
Tolerance: ± 20ppm, Stability: ± 30ppm, -40°C to +85°C, 8pF, 50 Ohms ESR, Automotive Quartz Crystal, NX3225GA Series


PackageDescription:
4 Pins, 2x1.6X0.5mm, SMD Seam Sealing Crystal, 8Y Serie

Part Description:
±30ppm 18pF -20°C to +70°C  4 Pins, 2x1.6X0.5mm, SMD Seam Sealing Crystal, 8Y Serie


PackageDescription:
Oscillator FA-238 Series, Corner Concave; 4 pin, 2.50mm L X 3.2mm W X 0.7mm H

Part Description:
Tolerance: ±50ppm, Stability: ±30ppm, -20°C to +70°C, 18pF, SMD Crystal, FA-238 Series


PackageDescription:
4 Pins, SMD Crystal, Body 5x3.2mm, ABM3 Series

Part Description:
Tolerance: ± 20ppm, Stability: ± 50ppm, -20°C to +70°C, 18pF, Ceramic SMD Crystal, ABM3 Series


PackageDescription:
2 Pins, 1.4 x 5.2 x 1.4mm , SMD Crystal, MS3V-T1R Serie

Part Description:
Tolerance: ± 20ppm, -40°C to +85°C, 12.5pF,  Surface Mount Crystal, MS3V-T1R Series


PackageDescription:
2 Pins, 2.15x1.3mm, SMD Low Profile Crystal, ABS06 Series

Part Description:
Tolerance: ±20ppm, -40°C to +85°C, 9pF, SMD Low Profile Crystal, ABS06 Series


Part Description:
Tolerance: ±20ppm, -40°C to +85°C, 12.5pF, SMD Low Profile Crystal, ABS06 Series


PackageDescription:
2 Pins, 4.1x1.5mm, SMD Low Profile Crystal, ABS09 Serie

Part Description:
Tolerance: ±20ppm, Stability: ±5ppm, -40°C to +85°C, 12.5pF, SMD Low Profile Crystal, ABS09 Series


PackageDescription:
4 Pins, 8mm L X 3.8mm W X 2.7mm H, SMD Crystal, ABS25 Serie

Part Description:
Tolerance: ±20ppm, -40°C to +85°C, 12.5pF, SMD Crystal, ABS25 Series


PackageDescription:
EPSON Crystal; 10.41mm L X 4.06mm W X 3.6mm H

Part Description:
Load capacitance 12.5pF, Frequency Tolerance ±20 ppm, 40°C to 85°C, Surface Mount Quartz Crystal, MC-406 Series


PackageDescription:
8 Pins, 3.2 x 1.5 x 0.8mm, SMD Crystal, I2C

Part Description:
Tolerance: ± 20ppm, Temp Compensated ±3 ppm -40°C to +85°C, Surface Mount Crystal Chip


Part Description:
Tolerance: ± 30ppm, Stability: ± 50ppm, -10°C to +70°C, 16pF, Surface Mount Quartz Crystal, HC49/4HSMX Series


PackageDescription:
ZTB Serie Leaded Ceramic Resonator, Body L 7.9 x W 3.6mm H 9.3, Pitch 5mm

Part Description:
Tolerance: ± 2kHz, Stability: ± 0.3%, -20°C to +80°C, 120pF Radial Lead Ceramic Resonator ZTB Series


Part Description:
Tolerance: ± 30ppm, Stability: ± 50ppm, -10°C to +66°C, 18pF, Surface Mount Quartz Crystal, HC49/4HSMX Series


PackageDescription:
SMD Crystal Kyocera, 4 Pin, 3.2mm L X 2.5mm W X 0.6mm H

Part Description:
Tolerance: ±10ppm,  Stability: ±15ppm, 8pF, -40°C to +85°C, Surface Mount Crystal


Part Description:
±30ppm 8pF -40°C to +85°C  4 Pins, 3.2x2.5X0.8mm, SMD Sealing Crystal, 7M Series


Part Description:
Tolerance: ±10ppm, Stability: ±15ppm, 8pF, -40°C to +85°C, Surface Mount Crystal


PackageDescription:
SMD Crystal, 3 Pins, Body 11.40mm L X 4.70mm W X 4.20mm H, HC/49US (AT49) ALBSG Series

Part Description:
Tolerance: ± 20ppm, Stability: ± 30ppm, -40°C to +80°C, 18pF, 3 Leads Case-Grounded SMD Low Profile Crystal, ABLSG Series


PackageDescription:
HC-49/U-S Leaded Cristal, Body 11.5x4.66mm; Pitch 4.88mm

Part Description:
Tolerance: ± 30ppm, Stability: ± 50ppm, -10°C to +60°C, 18pF, Quartz Crystal, HC-49/U-S Series


Part Description:
Tolerance: ± 20ppm, Stability: ± 50ppm, -10°C to +70°C, 16pF, Surface Mount Quartz Crystal, HC49/4HSMX Series


Part Description:
Tolerance: ± 20ppm, Stability: ± 50ppm, -20°C to +70°C, 18pF, 80 Ohms ESR, Low Profile Surface Mount Microprocessor Crystal, ABLS Series


PackageDescription:
DFN Case Style, Cristal, Body 3.5x2.5mm, CC6F-T1A Serie

Part Description:
Tolerance: ± 18ppm, -40°C to +85°C, 18pF,  Surface Mount Inverted Mesa AT Crystal, CC6F-T1A Series


Part Description:
Tolerance: ±30ppm, Stability: ±30ppm, -20°C to +70°C, 12pF, SMD Glass Seam Sealing Crystal, 7A Series


# DC-DC Converters

PackageDescription:
ULTRAVOLT AA Series, DC-DC Converter, with 'Eared' Heat Sink Plate and I5 Interface, Body 75.4x38.1mm

Part Description:
23-30VDC to 500VDC, 30W High Voltage DC-DC Converter, with Heat Sink Plate and Enhanced Interface 5V


PackageDescription:
ULTRAVOLT C Series, DC-DC Converter, Body 94x38.1mm

Part Description:
23-30VDC to 500VDC, 20W High Voltage Cap-Charging Supply DC-DC Converter


Part Description:
23-30VDC to 250VDC, 20W High Voltage DC-DC Converter, with Heat Sink Plate and Enhanced Interface 5V


PackageDescription:
A Series Single Output, THD DC/DC Converter,  Body 12.7x12.7mm

Part Description:
12VDC to 48VDC, Iout (max) 26mA, 1.25W High Reliability and Ultra-Miniature, Low Profile DC-DC Converter


PackageDescription:
SA Series Single Output, THD DC/DC Converter,  Body 19.05x13.97mm

Part Description:
12VDC to 100VDC, Iout (max) 30mA, 3W High Voltage Isolated  Ultra-Compact, Low Profile DC-DC Converter


PackageDescription:
SMV Series Dual Output, SMD DC/DC Converter,  Body 12.7x12.7mm

Part Description:
24VDC to ±150VDC, Iout (max) ±4.17mA, 0.625W Unregulated High Voltage Isolated DC-DC Converter


Part Description:
23-30VDC to 4000VDC, 30W High Voltage Cap-Charging Supply DC-DC Converter


Part Description:
5V to 2x 5V, 1W DC-DC Converter, Dual Isolated Outputs, Input to Output Isolated


Part Description:
5V to ±5V, 1W DC-DC Converter, Dual Outputs, Input to Output Isolated


Part Description:
5V to 5V, 1W DC-DC Converter, Single Output, Input to Output Isolated


Part Description:
5V to 2x 12V, 1W DC-DC Converter, Dual Isolated Outputs, Input to Output Isolated


Part Description:
5V to ±12V, 1W DC-DC Converter, Dual Outputs, Input to Output Isolated


Part Description:
5V to 12V, 1W DC-DC Converter, Single Output, Input to Output Isolated


Part Description:
5V to 2x 15V, 1W DC-DC Converter, Dual Isolated Outputs, Input to Output Isolated


Part Description:
5V to ±15V, 1W DC-DC Converter, Dual Outputs, Input to Output Isolated


Part Description:
5V to 15V, 1W DC-DC Converter, Single Output, Input to Output Isolated


Part Description:
5V to ±15V, 6W DC-DC Converter, Dual Outputs, Input to Output Isolated


PackageDescription:
AEE 15W Series, Dual Output DCDC Converter, Body 50.8x25.4mm, Height 11.3mm

Part Description:
18-375VDC to ±15VDC, Iout (max) ±0.5A, 15W DC-DC Converter


PackageDescription:
ADP Series, Body 25.5x20.5mm, high voltage DC-DC converter

Part Description:
5V to -200V, Utra Compact, Regulated, High Voltage DC-DC Converter


PackageDescription:
C Series, Body 35.56 x 27.94mm, High Voltage DC-DC Converter

Part Description:
11.5-16VDC to 0-600VDC, 0 to 1.67mA, High Voltage DC-DC Converter, C Series


PackageDescription:
CCP-E Series, Body L 38.4mm x W 29.6mm x H 6.8mm

Part Description:
24V to 5V, Iout (max) 3A, 15W DC-DC Converter


Part Description:
24V to 12V, Iout (max) 1.25A, 15W DC-DC Converter


PackageDescription:
DIP; 14 - 7 Leads; Row Spacing 7.62 mm; Pitch 2.54 mm

Part Description:
5VDC to ±15VDC, Iout (max) 133mA, 2W, Isolated, Unregulated DC/DC converter Modules


PackageDescription:
DE Series, Body 63.5x44mm, high voltage DC-DC converter

Part Description:
24V to -6kV, Utra Compact, Regulated, High Voltage DC-DC Converter


Part Description:
24V to 6kV, Utra Compact, Regulated, High Voltage DC-DC Converter


PackageDescription:
E Series, Single Output DC/DC Converter, Body W 38.1mm x L 63.5mm x H 21.6mm

Part Description:
0-12VDC to 1.5kVDC, Iout (max) 2mA, 3W DC-DC Converter


Part Description:
12V to 0-3kV, Iout 3.33mA, 10W DC To HV DC Converters


PackageDescription:
G Series, Body W 38.1 x L 38.1mm x H 16mm, Single Output DC/DC Converter

Part Description:
0 to 400VDC Input, 0 to ±200V (3.75mA) Output, 1.5W, Isolated, Proportional DC HV DC converter


PackageDescription:
HB04UC Series, Body 50.8x25.4mm, Height 10.4mm

Part Description:
15V to 15V, Iout (max) 267mA, 4W Unregulated High Isolation DC-DC Converter


PackageDescription:
TDK, i6A Series, Non-isolated DC-DC Converter (Negative Logic ON/OFF Option), Body 33x22.9mm

Part Description:
I6a Series, 250W, 9-40V Input, 3.3 to 24V Output, Non-isolated DC-DC Converter


PackageDescription:
INNOTEC, DC-DC Converter, Body 99.7x49.8mm

Part Description:
23-28 VDC to 400VDC, 10W High Voltage DC-DC Converter


Part Description:
23-28 VDC to 4000VDC, 10W High Voltage DC-DC Converter


PackageDescription:
SIP-8 Package DC-DC Converter, Body 21.85x9.2mm, IU Serie

Part Description:
9-18VDC to  ±24VDC, Iout (max) 83mA, 2W DC-DC Converter


Part Description:
9-18VDC to 24VDC, Iout (max) 83mA, 2W DC-DC Converter


PackageDescription:
SIP-8 Package DC-DC Converter,Body 21.85x11.1mm, IZ Serie

Part Description:
9-18V to 5V, Iout (max) 600mA, 3W DC-DC Converter


Part Description:
4.9-9VDC to  ±15VDC, Iout (max) ±330mA, 10W DC-DC Converter


PackageDescription:
JTB03 Series, Body 31.8x20.3mm, Pitch 2.54mm

Part Description:
9-36V to 5V, Iout (max) 600mA, 3W DC-DC Converter


PackageDescription:
SON, 0.50mm Pitch; 24 pin, 4.00mm W X 7.00mm L X 0.80mm H body (w/thermal tab 2.74 X 6.53 mm), IPC Medium Density

Part Description:
Dual 3A Boost/Inverting/SEPIC DC/DC Converter with Fault Protection


PackageDescription:
LGA, 9-Pin, Body 2.3mm x2.5mm, MURATA LXDC2UR Series

Part Description:
3.6-5.5VDC to 3.3VDC, Iout (max) 600mA, Step-Down Micro DC-DC Converter


PackageDescription:
LGA, 9-Pin, Body 2.8mm x 2.6mm, MURATA LXDC2XQ Series

Part Description:
2.7-5.5VDC to 3.3V,  Iout (max) 800mA, Step-Down DC-DC Converter


PackageDescription:
LGA, 9-Pin, Body 3.2mm x 3.5mm, MURATA LXDC3EP Type F Series

Part Description:
2.5-5.5VDC to 1.8V,  Iout (max) 1A, Micro Step-Down DC-DC Converter


PackageDescription:
LGA, 14-Pin, Body 5.0mm x 5.7mm, MURATA LXDC55K Series

Part Description:
2.7-5.5VDC to 0.8-3.6VDC, Iout (max) 3A, Adjustable Step-Down Micro DC-DC Converter


PackageDescription:
MEE3 Series, Body 14.15mm x 8.15mm, SIP-4

Part Description:
12VDC to 5VDC, Iout (max) 600mA, 1kVDC Isolated, 3W DC-DC Converter


Part Description:
12VDC to 9VDC, Iout (max) 333mA, 1kVDC Isolated, 3W DC-DC Converter


Part Description:
12VDC to 15VDC, Iout (max) 200mA, 1kVDC Isolated, 3W DC-DC Converter


PackageDescription:
MEJ2 Series, Body 19.65 x 10.05mm, SIP-7

Part Description:
5VDC to 15VDC, Iout (max) 133mA, 5.2kVDC Isolated, 2W DC-DC Converter


Part Description:
15VDC to 15VDC, Iout (max) 67mA, 5.2kVDC Isolated, 2W DC-DC Converter


Part Description:
3.3VDC to 3.3VDC, Iout (max) 606mA, 5.2kVDC Isolated, 2W DC-DC Converter


Part Description:
24V to 5V, Iout (max) 200mA, 3kVDC Isolated, 1W DC-DC Converter


PackageDescription:
MEV3S Series, Body 19.65 x 7.65mm, SIP-7

Part Description:
5V to 5V, Iout (max) 600mA, 3kVDC Isolated, 3W DC-DC Converter


Part Description:
5V to 9V, Iout (max) 333mA, 3kVDC Isolated, 3W DC-DC Converter


Part Description:
5V to 15V, Iout (max) 200mA, 3kVDC Isolated, 3W DC-DC Converter


Part Description:
12V to 9V, Iout (max) 333mA, 3kVDC Isolated, 3W DC-DC Converter


Part Description:
12V to 15V, Iout (max) 200mA, 3kVDC Isolated, 3W DC-DC Converter


PackageDescription:
MTU1 Series, Body 8.2 x 8.4, Height 8.5mm

Part Description:
12V to ±15V, Iout (max) ±33mA, 1kVDC Isolated, 1W Dual Output DC-DC Converter


PackageDescription:
MTU2 Series, Body 8.2 x 8.4, Height 8.5mm

Part Description:
5V to ±5V, Iout (max) ±200mA, 1kVDC Isolated, 2W Dual Output DC-DC Converter


Part Description:
3.3V to 5V, Iout (max) 400mA, 1kVDC Isolated, 2W Single Output DC-DC Converter


PackageDescription:
NMJ Series, Single Output, Body 19.5 x 9.8mm, SIP-7

Part Description:
5V to 15V, Iout (max) 66mA, 5.2kVDC Isolated, 1W DC-DC Converter


PackageDescription:
NMJ Series, Dual Output, Body 19.5 x 9.8mm, SIP-7

Part Description:
12V to ±5V, Iout (max) ±100mA, 5.2kVDC Isolated, 1W DC-DC Converter


Part Description:
12V to 15V, Iout (max) 66mA, 5.2kVDC Isolated, 1W DC-DC Converter


Part Description:
12V to ±15V, Iout (max) ±33mA, 5.2kVDC Isolated, 1W DC-DC Converter


Part Description:
5V to ±9V, Iout (max) ±111mA, 3kVDC Isolated, 2W DC-DC Converter


Part Description:
5V to 5V, Iout (max) 200mA, 3kVDC Isolated, 1W DC-DC Converter


Part Description:
5V to 12V, Iout (max) 84mA, 3kVDC Isolated, 1W DC-DC Converter


Part Description:
5V to ±12V, Iout (max) ±42mA, 3kVDC Isolated, 1W DC-DC Converter


Part Description:
5V to ±15V, Iout (max) ±33mA, 3kVDC Isolated, 1W DC-DC Converter


Part Description:
15V to 5V, Iout (max) 200mA, 3kVDC Isolated, 1W DC-DC Converter


PackageDescription:
NMXSO Series, Body 40.5x23.5mm, Height 10mm

Part Description:
5VDC to ±15VDC, Iout (max) ±200mA, Isolated 5W Regulated DC-DC Converter


PackageDescription:
NTE Series, 8-Leads, Body 12.7x7.7mm (max), Pitch 2.54mm

Part Description:
3V to 3V, Isolated 1W Single Output SM DC-DC Converter


Part Description:
5V to 3V3, Isolated 1W Single Output SM DC-DC Converter


Part Description:
5V to 9V, Isolated 1W Single Output SM DC-DC Converter


PackageDescription:
OKI-78SR Series, 3 Pin DC-DC Converter, Body 10.4 x 16.5mm

Part Description:
7-36V to 3.3V, Iout (max) 1.5mA, 5.2kVDC Isolated, 4.95W DC-DC Converter


Part Description:
48V to 15V (9V to 16.5V Ajustable), Iout 3.4A, 51 Watt  DC-DC Converter


Part Description:
48V to 24V (14.4V to 26.4V Ajustable), Iout 2.1A, 51 Watt  DC-DC Converter


Part Description:
48V to 5V (3V to 5.75V Ajustable), Iout 10A, 50 Watt  DC-DC Converter


Part Description:
5V to ( -4.5 to -1.4V), Iout (max) 6A, 12 Watt Plus to Minus Voltage Converter


Part Description:
5V to ( -6.5 to -2.7V), Iout (max) 3.5A, 12 Watt Plus to Minus Voltage Converter


Part Description:
3.3V to -2V, Iout (max) 5A, 10 Watt Plus to Minus Voltage Converter


Part Description:
3.3V to -5.2V, Iout (max) 2.5A, 12 Watt Plus to Minus Voltage Converter


PackageDescription:
Texas ERW (R-PDSS-T11) Case, Body W 51.94 x L 26.54 x H9.98mm

Part Description:
18V-60VDC to 9V-13.2VDC, Iout (max) 2.5A, 30W DC-DC Converter


PackageDescription:
R2D Series 6 Pin of 10 SMD Package Version, DC/DC Converter,  Body 10.7X15.24mm

Part Description:
5VDC to ±24VDC, Iout ±42mA, 3kVDC Isolated, 2W DC-DC Converter


PackageDescription:
REC5 Series , DIP 24, Pitch 2.54mm, Body 32 x 20.3mm

Part Description:
18-36VDC to 15VDC, Iout (max) 340mA, 4kV Isolated, 5W DC-DC Converter


PackageDescription:
RP Series, Body 19.65x7.05mm, Compact SIP-7 Package

Part Description:
5V-24V to 15VDC, Iout 66mA, 1W Regulated DC-DC Converter


PackageDescription:
RP40-GW Series, Body L 50.8 x W 50.8 x H 10.7mm

Part Description:
18V-75V to ±15VDC, Iout ±1333mA, 40W Regulated DC-DC Converter


PackageDescription:
RS Series, Body 21.8x9.2mm, Compact SIP-8 Package

Part Description:
4.5V-9V to ±15VDC, Iout ±67mA, 2W Regulated DC-DC Converter


Part Description:
18V-36V to ±15VDC, Iout ±67mA, 2W Regulated DC-DC Converter


PackageDescription:
RS6 Series, Body 21.8x9.2mm, Compact SIP-8 Package

Part Description:
24VDC to ±12VDC, Iout ±250mA, 2kVDC Isolated, 6W DC-DC Converter


Part Description:
24VDC to ±15VDC, Iout ±200mA, 2kVDC Isolated, 6W DC-DC Converter


PackageDescription:
SIP Series Model 100, Body 36.8 x 4.06mm, Regulated, Low Profile High Voltage DC-DC Converter

Part Description:
4 to 6.7VDC Input, <25 to 100VDC (0 to 10mA) Output, 1W Regulated, Low Ripple High Voltage DC-DC Converter


PackageDescription:
TDR 2SM Series, SMD DC/DC Converter,  Body 18.9x12.8mm

Part Description:
18-36VDC to ±15VDC, Iout ±67mA, 2W DC-DC Converter


PackageDescription:
TEL 15 Series, Body 50.8x25.4mm, Height 10.2mm

Part Description:
18-36V to ±15V, Iout (max) 500mA, 15W DC-DC Converter


PackageDescription:
TEL2 Series, Body 23.8x13.7mm, Pitch 2.54mm

Part Description:
4.5-9VDC to ±5VDC, Iout (max) 200mA, 2W DC-DC Converter


Part Description:
18-36VDC to ±15VDC, Iout (max) 65mA, 2W DC-DC Converter


Part Description:
4.5-9V to 5V, Iout (max) 600mA, 3W DC-DC Converter


Part Description:
4.5-9V to 12V, Iout (max) 250mA, 3W DC-DC Converter


Part Description:
4.5-9V to 15V, Iout (max) 200mA, 3W DC-DC Converter


Part Description:
4.5-9V to ±12V, Iout (max) ±125mA, 3W DC-DC Converter


Part Description:
4.5-9V to ±15V, Iout (max) ±100mA, 3W DC-DC Converter


Part Description:
9-18V to 12V, Iout (max) 250mA, 3W DC-DC Converter


Part Description:
9-18V to 15V, Iout (max) 200mA, 3W DC-DC Converter


Part Description:
9-18V to ±12V, Iout (max) ±125mA, 3W DC-DC Converter


Part Description:
9-18V to ±15V, Iout (max) ±100mA, 3W DC-DC Converter


Part Description:
18-36V to 5V, Iout (max) 600mA, 3W DC-DC Converter


Part Description:
18-36V to 12V, Iout (max) 250mA, 3W DC-DC Converter


Part Description:
18-36V to 15V, Iout (max) 200mA, 3W DC-DC Converter


Part Description:
18-36V to ±12V, Iout (max) ±125mA, 3W DC-DC Converter


Part Description:
18-36V to ±15V, Iout (max) ±100mA, 3W DC-DC Converter


Part Description:
9-18VDC to 3.3VDC, Iout (max) 1.2A, 5W DC-DC Converter


Part Description:
9-18VDC to 5VDC, Iout (max) 1A, 5W DC-DC Converter


PackageDescription:
TEL5 Series , Body 32x20.3mm, Pitch 2.54mm

Part Description:
9-18VDC to ±12VDC, Iout (max)  ±250mA, 5W DC-DC Converter


Part Description:
9-18VDC to ±15VDC, Iout (max)  ±200mA, 5W DC-DC Converter


PackageDescription:
TEL8 Series, Body 24.1x14mm, Pitch 2.54mm

Part Description:
9-18VDC to 5VDC, Iout (max) 1.6A, 8W DC-DC Converter


Part Description:
9-18VDC to 24VDC, Iout (max) 335mA, 8W DC-DC Converter


Part Description:
9-18VDC to ±15VDC, Iout (max)  ±265mA, 8W DC-DC Converter


Part Description:
36-75VDC to 24VDC, Iout (max) 335mA, 8W DC-DC Converter


PackageDescription:
TEN 15 Series, Body 50.8x25.4mm, Height 10.2mm

Part Description:
18-36V to +5V, Iout (max) 3A, 15W DC-DC Converter


PackageDescription:
TEN 15WI Series, Body 50.8x25.4mm, Height 10.2mm

Part Description:
9-36V to +5V, Iout (max) 2950mA, 15W DC-DC Converter


PackageDescription:
TEN 15 Series, Body 50.8x25.4mm, Height 10.mm

Part Description:
18-36V to +15V, Iout (max) 1A, 15W DC-DC Converter


Part Description:
18-75V to +5.1V, Iout (max) 2950mA, 15W DC-DC Converter


PackageDescription:
TEN 20WIN Series, Body 50.8x25.4mm, Height 10.2mm

Part Description:
9-36VDC to +5VDC, Iout (max) 4A, 20W DC-DC Converter


Part Description:
18-36VDC to 12VDC, Iout (max) 1.67A, 20W DC-DC Converter


Part Description:
9-18VDC to ±15VDC, Iout (max) ±1.0A, 30W DC-DC Converter


Part Description:
18-36VDC to 12VDC, Iout (max) 2.5A, 30W DC-DC Converter


Part Description:
18-36VDC to 15VDC, Iout (max) 2.0A, 30W DC-DC Converter


Part Description:
10-40VDC to +15VDC, Iout (max) 2A, 30W DC-DC Converter


Part Description:
18-36VDC to ±15VDC, Iout (max) ±1.0A, 30W DC-DC Converter


Part Description:
9-36VDC to ±15VDC, Iout (max) ±1.0A, 30W DC-DC Converter


Part Description:
36-75VDC to ±15VDC, Iout (max) ±1.0A, 30W DC-DC Converter


Part Description:
18-75VDC to ±15VDC, Iout (max) ±1.0A, 30W DC-DC Converter


Part Description:
4.5-9VDC to to 15VDC, Iout (max) 200mA, 3W DC-DC Converter


Part Description:
9-18VDC to 5VDC, Iout (max) 500mA, 3W DC-DC Converter


Part Description:
18-36VDC to 5VDC, Iout (max) 500mA, 3W DC-DC Converter


Part Description:
18-36VDC to 15VDC, Iout (max) 200mA, 3W DC-DC Converter


Part Description:
18-36VDC to ±15VDC, Iout (max) ±100mA, 3W DC-DC Converter


Part Description:
18-36VDC to 5VDC, Iout (max) 8A, 40W DC-DC Converter


Part Description:
9-36VDC to 5VDC, Iout (max) 8A, 40W DC-DC Converter


Part Description:
18-36VDC to 15VDC, Iout (max) 2.66A, 40W DC-DC Converter


Part Description:
18-36VDC to  ±12VDC, Iout (max) 1.66A, 40W DC-DC Converter


Part Description:
18-36VDC to  ±15VDC, Iout (max) 1.33A, 40W DC-DC Converter


Part Description:
18-36VDC to  5VDC Iout (max) 6A and ±12VDC Iout (max) 400mA, 40W DC-DC Converter


PackageDescription:
TEN 4 Series, Body 32.5x20.8mm, DIP-24 Package with Standard Pinout

Part Description:
9-36V to ±12V, Iout (max) ±165mA, 4W DC-DC Converter


Part Description:
9-18VDC to 15VDC, Iout (max) 400mA, 6W DC-DC Converter


PackageDescription:
TEN 5 Series, Body 32.5x20.5mm, DIP-24 Package with Standard Pinout

Part Description:
9-36V to 3.3V, Iout (max) 1200mA, 6W DC-DC Converter


Part Description:
9-36V to 5V, Iout (max) 1000mA, 6W DC-DC Converter


Part Description:
9-36V to 12V, Iout (max) 500mA, 6W DC-DC Converter


Part Description:
18-36VDC to 15VDC, Iout (max) 400mA, 6W DC-DC Converter


Part Description:
9-36V to 15V, Iout (max) 400mA, 6W DC-DC Converter


Part Description:
9-36V to ±5V, Iout (max) ±500mA, 6W DC-DC Converter


PackageDescription:
TEN 5 Series , Body 32.5x20.5mm, DIP-24 Package with Standard Pinout

Part Description:
9-36V to ±12V, Iout (max) ±250mA, 6W DC-DC Converter


Part Description:
18-36VDC to ±15VDC, Iout (max) ±200mA, 6W DC-DC Converter


Part Description:
9-36V to ±15V, Iout (max) ±200mA, 6W DC-DC Converter


Part Description:
18-75VDC to 5VDC, Iout (max) 1A, 6W DC-DC Converter


Part Description:
18-36VDC to 5VDC, Iout (max) 12.0A, 60W DC-DC Converter


Part Description:
18-36VDC to 5VDC, Iout (max) 12A, 60W DC-DC Converter


Part Description:
18-36VDC to 15VDC, Iout (max) 4A, 60W DC-DC Converter


Part Description:
9-36VDC to 15VDC, Iout (max) 4A, 60W DC-DC Converter


Part Description:
18-36VDC to ±15VDC, Iout (max) 2A, 60W DC-DC Converter


PackageDescription:
TEN6WIN Series, Body 31.8x20.3mm, DIP-24 Package

Part Description:
9-36VDC to 5VDC, Iout (max) 1200mA, 6W DC-DC Converter


Part Description:
18-75VDC to 24VDC, Iout (max) 250mA, 6W DC-DC Converter


Part Description:
9-18VDC to 15VDC, Iout (max) 535mA, 8W DC-DC Converter


Part Description:
9-18VDC to ±12VDC, Iout (max) ±335mA, 8W DC-DC Converter


Part Description:
18-36VDC to 5VDC, Iout (max) 1.5A, 8W DC-DC Converter


Part Description:
18-36VDC to 15VDC, Iout (max) 535mA, 8W DC-DC Converter


Part Description:
18-36VDC to ±15VDC, Iout (max) ±265mA, 8W DC-DC Converter


PackageDescription:
TEN 8 WI Series, Body 32x20.3mm, Height 10.2mm

Part Description:
18-75VDC to ±12VDC, Iout (max) ±333mA, 8W DC-DC Converter


PackageDescription:
TEP 100 Series, Single Output DC/DC Converter,  Body 61.5x58.2mm

Part Description:
36-75VDC to 5VDC, Iout (max) 20A, DC-DC Converter


Part Description:
36-75VDC to 15VDC, Iout (max) 6.7A, DC-DC Converter


PackageDescription:
TEP 100WIR Series, Single Output DC/DC Converter,  Body 61.5x58.2mm

Part Description:
16.5-75VDC to 24VDC, Iout (max) 4.2A, DC-DC Converter


PackageDescription:
TES 1 Series, Single Output DC/DC Converter,  Body 13.7x8mm

Part Description:
5V ±10% to 5V, Iout (max) 200mA, 1W DC-DC Converter


PackageDescription:
SOIC, 2.54mm, pitch; 6 of 16 Pin, 13.70mm W X 24.00mm L X 9.25mm H body, IPC Medium Density

Part Description:
5V ±10% to ±15V, Iout (max) ±66mA, 2W DC-DC Converter


PackageDescription:
TES 2 Series, DC/DC Converter,  Body 24x13.7mm

Part Description:
9V-18V to ±5VDC, Iout ±200mA, 2W DC-DC Converter


Part Description:
9V-18V to ±15VDC, Iout ±65mA, 2W DC-DC Converter


PackageDescription:
SOIC, 2.54mm Pitch, 12 Pin of 24, 14.8 W X 32.3mm L X 10.45mm H, IPC Medium Density

Part Description:
18V-36V to 3.3VDC, Iout 700mA, 3W DC-DC Converter


Part Description:
18V-36V to ±12VDC, Iout ±125mA, 3W DC-DC Converter


Part Description:
18V-75V to 15VDC, Iout 200mA, 3W DC-DC Converter


Part Description:
9-18VDC to 12VDC, Iout (max) 250mA, 3W DC-DC Converter


Part Description:
9-18VDC to ±15VDC, Iout (max) 100mA, 3W DC-DC Converter


PackageDescription:
THD 10 Series, Body 32.3x20.8mm, Height 10.7mm

Part Description:
18-36VDC to 5.1VDC, Iout (max) 2A, 10W DC-DC Converter


PackageDescription:
THD 10N Series, Body 31.8x20.3mm, Height 10.2mm

Part Description:
36-75VDC to ±12VDC, Iout (max) ±416mA, 10W DC-DC Converter


PackageDescription:
THD 15N Series, Body 22.3x20.8mm, Height 10.7mm

Part Description:
18-36VDC to ±5VDC, Iout (max) 1.5A, 15W DC-DC Converter


PackageDescription:
THI 2 Series, Body 32x20mm, Pitch 2.54mm

Part Description:
5 to 5VDC, Iout (max) ±400mA, 2W DC-DC Converter


Part Description:
5 to ±15VDC, Iout (max) ±65mA, 2W DC-DC Converter


PackageDescription:
THL 10 Series, Body 25.4x25.4mm, Height 10.6mm

Part Description:
18-36VDC to ± 5VDC, Iout (max) 1000 mA, 10W DC-DC Converter


PackageDescription:
THL 20WI Series, Body 25.4x25.4mm, Height 10.7mm

Part Description:
9-36VDC to 15VDC, Iout (max) 1.34A, 20W DC-DC Converter


Part Description:
9-36VDC to 24VDC, Iout (max) 835mA, 20W DC-DC Converter


Part Description:
9-36VDC to ± 12VDC, Iout (max) 835mA, 20W DC-DC Converter


Part Description:
9-36VDC to ± 15VDC, Iout (max) 670mA, 20W DC-DC Converter


PackageDescription:
THL 3 WISM Series, DC/DC Converter,  Body 24x13.7mm

Part Description:
18-75VDC to 12VDC, Iout 250mA, 3W DC-DC Converter


Part Description:
4.5-9VDC to 5VDC, Iout (max) 2A, 10W DC-DC Converter


Part Description:
4.5-9VDC to 12VDC, Iout (max) 830mA, 10W DC-DC Converter


Part Description:
9-18VDC to 15VDC, Iout (max) 200mA, 3W DC-DC Converter


Part Description:
18-36VDC to ±15VDC, Iout (max) 200mA, 6W DC-DC Converter


PackageDescription:
THN 15 Series, Body 25.4x25.4mm, Height 9.9mm

Part Description:
9-18VDC to 5VDC, Iout (max) 3A, 15W DC-DC Converter


Part Description:
9-18VDC to 12VDC, Iout (max) 1.3A, 15W DC-DC Converter


Part Description:
9-18VDC to 15VDC, Iout (max) 1A, 15W DC-DC Converter


Part Description:
9-18VDC to ±5VDC, Iout (max) ±1.5A, 15W DC-DC Converter


PackageDescription:
THN 15WIR Series, Body 25.4x25.4mm, Height 9.9mm

Part Description:
9-36VDC to +5VDC, Iout (max) 3A, 15W, Wide Input Voltage Range, Ruggedized DC-DC Converter


Part Description:
18-36VDC to +15VDC, Iout (max) 1A, 15W DC-DC Converter


Part Description:
18-36VDC to ±15VDC, Iout (max) 500mA, 15W DC-DC Converter


PackageDescription:
THN 20WI Series, Body 25.4x25.4mm, Height 9.9mm

Part Description:
9-36VDC to +3.3VDC, Iout (max) 4.5A, 30W DC-DC Converter


Part Description:
9-36VDC to +24VDC, Iout (max) 833mA, 30W DC-DC Converter


PackageDescription:
THN 30 Series, Body 25.4x25.4mm, Height 9.9mm

Part Description:
18-36VDC to ±15VDC, Iout (max) 1A, 30W DC-DC Converter


PackageDescription:
THN 30WI Series, Body 25.4x25.4mm, Height 9.9mm

Part Description:
9-36VDC to ±15VDC, Iout (max) 1A, 30W DC-DC Converter


PackageDescription:
TMA Series, Body 19.5x6.1mm, SIP-6, Unregulated

Part Description:
5V ±10% to 5V, Iout (max) ±200mA, 1W DC-DC Converter


Part Description:
5V ±10% to ±15V, Iout (max) ±35mA, 1W DC-DC Converter


Part Description:
24V ±10% to ±15V, Iout (max) ±35mA, 1W DC-DC Converter


PackageDescription:
TME Series, Body 11.75x7.25mm, SIP-4 Package

Part Description:
24V ±10% to 5V, Iout (max) 200mA, 1W DC-DC Converter


Part Description:
24V ±10% to 15V, Iout (max) 65mA, 1W DC-DC Converter


PackageDescription:
TMH Series , Body 19.5x7.5mm, Compact SIP Package

Part Description:
5VDC to ±12V, Iout (max) ±80mA, 2W DC-DC Converter


PackageDescription:
TMR 1 Series, Body 17.5x8.12mm, Compact SIP-6 Package

Part Description:
4.5-9VDC to 5VDC, Iout (max) 200mA, 1W DC-DC Converter


PackageDescription:
SOIC, 2.54mm pitch; 7 of 14 pin, 13.70mm W X 18.90mm L X 9.20mm H body, IPC Medium Density


PackageDescription:
TMR 2E Series, Body 21.8x9.3mm, SIP-7 Package

Part Description:
4.5-9VDC to 12VDC, Iout (max) 167mA, 2W DC-DC Converter


PackageDescription:
TMR 2 Series, Body 21.8x9.2mm, Compact SIP-8 Package

Part Description:
18-36VDC to 5VDC, Iout (max) 400mA, 2W DC-DC Converter


Part Description:
18-36VDC to 12VDC, Iout (max) 165mA, 2W DC-DC Converter


Part Description:
18-36VDC to ±5VDC, Iout (max) ±200mA, 2W DC-DC Converter


Part Description:
18-36VDC to ±12VDC, Iout (max) ±85mA, 2W DC-DC Converter


Part Description:
18-36VDC to ±15VDC, Iout (max) ±65mA, 2W DC-DC Converter


PackageDescription:
TMR 2WI Series, Body 26x9.3mm, SIP-9 Package

Part Description:
18-75VDC to ±15VDC, Iout (max) ±65mA, 2W DC-DC Converter


PackageDescription:
TMR 2WISM Series, DC/DC Converter,  Body 19x14.9mm

Part Description:
18-75VDC to ±15VDC, Iout (max) ±67mA, 2W DC-DC Converter


PackageDescription:
TMR 3 Series, Body 21.8x9.2mm, Compact SIP-8 Package

Part Description:
4.5-9VDC to 5VDC, Iout (max) 600mA, 3W DC-DC Converter


Part Description:
4.5-9VDC to ±15VDC, Iout (max) ±100mA, 3W DC-DC Converter


Part Description:
9-18VDC to 5VDC, Iout (max) 600mA, 3W DC-DC Converter


Part Description:
9-18VDC to ±12VDC, Iout (max) ±125mA, 3W DC-DC Converter


PackageDescription:
TMR 3 Series, Body 21.8x9.2mm, Compact SIP-8 Package, HI Version

Part Description:
9-18VDC to ±15VDC, Iout (max) ±100mA, 3W DC-DC Converter, 3kVDC Isolation


Part Description:
18-38VDC to 15VDC, Iout (max) 200mA, 3W DC-DC Converter


Part Description:
18-38VDC to ±15VDC, Iout (max) ±100mA, 3W DC-DC Converter


PackageDescription:
TMR 6 Series, Body 21.8x9.1mm, Compact SIP-8 Package

Part Description:
4.5-9VDC to 5VDC, Iout (max) 1.2A, 6W DC-DC Converter


Part Description:
4.5-9VDC to 15VDC, Iout (max) 400mA, 6W DC-DC Converter


Part Description:
9-18VDC to ±12VDC, Iout (max) ±250mA, 6W DC-DC Converter


Part Description:
18-36VDC to 5VDC, Iout (max) 1.2A, 6W DC-DC Converter


Part Description:
18-36VDC to 24VDC, Iout (max) 250mA, 6W DC-DC Converter


PackageDescription:
TMR 9 Series, Body 21.8x9.6mm, Compact SIP-8 Package

Part Description:
36-75VDC to 24VDC, Iout (max) 375mA, 9W DC-DC Converter


PackageDescription:
TMR 9 WI Series, Body 21.8x9.6mm, Compact SIP-8 Package

Part Description:
18-75VDC to ±12VDC, Iout (max) ±375mA, 9W DC-DC Converter


PackageDescription:
TMV Series, Single Output DC/DC Converter,  Body 22x7.5mm


PackageDescription:
TMV Series, Dual Output DC/DC Converter,  Body 19.5x7.1mm

Part Description:
5V ±10% to ±15V, Iout (max) ±65mA, 1W DC-DC Converter


PackageDescription:
TMV Series, Dual Output DC/DC Converter,  Body 22x7.5mm

Part Description:
5V ±10% to ±15V, Iout (max) ±30mA, 1W DC-DC Converter


Part Description:
5VDC ±10% to 9VDC, Iout (max) 110mA, 1W DC-DC Converter


PackageDescription:
TRN 1 SM Series, DC/DC Converter,  Body 12.1 x 11.9 x 7.6mm

Part Description:
18-36VDC to 5VDC, Iout (max) 200mA, 1W DC-DC Converter


Part Description:
18-36VDC to 12V, Iout (max) 90mA, 1W DC-DC Converter


Part Description:
18-36VDC to ±12V, Iout (max) ±45mA, 1W DC-DC Converter


Part Description:
9-18VDC to ±12V, Iout (max) ±125mA, 3W DC-DC Converter


Part Description:
18-36VDC to 5V, Iout (max) 600mA, 3W DC-DC Converter


Part Description:
18-36VDC to ±15V, Iout (max) ±100mA, 3W DC-DC Converter


PackageDescription:
SOIC, 1.27mm, pitch; 8 of 14 pin, 8.00mm W X 12.35mm L X 6.95mm H body, IPC Medium Density


Part Description:
12V ±10% to 12V, Iout (max) 80mA, 1W DC-DC Converter


PackageDescription:
TSN 1 Series, Single Output DC/DC Converter,  Body 11.7x7.5mm

Part Description:
-18 - -32VDC to -15VDC, Iout (max) 1A, DC-DC Converter


Part Description:
-7 - -32VDC to -5VDC, Iout (max) 1A, DC-DC Converter


PackageDescription:
TSR 0.5 Series, Single Output DC/DC Converter,  Body 11.5x7.55mm

Part Description:
6.5-32VDC to 5VDC, Iout (max) 0.5A, DC-DC Converter


PackageDescription:
TSRN 0.5SM Series, Case, 10 Pin, Pitch 2.54mm, Body 9.6 x 15.3mm


Part Description:
8-32VDC to 6.5VDC, Iout (max) 0.5A, DC-DC Converter


PackageDescription:
TSR 1 Series, Single Output DC/DC Converter,  Body 11.7x7.6mm

Part Description:
4.6-36VDC to 1.2VDC, Iout (max) 1A, DC-DC Converter


Part Description:
4.6-36VDC to 1.5VDC, Iout (max) 1A, DC-DC Converter


Part Description:
18-36VDC to 15VDC, Iout (max) 1A, DC-DC Converter


Part Description:
4.6-36VDC to 1.8VDC, Iout (max) 1A, DC-DC Converter


Part Description:
4.6-36VDC to 2.5VDC, Iout (max) 1A, DC-DC Converter


PackageDescription:
TSR 1 SM Series, DC/DC Converter,  Body 15.24 x 11.8 x 7.62mm

Part Description:
4.75-36VDC to 3.3VDC, Iout (max) 1A, DC-DC Converter


Part Description:
6.5-36VDC to 5VDC, Iout (max) 1A, DC-DC Converter


Part Description:
12-36VDC to 9VDC, Iout (max) 1A, DC-DC Converter


PackageDescription:
TRACO TSR-3, DC/DC Converter,  Body W 6mm x L 10.4mm x H 15.5mm

Part Description:
4.7-13VDC to (-0.59 to -6.0VDC), Iout 2.2A (max at Vout < 3.3VDC), DC-DC Converter


Part Description:
10-30VDC to 5.0-15VDC, Iout (max) 3A, DC-DC Converter


PackageDescription:
TRACO TSR-3, Angular Pin Version, DC/DC Converter, Body W 10.4mm x L 15.5mm

Part Description:
10-30VDC to 5.0-15VDC, Iout (max) 3A, DC-DC Converter (Angular Pin Version)


PackageDescription:
TSRN-1SM Case, 6-Pin, Pitch 2.13mm, Body 15.2x9.3mm

Part Description:
6.5-42VDC to 2.5-8VDC (5V nom), Iout (max), 1A Positive Switching Regulator


PackageDescription:
TSRN 1 Series, 1 A Switching DC/DC Converter, Body 11.7x7.5mm

Part Description:
8-42VDC to 6.5VDC, Iout (max) 1A, DC-DC Converter


Part Description:
4.75-6VDC to ±15VDC/±165mA, Ripple and Noise (max) 3mVpk-pk, DC-DC Converter


Part Description:
4.75-6VDC to +15VDC/±200mA -15VDC/100mA, Ripple and Noise (max) 3mVpk-pk, DC-DC Converter


PackageDescription:
TVN  5WI Series, Body 32x20mm, Pitch 2.54mm

Part Description:
9-36VDC to  ±24V, Iout (max) 104mA, 15W DC-DC Converter


PackageDescription:
TWR Series, Body 50.08 x 25.4mm, Height 9.53mm

Part Description:
18-36VDC to ±12V (210mA) ±5% And +5V(1A) ±2% High-Reliability, Triple Output DC-DC Converter


Part Description:
4.75-6VDC to 5VDC, Iout (max) 300mA, 1.5W DC-DC Converter


Part Description:
4.75-6VDC to ±15VDC, Iout (max) ±53mA, 1.5W DC-DC Converter


PackageDescription:
VICOR  Micro DC-DC Converter, Short Pin RoHS, Threaded Baseplate

Part Description:
18-36VDC to 15VDC, -20°C to 100°C, 50W DC-DC Converter, Short Pin RoHS, Threaded Baseplate (Micro Family)


PackageDescription:
VICOR  Micro DC-DC Converter, Short Pin RoHS, Slotted Baseplate

Part Description:
18-36VDC to 15VDC, -10°C to 100°C, 50W DC-DC Converter, Short Pin RoHS, Slotted Baseplate (Micro Family)


Part Description:
18-36VDC to 24VDC, -20°C to 100°C, 50W DC-DC Converter, Short Pin RoHS, Threaded Baseplate (Micro Family)


Part Description:
18-36VDC to 5VDC, -20°C to 100°C, 100W DC-DC Converter, Short Pin RoHS, Threaded Baseplate  (Micro Family)


PackageDescription:
ZUS25 Series , Body 65x50mm, Height 8.5mm

Part Description:
4.5-9VDC to ±12VDC, Iout (max) 1.7A, 20.4W DC-DC Converter


# Diodes

PackageDescription:
DO-201, Diode, Axial; Lead Spacing 20.32mm, Lead Dia. 1.07mm, Body Length 9mm, Body Dia. 5.05mm

Part Description:
Uni-directional  Transient Voltage Suppressor Diode - Transil


Part Description:
Bi-directional Transient Voltage Suppressor Diode - Transil


PackageDescription:
DO-214-AB/SMC Molded Diode, Body 7.9x5.9mm, IPC Medium Density

Part Description:
Uni-Directional Transient Voltage Suppressor Diode


PackageDescription:
TO-252AA DPAK TO, 2.28mm pitch; 2 pin,9.905mm L X 6.095mm W X 2.39mm H body, IPC Medium Density

Part Description:
Center Tap Schottky Rectifier (Common Cathode)


PackageDescription:
DO-214-AC/SMA  Molded Diode, Body 5.0x2.7mm, IPC Medium Density


Part Description:
Uni-directional  Transient Voltage Suppressor Diode -Transil


PackageDescription:
DO-41, Diode, Axial, Body 4.7 x 2.7mm (LxDia. Max), Pin spacing 10.16mm


PackageDescription:
DO-35, Diode, Axial, Body 4.6 x 2mm (LxDia. max), Pin spacing 7.62mm


PackageDescription:
SODFL Diode; 1.70mm W X 1.25mm L X 1.00mm H body, IPC Medium Density


PackageDescription:
SOD-323 Diode; 1.775mm W X 1.30mm L X 1.15mm H Body, IPC Medium Density


PackageDescription:
SOD Diode (SOD-123); 2.70mm W X 1.55mm L X 1.35mm H body, IPC Medium Density

Part Description:
Surface Mount Small Signal Fast Switching Diode


PackageDescription:
Small Outline Diode (SOD-323), 1.70mm W X 1.25mm L X 1.10mm H body,  IPC Medium Density


PackageDescription:
Diode Case SOD57,  Axial, Body L 4.57 x D 3.81 mm , Pin spacing 10.16mm


PackageDescription:
ONSEMICONDUCTOR CASE 017AA-01, Diode, Axial; Lead Spacing 15.24mm, Lead Dia. 1.09mm, Body Length 8.89mm, Body Dia. 3.68mm


PackageDescription:
DO-15, Diode, Axial, Body 7.62 x 3.56mm (LxDia. Max), Pin spacing 13.97mm


PackageDescription:
DO-201AD, Diode, Axial; Lead Spacing 20.32mm, Lead Dia. 1.3mm, Body Length 9.5mm, Body Dia. 5.6mm


PackageDescription:
ONSEMICONDUCTOR CASE 41A-04, Diode, Axial; Lead Spacing 15.24mm, Lead Dia. 1.06mm, Body Length 9mm, Body Dia. 5.05mm

Part Description:
MOSORB® Uni-Directional Transient Voltage Suppressor


PackageDescription:
Diode, Axial; Lead Spacing 15.24mm, Lead Dia. 1mm, Body Length 8.89mm, Body Dia. 5.46mm

Part Description:
Axial Lead Hermetically Sealed High Voltage Rectifier Diode


PackageDescription:
DO-214-AC/SMA Diode, Molded Body; 5.21mm L X 2.60mm W X 2.20mm H, IPC Medium Density


PackageDescription:
DO-214-AA/SMB Diode, Molded Body; 5.40mm L X 3.62mm W X 2.44mm H, IPC Medium Density

Part Description:
Plastic Surface Mount Zener Voltage Regulator Diode


PackageDescription:
Three Phase Bridge Bridge, Body 28.5mm x 28.5mm


PackageDescription:
Bridge Rectifier, Body 14.73mm x 2.41mm, VISHAY Case Type KBPM

Part Description:
Glass Passivated Single-Phase Bridge Rectifier


Part Description:
Silicon Controlled Rectifiers - Reverse Blocking Thyristors


PackageDescription:
905nm Fiber Pigtailed Pulsed Laser Diode 905 XX FP-Series

Part Description:
905nm Fiber Pigtailed Pulsed Laser Diode 905 XX FP-Series


PackageDescription:
MICROSEMI SOT-227 (ISOTOP) Case, Body 38.2mm x 25.4mm, Screws on PCB Version

Part Description:
Dual Die ISOTOP Package High Voltage Schottky Diode


PackageDescription:
DO-214-AC/SMA Diode, Molded Body; 5.195mm L X 2.605mm W X 2.30mm H, IPC Medium Density

Part Description:
Surface Mount Schottky Barrier Rectifier


PackageDescription:
DO-214-AC/SMA Molded Diode, 2-Leads, Body 5.1x2.7mm, IPC Medium Density

Part Description:
High-Current Density Surface Mount Schottky Rectifier


PackageDescription:
Bridge Rectifier, Body 9.35m x 8.33mm, VISHAY Case Type WOG


PackageDescription:
SOT23, 3 pin, Pitch 0.95mm - 1.3mm W X 2.9mm L X 1.1mm H, IPC Medium Density


PackageDescription:
SOT23 3-Leads, Pitch 0.95mm - Body 1.3x2.9mm, IPC Medium Density


PackageDescription:
SOT23 3-Leads, Pitch 0.95mm - Body 1.6x3.04mm, IPC Medium Density

Part Description:
Dual Common Anode Small Signal Schottky Diode


Part Description:
Silicon PIN Diode Array (Series Connected)


PackageDescription:
SOT23 3-Leads, Pitch 0.95mm, Body 1.3x2.9mm, IPC Medium Density


PackageDescription:
DFN; 2 pin,1.00mm L X 0.60mm W X 0.50mm H, IPC Medium Density


PackageDescription:
SOD110 Diode, Molded Body; 2.00mm L X 1.25mm W, IPC Medium Density


Part Description:
Small Signal Diode Array (Series Connected)


PackageDescription:
MELF Diode, 2-Leads, Body 1.7x1.15mm, IPC Medium Density

Part Description:
Surface Mount Small Signal Schottky Diode


Part Description:
Dual Series Surface Mount Schottky Barrier Diodes


PackageDescription:
SOT323, 0.65mm pitch; 3 pin, 1.25mm W X 2.00mm L, IPC Medium Density

Part Description:
Dual Series General-Purpose Schottky Diodes


Part Description:
Dual Common Anode General-Purpose Schottky Diodes


PackageDescription:
SOD-80, MELF Diode, 2-Leads, Body 3.5x1.5mm, IPC Medium Density


PackageDescription:
SOT143, 4-Leads, Body 3.0x2.6mm (max), Pitch 1.92mm, IPC Medium Density


PackageDescription:
SODFL Diode (SOD323F); 1.70mm W X 1.25mm L X 0.80mm H body, IPC Medium Density


Part Description:
Dual Common Cathode Small Signal Schottky Diode


PackageDescription:
SOD-323 Diode; 1.75mm W X 1.30mm L X 1.14mm H Body, IPC Medium Density


Part Description:
Dual Series Small Schottky Barrier Diodes


PackageDescription:
SOD80C, MELF Diode, 2-Leads, Body 3.5x1.5mm, IPC Medium Density


PackageDescription:
SOT23 3-Leads, Pitch 0.95mm - Body 1.4x3mm, IPC Medium Density


PackageDescription:
SOD Diode (SOD123); 2.70mm W X 1.55mm L X 1.45mm H body, IPC Medium Density


Part Description:
Dual Common Cathode High-Speed Switching Diodes


PackageDescription:
SOT363, SC70-6, SOT, 0.65mm Pitch, 6 pin, 1.25mm W X 2.00mm L X 1.10mm H, IPC Medium Density

Part Description:
Integrated Dual Serial Pair High-Speed Switching Diodes


Part Description:
Dual Common Cathode Low-voltage Variable Capacitance Diode


PackageDescription:
Diode Case SOD57,  Axial, Body L 4.57 x D 3.81 mm , Pin spacing 22mm


PackageDescription:
Diode Case SOD57,  Axial, Body L 4.57 x D 3.81 mm , Pin spacing 32mm


PackageDescription:
Diode, Axial, Body L 4 x D 4.3mm , Pin spacing 12.7mm


PackageDescription:
DO-214-AC Molded Diode, 2-Leads, Body 5.1x2.7mm, IPC Medium Density


Part Description:
High Voltage Ultrafast Avalanche SMD Rectifiers


PackageDescription:
DO-213-AB, MELF Diode, 2-Leads, Body 5.0x2.5mm, IPC Medium Density


Part Description:
Surface Mount Glass Passivated Junction Rectifier


PackageDescription:
SOT, 0.95mm Pitch; 6 Pin, 1.50mm W X 2.90mm L X 1.10mm H Body, IPC Medium Density

Part Description:
Quadruple ESD Transient Voltage Suppressor


Part Description:
Dual Common Anode Voltage Regulator Diodes


PackageDescription:
DO-214-AC/SMA Molded Diode, Body 5.3x2.6mm, IPC Medium Density


PackageDescription:
Diode, Axial, Body L 4.57 x D 3.81 mm , Pin spacing 10.16mm

Part Description:
Zener Diodes with Surge Current Specification


PackageDescription:
Diode, Axial; Lead Spacing 20.40mm, Lead Dia. 1.25mm, Body Length 8.85mm, Body Dia. 8.85mm


PackageDescription:
SOT, 0.95mm Pitch; 3 Pin, 1.315mm W X 2.95mm L X 1.15mm H body, IPC Medium Density


Part Description:
Silicon Carbide Schottky Diode Z-Rec™ Rectifier (Common Cathode)


PackageDescription:
SOD80, Diode, MELF; 3.50mm L X 1.65mm Dia, IPC Medium Density


Part Description:
Unidirectional ESD Protection for Transient Voltage Suppressor Diode


Part Description:
Bi-directional ESD Protection for Transient Voltage Suppressor Diode


PackageDescription:
SOT23, 6-Leads, Body 1.6x3.0mm, Pitch 0.95mm, IPC Medium Density


PackageDescription:
DO-214-AC/SMA Diode, Molded Body; 5.21mm L X 2.605mm W X 2.62mm H, IPC Medium Density

Part Description:
Surface Mount Silicon Ultra Fast Recovery Rectifier


PackageDescription:
DIP 6, 4 Leads, Row Spacing 7.62 mm; Pitch 2.54 mm

Part Description:
Single-Phase Glass Passivated Bridge Rectifier


PackageDescription:
SOD128, SODFL Diode; 3.80mm W X 2.40mm L X 0.90mm H body, IPC Medium Density


PackageDescription:
Small Outline Diode Flat Lead (SOD-723), 0.6mm W X 1mm L X 0.55mm H body,  IPC Medium Density


Part Description:
Low Profile Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifier


PackageDescription:
SODFL Diode; 2.8mm W X 1.78mm L X mm H Body, POWERDI®123 Case


Part Description:
Miniature Clamper/Damper Glass Passivated Plastic Rectifier


PackageDescription:
IXYS SOT-227B (Minibloc) Case, Body 38.01mm x 25.42mm, Screws on PCB Version

Part Description:
Sonic Fast Recovery Diode, Parallel Legs


PackageDescription:
MAXIM TSOC Case, 6 Pins, Pitch 1.27mm, 4mm W X 4.45mm L X 1.5mm H


PackageDescription:
Diode, Axial; Lead Spacing 24mm, Lead Dia. 0.8mm, Body Length 8.2mm, Body Dia. 8mm, DSA2 IXYS Case


Part Description:
Fast Recovery Diode Epitaxial Diode (FRED)


PackageDescription:
D2PAK TO-263, TO, 2.54mm Pitch; 2 Pin, 15.245mm L X 9.145mm W X 4.83mm H Body, IPC Medium Density


Part Description:
High Performance Dynamic Fast Recovery Diode, Extreme Low Loss and Soft Recovery, Parallel Legs With Series Connected Dice


Part Description:
High Performance Schottky Diode, Low Loss and Soft Recovery, Parallel Legs


Part Description:
Ultralow Capacitance ESD (15kV) Protection


PackageDescription:
Ultra Small Outline Diode Flat Lead (SOD-523), Body; 1.2mm L X 0.8mm W X 0.65mm H, IPC Medium Density


PackageDescription:
SOT, 0.95mm Pitch; 3 Pin, 1.60mm W X 2.975mm L X 1.40mm H Body, IPC Medium Density

Part Description:
Dual Common Anode Silicon Epitaxial Planar Diode


PackageDescription:
CRD Diode, Lead spacing 7.62mm Body 4.2mm X 2mm, SEMITEC Case Type CRD E


Part Description:
High Frequency Twin Triode Preamplifier Tube


PackageDescription:
Diode Molded in ABS Box, Lead Spacing 28mm, Body L 22mm X W 14mm x H 12mm

Part Description:
Axial Lead Hermetically Sealed High Voltage Rectifier Diode (1N6517) Molded in ABS Box


PackageDescription:
DO-214-AA/SMB Diode, Molded Body; 5.34mm L X 3.625mm W X 2.65mm H, IPC Medium Density


PackageDescription:
DO-214-AC/SMB Diode, Molded Body; 5.45mm L X 2.705mm W X 3.15mm H, IPC Medium Density


Part Description:
Surface Mount Ultrafast Plastic Rectifier


PackageDescription:
DFN; 2 pin,1.00mm L X 0.60mm W X 0.40mm H, IPC Medium Density

Part Description:
30kV ESD Low Capacitance Uni-Directional TVS Diode


PackageDescription:
SOTFL, 0.40mm, Pitch; 3 Pin, 0.80mm W X 1.20mm L X 0.59mm H body, IPC Medium Density

Part Description:
20kV ESD Ultra-Low Capacitance Uni-Directional TVS Diode Array


PackageDescription:
TO-220 2-Terminal + Tab - Horizontal Mount


PackageDescription:
TO-220 2-Terminal + Tab - Vertical Mount


PackageDescription:
Glass Passivated Single-Phase Bridge Rectifier, Body 28.8mm x 28.8mm


PackageDescription:
Glass Passivated Single-Phase Bridge Rectifier, Body 22.05mm x 3.43mm


PackageDescription:
Glass Passivated Single-Phase Bridge Rectifier, Body 22.3mm x 18.8mm


PackageDescription:
Glass Passivated Single-Phase Bridge Rectifier, Body 22.3mm x 3.56mm


Part Description:
High Voltage Glass Passivated Plastic Rectifier


Part Description:
Glass Passivated Junction Plastic Rectifier


Part Description:
Ultra Large Bandwidth HDMI ESD (15kV) Protection


Part Description:
Glass Passivated High Efficient Rectifier


PackageDescription:
SOT23, 5-Leads, Body 1.7x3.0mm (max), Pitch 0.95mm, IPC Medium Density

Part Description:
Quad PIN Diode Pi  Attenuator 300 kHz to 3 GHz


Part Description:
Surface Mount Dual Isolated RF Schottky Barrier Diode


Part Description:
Triple Isolated  RF Schottky Barrier Diodes


Part Description:
Surface Mount Dual Isolated RF Schottky Barrier Diodes


Part Description:
3rd Generation thinQ!TM SiC Schottky Diode


PackageDescription:
Single-Phase Bridge Rectifier, Body 19mm x 6.25mm x 16.3mm


PackageDescription:
Single-Phase Bridge Rectifier, Body 23.2mm x 6.85mm


PackageDescription:
Bridge Rectifier, Body 30mm x 4.8mm, VISHAY Case Type GSIB-5S

Part Description:
Low VF, Single-Phase Single In-Line Bridge Rectifiers


PackageDescription:
SOIC, 4-Leads, Body 3.9x4.75mm, Pitch 2.54mm, IPC Medium Density

Part Description:
Miniature Glass Passivated Fast Recovery Surface Mount Bridge Rectifier


PackageDescription:
SOD Diode (SOD-123); 2.70mm W X 1.60mm L X 1.18mm H body, IPC Medium Density


PackageDescription:
SOD Diode (SOD-123); 2.70mm W X 1.55mm L X 1.45mm H body, IPC Medium Density


PackageDescription:
Diode (SOD-123), 2.70mm W X 1.60mm L X 1.35mm H body, IPC Medium Density


PackageDescription:
Small Outline Diode Flat Lead (SOD-123FL), Body; 2.70mm L X 1.65mm W X 1.0mm H


Part Description:
Switch‐mode Power Rectifier (Common Cathode)


Part Description:
SWITCHMODE Power Rectifier (Common Cathode)


PackageDescription:
ON SEMICONDUCTOR POWERMITE Case, 2-Leads, Body 1.965mm x 1.9mm


PackageDescription:
SODFL Diode (SOD-323F), 1.70mm W X 1.30mm L X 1.00mm H body, IPC Medium Density


Part Description:
Silicon Hot-Carrier Detector And Switching Diode


PackageDescription:
DO-214-AC/SMA Molded Diode, Body 5.2x2.6mm, IPC Medium Density

Part Description:
Surface Mount Standard Recovery Power Rectifier


Part Description:
Switch Mode Power Rectifier (Common Anode)


PackageDescription:
TO-220 3-Terminal + Tab, Flipped Horizontal Mount


Part Description:
Constant Current Regulator & LED Driver (CRD)


PackageDescription:
Diode, Axial; Lead Spacing 13.97mm, Lead Dia. 1.20mm, Body Length 7mm, Body Dia. 4mm


PackageDescription:
SOTFL (SOT666, SOT563,), 0.50mm, Pitch; 6 Pin, 1.20mm W X 1.60mm L X 0.60mm H Body, IPC Medium Density

Part Description:
ESD Protection Diodes Array (8kV) with Low Clamping Voltage


PackageDescription:
SOIC 8, Pitch 1.27mm - Body 4x5mm, IPC Medium Density

Part Description:
ESD Low Capacitance Surface Mount TVS for High Speed Data Interfaces


PackageDescription:
SOT, 0.95mm, pitch; 3 pin,1.30mm W X 2.92mm L X 1.12mm H body, IPC Medium Density

Part Description:
A Sensitive Gate Silicon Controlled Rectifiers (Reverse Blocking Thyristor)


Part Description:
Bi-Directional Transient Voltage Suppressor Diode


Part Description:
Surface Mount Uni-directional TRANSZORB® Transient Voltage Suppressor


Part Description:
Transient Voltage Suppressor (TVS) Diode


Part Description:
Uni-directional Zener Transient Voltage Suppressor


PackageDescription:
Bridge Rectifier, Body 30mm x 4.8mm, VISHAY Case Type PB

Part Description:
Single-Phase Enhanced Power Bridge Rectifiers


Part Description:
Low Capacitance 23kV Bidirectional ESD Protection Diode


Part Description:
Dual Common Cathode ESD Protection Diodes (30kV)


PackageDescription:
SOT, 0.95mm Pitch; 6 Pin, 1.60mm W X 2.90mm L X 1.10mm H Body, IPC Medium Density

Part Description:
Quad Common Anode ESD Protection Diodes (30kV)


Part Description:
Unidirectional ESD Protection for Transient Voltage Suppression


PackageDescription:
0603, 2-Leads, Body 1.6mm x 0.8mm, IPC Medium Density

Part Description:
Pulse-Guard ESD Surface Mount Polymeric Electrostatic Discharge Suppressor


Part Description:
Very Low VF MEGA Schottky Barrier Rectifier


PackageDescription:
SODFL Diode (SOD123W); 2.60mm W X 1.70mm L X 1.10mm H body, IPC Medium Density


PackageDescription:
SOT143B, SOT, 1.90mm Pitch; 4 Pin, 1.30mm W X 2.90mm L X 1.10mm H body, IPC Medium Density

Part Description:
Ultra Low Capacitance (1pF) Double Rail-to-Rail ESD Protection Diode (8kV)


Part Description:
Integrated Quad Ultra-Low Capacitance ESD (±8kV) Protection


PackageDescription:
BOURNS PTVS10-320C-TH, High Voltage, High Current TVS Diode, Lead Spacing 24.15mm, Lead Dia. 1.25mm, Body Length 16.5mm, Body Width 14mm


PackageDescription:
SOD128, SODFL Diode; 3.80mm W X 2.50mm L X 1.10mm H Body, IPC Medium Density


PackageDescription:
SON, 0.40mm Pitch; 9 Pin, 1.00mm W X 2.00mm L X 0.43mm H Body, IPC Medium Density

Part Description:
RailClamp® Ultra Low Capacitance TVS Arrays, ESD (15kV) Protection


PackageDescription:
SODFL Diode 2.00mm W X 1.40mm L X 0.80mm H body, IPC Medium Density


Part Description:
Glass Passivated Junction Fast Switching Plastic Rectifier


PackageDescription:
SODFL Diode; 2.60mm W X 1.60mm L X 0.70mm H Body, IPC Medium Density


PackageDescription:
DO-214-AC/SMA Diode, Molded Body;5.20mm L X 2.725mm W X 2.70mm H, IPC Medium Density

Part Description:
Surface Mount Glass Passivated Rectifier


Part Description:
General Purpose Rectifiers (Glass Passivated)


PackageDescription:
D2PAK TO-263, TO, 2.54mm pitch; 2 pin, 15.44mm L X 10.97mm W X 4.78mm H body, IPC Medium Density

Part Description:
Teccor Brand Thyristors 16A Standard SCRs


PackageDescription:
TO-277A (SMPC), 3-Leads, Pitch 2.13mm, Body 6.1x4.3mm

Part Description:
High Current Density Surface Mount Glass Passivated Rectifier


PackageDescription:
2.28mm pitch; 3 pin, 5.375mm L X 3.975mm W X 1.150mm H body, POWERDI 5


Part Description:
Soft Recovery Ultrafast Plastic Rectifier


PackageDescription:
SOT363, SOT, 0.65mm Pitch; 6 Pin, 1.25mm W X 2.00mm L X 1.10mm H body, IPC Medium Density


PackageDescription:
AVX SMB DO-214-AA Lead-less Chip Form, 2-Leads, Body 5.2x3.6mm


Part Description:
650nm 100MBd Fiber Optic Photodiode Detector  (Use With SFH250V Plastic Connector Housing)


Part Description:
650nm 10MBd Fiber Optic Photodiode Detector  (Use With SFH756V Plastic Connector Housing)


Part Description:
1600V 134A Antiparallel Thyristor Module


PackageDescription:
DO-214-AB (HSMC) Molded Diode, Body 6.025 x 6.13mm, IPC Medium Density


PackageDescription:
DO-214-AC/SMA Molded Diode, 2-Leads, Body 5.1x2.6mm, IPC Medium Density

Part Description:
2A, 60V Surface Mount Schottky Barrier Rectifier


PackageDescription:
Three Phase Bridge Bridge, Body 28.8mm x 28.8mm G11b Case


PackageDescription:
DO-214-AA/SMB Molded Diode, Body 5.4x3.6mm, IPC Medium Density


Part Description:
Asymmetrical TVS Diode for Extended Common-Mode RS-485


PackageDescription:
D2PAK TO-263, TO, 2.54mm pitch; 3 pin, 15.24mm L X 10.67mm W X 4.83mm H body, IPC Medium Density


Part Description:
Surface Mount TRANSZORB® Uni-directional Transient Voltage Suppressors


Part Description:
Surface Mount Bi-directional Transient Voltage Suppressor Diode


Part Description:
Surface Mount Uni-directional Transient Voltage Suppressor Diode


Part Description:
Bidirectional TVS Array for Protection of Four Lines


Part Description:
Trisil™ for Telecom Equipment Protection


Part Description:
30pF 30kV 3 Channel Unidirectional TVS Array, SP05 Series


Part Description:
RailClamps Low Capacitance TVS Diode Array, ESD (15kV) Protection


Part Description:
RailClamps® Low Capacitance TVS Diode Array, ESD (15kV) Protection


PackageDescription:
TO-277A (SMPC), 3-Leads, Pitch 2.13mm, Body 6.15x4.35mm

Part Description:
High Current Density Surface Mount Dual Common Cathode Schottky Rectifier


PackageDescription:
DO-214-AC Molded Diode, Body 5.1x2.7mm, IPC Medium Density


PackageDescription:
DO-214-AB/SMC Molded Diode, Body 7.95x5.9mm, IPC Medium Density


Part Description:
High Voltage Power Schottky Rectifier (Common Cathode)


Part Description:
Low Drop Power Schottky Rectifier (Common Cathode)


PackageDescription:
D2PAK TO-263, TO, 2.54mm pitch; 2 pin,15.425mm L X 9.15mm W X 4.60mm H body, IPC Medium Density


Part Description:
Turbo 2 Ultrafast High Voltage Rectifier (Common Cathode)


PackageDescription:
DO-41, Diode, Axial, Body 4.7 x 2.7 mm (LxDia. max), Pin spacing 10.16mm

Part Description:
Turbo 2 Ultrafast High Voltage Rectifier


PackageDescription:
DPAK TO-252, 2.28mm pitch; 2 pin, 9.725mm L X 6.10mm W X 2.40mm H body, IPC Medium Density


Part Description:
Thyristor Surge Protection Device (Trisil™) for Telecom Equipment Protection


Part Description:
1 Channel ESD Protection Device for Super-Speed (up to 6 Gbps) Interface


PackageDescription:
DFN; 2 Pin,1.70mm L X 0.90mm W X 0.85mm H, IPC Medium Density


PackageDescription:
4x Fiber Optic Surface-Emitting Laser, Anode and Cathode Wire Bonding on Top Side

Part Description:
14 Gbps VCSEL 850nm Vertical Cavity Surface-Emitting Laser, Quad Channel


PackageDescription:
Fiber Optic Photodiode Detector, Anode and Cathode Wire Bonding on Front Side

Part Description:
14 Gbps PIN Photodiode Chip, Single Channel


PackageDescription:
Diode High Voltage, Axial; Lead Spacing 30.48mm, Lead Dia. 1.2mm, Body Length 22mm, Body Height 7.5mm

Part Description:
High Voltage Power Diode, Ultra-Fast Recovery


PackageDescription:
Diode High Voltage, Axial, Vertical Mount; Lead Spacing 6.35mm, Lead Dia. 1.2mm, Body Length 22mm, Body Height 7.5mm


Part Description:
Center Tap Schottky Rectifier (Common Cathode), Halogen-Free


PackageDescription:
D2PAK TO-263AB, TO, 2.54mm pitch; 2 pin, 15.24mm L X 10.16mm W X 4.83mm H body, IPC Medium Density


Part Description:
Standard Recovery Diode (Cathode to Stud)


Part Description:
Center Tap Trench MOS Barrier Schottky Rectifier (Common Cathode)


PackageDescription:
PolyZen, Polymer Enhanced Zener Diode. Case LS, 3-Pin, Body 4x4mm


PackageDescription:
10 to 2500MHZ, 50 Ohm SPDT Pin Diode Reflective

Part Description:
10 to 2500MHZ, 50 Ohm SPDT Pin Diode Reflective


# LEDs & Displays

PackageDescription:
10.9mm Single Digit, Common Cathode, HER Seven Segment Display, Body 12.7x19.05mm

Part Description:
10.9mm Single Digit, Common Cathode, HER Seven Segment Display


PackageDescription:
Four Digit 0.56" GaP HER Seven Segment Display

Part Description:
Four Digit GaP HER Seven Segment Display, Common Anode


PackageDescription:
LCD Display Module, 16 Characters (5x8 Dots) x 2 Lines, I2C-bus Data Interface, With White Backlight, Body 74.5x29.8mm

Part Description:
LCD Display Module, 16 Characters (5x8 Dots) x 2 Lines, I2C-bus Data Interface, With White Backlight


PackageDescription:
LCD Display Module, 128x64 Dots,Transmissive Negative, BL White LED, Wide Temp, Negative Voltage Generator, STN Blue

Part Description:
LCD Display Module, 128x64 Dots,Transmissive Negative, BL White LED, Wide Temp, Negative Voltage Generator, STN Blue


PackageDescription:
2.8" Integrated TFT Display Module (250RGB x 320 Dots), Body 71.2 x60mm

Part Description:
2.8" Integrated TFT Display Module (250RGB x 320 Dots)


PackageDescription:
LCD Display Module, 20 Characters (5x8 Dots) x 4 Lines, I2C-bus Data Interface, With White Backlight, Body 98x60mm

Part Description:
LCD Display Module, 20 Characters (5x8 Dots) x 4 Lines, I2C-bus Data Interface, With White Backlight, Body 98x60mm


PackageDescription:
160x104-Pixel  LCD Graphic Display With Blue Background

Part Description:
160x104-Pixel  LCD Graphic Display With Blue Background


PackageDescription:
White LED Backlight for 60x104-Pixel  LCD Graphic Display

Part Description:
White LED Backlight for 60x104-Pixel  LCD Graphic Display


PackageDescription:
Touch Panel For LCD DOGXL160 Graphic Display

Part Description:
Touch Panel For DOGXL160  LCD Graphic Display


PackageDescription:
20-Leads, Body 14.8x12mm, Pitch 1.5mm, Hyper Red SMD Common Cathode Dual 7-SegmentDisplay

Part Description:
Dual Digit, SMD 7-Segment Common Cathode Hyper Red Display


PackageDescription:
13.2mm Single Digit Numeric Red Display, Body 12.65x17.75mm

Part Description:
13.2mm Single Digit 7-Segment Red Display, Common Anode, Right Hand Dot Point


PackageDescription:
4½ Digit LCD Voltmeter With 12.5mm (0.5") Digit Height

Part Description:
4½ Digit LCD Voltmeter With 12.5mm (0.5") Digit Height


PackageDescription:
3½ Digit LED, 8mm Digit Height, Body 23.4x19.5mm, DIL Pin Connection


PackageDescription:
LCD Display 20 Characters (5x8 Dots) x 4 Lines, I2C, Body 74.5x36.6mm

Part Description:
LCD Display, STN Blue, Negative, Transmissive, Backlight LED White, I2C, 4x20 Character (5x8 Dots)


PackageDescription:
4 1/2 Digit, LCD Display Digital Panel Voltmeters, Body 55.1x23.4mm

Part Description:
±2V/±20V Input, Single 5V Supply, 4 1/2 Digit, LCD Display Digital Panel Voltmeters


PackageDescription:
0.145" 4-Character 5 x 7 Dot Matrix Alphanumeric Intelligent Red Display, Body 20.32x17.78mm

Part Description:
0.145" 4-Character 5 x 7 Dot Matrix Alphanumeric Intelligent Red Display


PackageDescription:
0.145" 4-Character 5 x 7 Dot Matrix Alphanumeric Intelligent Display, Body 19.91x10.16mm

Part Description:
0.145" 4-Character 5 x 7 Dot Matrix Alphanumeric Intelligent Green Display


PackageDescription:
Long Life Cold Cathode Ten Digit Indicator Tube for Side Viewing, 0-9, Left Point

Part Description:
Long Life Cold Cathode Ten Digit Indicator Tube for Side Viewing, 0-9, Left Point


PackageDescription:
Alphanumeric LCD Display Module, 2 x 12 characters, Dot Size:0.45 x 0.60, Dot Pitch 0.55 x 0.70, With LED Backlight Yellow-Green

Part Description:
STN positive gray, Alphanumeric LCD Display Module, 2 x 12 characters With LED Backlight Yellow-Green


PackageDescription:
3 Digit, Red Seven Segments Magnified Monolithic Numeric Display, Body 15.11x11.05mm

Part Description:
3 Digit, Red Seven Segments Magnified Monolithic Numeric Display


PackageDescription:
Warm White LED, Body 10x10.6mm, Pin spacing 5.08mm (Exposed Pad 10.7mm x 8.4mm)


PackageDescription:
High Brightness Tricolor (RGB) Surface Mount LED With Black Top Surface, Body 3x2.8mm

Part Description:
High Brightness Tricolor (RGB) Surface Mount LED With Black Top Surface


Part Description:
High Brightness Tricolor (RGB) Surface Mount LED With Black Surface


PackageDescription:
LED, Red, Body Dia. 3.43 mm, Pin spacing 2.54mm


PackageDescription:
LED, Yellow, Body Dia. 3.43 mm, Pin spacing 2.54mm


PackageDescription:
LED, Green, Body Dia. 3.43 mm, Pin spacing 2.54mm


PackageDescription:
LED, Red, Body Dia. 5.08mm, Pin spacing 2.54mm


PackageDescription:
LED, Yellow, Body Dia. 5.08mm, Pin spacing 2.54mm


PackageDescription:
LED, Green, Body Dia. 5.08mm, Pin spacing 2.54mm


PackageDescription:
Bicolor High Efficiency Red/Green, 5mm Diameter LED, Leads Spacing 1.27mm

Part Description:
5mm Diameter, Bicolor High Efficiency Red/Green LED


PackageDescription:
Molded SMD AMBER LED, 2-Leads, Body 3.5x2.8mm, IPC Medium Density

Part Description:
Surface Mount 590nm Amber LED (PLCC-2 Case)


PackageDescription:
Amber Chip LED, 2-Leads, Body 1.7x1.1mm, Side Emitting Package

Part Description:
High Performance Right Angle Chip Amber LED


PackageDescription:
Red Chip LED, 2-Leads, Body 3.3x1.6mm, Side Emitting Package

Part Description:
High Performance Right Angle Chip Red LED


PackageDescription:
Red Chip LED, 2-Leads, Body 1.7x1.1mm, Side Emitting Package


PackageDescription:
Red Chip LED, 2-Leads, Body 3.2 x1.6mm, IPC Medium Density


PackageDescription:
Molded SMD ORANGE LED, 2-Leads, Body 3.5x2.8mm, IPC Medium Density

Part Description:
Surface Mount 602nm Orange LED (PLCC-2 Case)


PackageDescription:
Green Chip LED, 2-Leads, Body 3.3x1.6mm, Side Emitting Package

Part Description:
High Performance Right Angle Chip Green LED


PackageDescription:
Green Chip LED, 2-Leads, Body 1.7x1.1mm, Side Emitting Package


PackageDescription:
Surface Mount Red/Green Bicolor LED, Body 3.2mm X 2.8mm

Part Description:
Bicolor Red/Emerald Green Surface Mount LED


PackageDescription:
Right Angle Tricolor Surface Mount ChipLED, Body 2.5x1mm

Part Description:
Right Angle Tricolor (Blue, Red, Green) Surface Mount ChipLED


PackageDescription:
Molded SMD GREEN LED, 2-Leads, Body 3.5x2.8mm, IPC Medium Density

Part Description:
Surface Mount 569nm Emerald Green LED (PLCC-2 Case)


PackageDescription:
Green Chip LED, 2-Leads, Body 3.2 x1.6mm, IPC Medium Density


PackageDescription:
Red Diffused Chip LED, 2-Leads, Body 3.2 x1.6mm, IPC Medium Density

Part Description:
Red Diffused Surface Mount LED (1206 Case)


Part Description:
Surface Mount 525nm Green LED (PLCC-2 Case)


PackageDescription:
Molded SMD Blue LED, 2-Leads, Body 3.5x2.8mm, IPC Medium Density

Part Description:
Surface Mount 470nm Blue LED (PLCC-2 Case)


PackageDescription:
Blue Chip LED, 2-Leads, Body 1.7x1.1mm, Side Emitting Package

Part Description:
High Performance Right Angle Chip InGaN Blue LED


PackageDescription:
Yellow Diffused Chip LED, 2-Leads, Body 3.2 x1.6mm, IPC Medium Density

Part Description:
Yellow Diffused Surface Mount LED (1206 Case)


PackageDescription:
Molded SMD RED LED, 2-Leads, Body 3.5x2.8mm, IPC Medium Density

Part Description:
Surface Mount 630nm Red LED (PLCC-2 Case)


PackageDescription:
Quad-Level Board Indicator with 4  Single Rectangular 2x3mm Yellow LED, BIVAR H480C Series

Part Description:
Quad-Level Board Indicator with 4  Single Rectangular 2x3mm Yellow LED, BIVAR H480C Series


PackageDescription:
Quad-Level 2mm Blue LED, PCB Edge Mounting  BIVAR H485C Serie

Part Description:
Quad-Level 2mm Blue LED, PCB Edge Mounting


PackageDescription:
Quad-Level 2mm Green, PCB Edge Mounting  BIVAR H485CHDL

Part Description:
Quad-Level 2mm Green LED, PCB Edge Mounting


PackageDescription:
Quad-Level 2mm HE Red, PCB Edge Mounting  BIVAR H485CHDL

Part Description:
Quad-Level 2mm HE Red LED, PCB Edge Mounting


PackageDescription:
Quad-Level 2mm (Green+Green+HeRed+HeRed) LED, PCB Edge Mounting  BIVAR H485C Serie

Part Description:
Quad-Level 2mm (Green+Green+HeRed+HeRed) LED, PCB Edge Mounting


PackageDescription:
PLCC4 3 in 1 Surface Mount Red/Green/Blue LED With Black Top Surface, Body 3.2mm X 2.8mm

Part Description:
PLCC4 3 in 1 Surface Mount Tricolor (Red/Green/Blue) LED With Black Top Surface


PackageDescription:
SMT Amber LED, XLAMP® XP-E2 Case , Body L 3.45 x W 3.45mm H 2.26mm


PackageDescription:
SMT Green LED, XLAMP® XP-E2 Case , Body L 3.45 x W 3.45mm H 2.26mm


PackageDescription:
SMT Red LED, XLAMP® XP-E2 Case , Body L 3.45 x W 3.45mm H 2.26mm


PackageDescription:
Single 5mm Bi-color Red/Green LED, Body 5.84x6.1mm (Square Back Housing), Leads Spacing 2.54mm

Part Description:
5mm Bi-Color Red/Green LED CBI® Circuit Board Indicator (Square Back Housing)


PackageDescription:
Bicolor Red/Green  LED, 3-Leads, Body 9.65x7.62mm, Leads Spacing 2.54mm

Part Description:
5mm LED CBI® Circuit Board Indicator, 3 Leaded, Bi-Color Red/Green, Common Cathode


PackageDescription:
Single 3mm Green LED, Body 10x5mm, Pin spacing 2.54mm

Part Description:
Single 3mm Green LED CBI® Circuit Board Indicator, High Efficiency


PackageDescription:
Single 3mm Green LED, Body 6.35x4.32mm, Pin spacing 2.54mm


PackageDescription:
Single 3mm Red LED, Body 6.35x4.32mm, Pin spacing 2.54mm

Part Description:
Single 3mm Red LED CBI® Circuit Board Indicator


PackageDescription:
Single 3mm Yellow LED, Body 6.35x4.32mm, Pin spacing 2.54mm

Part Description:
Single 3mm Yellow LED CBI® Circuit Board Indicator


Part Description:
Single 3mm Green LED CBI® Circuit Board Indicator


PackageDescription:
Dual 3mm Red LED, Body 10.55x4.32mm, Pin spacing 2.54mm

Part Description:
Dual 3mm Red LED CBI® Circuit Board Indicator


PackageDescription:
Dual 3mm LED  (Top: Red, Bot: Green), Body 10.55x4.32mm, Pin spacing 2.54mm

Part Description:
Dual 3mm LEDs, Red Top, Green Bot, CBI® Circuit Board Indicator


PackageDescription:
Dual 3mm Green LED, Body 10.55x4.32mm, Pin spacing 2.54mm

Part Description:
Dual 3mm Green LED CBI® Circuit Board Indicator


PackageDescription:
Dual 3mm Yellow LED, Body 10.55x4.32mm, Pin spacing 2.54mm

Part Description:
Dual 3mm Yellow LED CBI® Circuit Board Indicator


PackageDescription:
Dual 3mm Blue LED, Body 8.1x4.3mm, Pin spacing 2.54mm

Part Description:
Dual 3mm Blue LED CBI® Circuit Board Indicator


Part Description:
Dual 3mm Green LED CBI® Circuit Board Indicator, Low Current


PackageDescription:
Dual 3mm Green LED, Body 8.1x4.3mm, Pin spacing 2.54mm


Part Description:
Dual 3mm Yellow LED CBI® Circuit Board Indicator, Low Current


Library Ref:
LED x2 Red-Green 1CRAG 2ARCG-BOT 3CRAG 4ARCG-TOP

PackageDescription:
Bi-Level 2x3mm Bi-Color Red/Green, LED CBI Circuit Board Indicator

Part Description:
Bi-Level 2x3mm Round Bi-Color Red/Green LED CBI Circuit Board Indicator


PackageDescription:
Single 2mm Red LED, Body 5.08x2.54mm, Pin spacing 2.54mm

Part Description:
Single 2mm Red LED CBI® Circuit Board Indicator


Part Description:
Single 2mm Red LED CBI® Circuit Board Indicator with Integral Resistor for 5V


PackageDescription:
Single 2mm Green LED, Body 5.08x2.54mm, Pin spacing 2.54mm

Part Description:
Single 2mm Green LED CBI® Circuit Board Indicator


Part Description:
Single 2mm Green LED CBI® Circuit Board Indicator with Integral Resistor for 5V


PackageDescription:
Single 2mm Yellow LED, Body 5.08x2.54mm, Pin spacing 2.54mm

Part Description:
Single 2mm Yellow LED CBI® Circuit Board Indicator


Part Description:
Single 2mm Yellow LED CBI® Circuit Board Indicator with Integral Resistor for 5V


PackageDescription:
Single Vertical 5mm HE Green LED With Housing Stand-off (D 7.1mmx H 6.985mm), Overall Height 12.7mm

Part Description:
Single Vertical 5mm HE Green LED With Housing Stand-off (D 7.1mmx H 6.985mm), Overall Height 12.7mm


PackageDescription:
Single Vertical 5mm HE Green LED With Housing Stand-off (D 7.1mmx H 9.52mm), Overall Height 15.24mm

Part Description:
Single Vertical 5mm HE Green LED With Housing Stand-off (D 7.1mmx H 9.52mm), Overall Height 15.24mm


PackageDescription:
3x Red LED 3mm PCB Edge Mounting DIALIGHT 564 Series


PackageDescription:
3x Green LED 3mm PCB Edge Mounting DIALIGHT 564 Series


Library Ref:
LED x3 Red-Green 1CRAG 2ARCG-BOT 3CRAG 4ARCG-MID 5CRAG 6ARCG-TOP

PackageDescription:
3x Red-Green Led 3mm PCB Edge Mounting DIALIGHT 564 Series


Library Ref:
LED x3 Red-Green 1CGAR 2AGCR-BOT 3CGAR 4AGCR-MID 5CGAR 6AGCR-TOP


PackageDescription:
Quad-Level 4x3mm Bi-Color Red/Green, LED CBI Circuit Board Indicator

Part Description:
Quad-Level 4x3mm Round Bi-Color Red/Green LED CBI Circuit Board Indicator


PackageDescription:
Quad-Level 4x2mm Rectangular Bi-Color Red/Green LED CBI Circuit Board Indicator

Part Description:
Quad-Level 4x2mm Rectangular Bi-Color Red/Green LED CBI Circuit Board Indicator


PackageDescription:
3x 2mm LED (Top: Red , Middle: Red, Bot: Green) PCB Edge Mounting DIALIGHT 570 Serie

Part Description:
Triple 2mm CBI® LEDs, Red Top, Red Middle, Green Bottom


PackageDescription:
3x 2mm LED (Top: Green , Middle: Green, Bot: Blank) PCB Edge Mounting DIALIGHT 570 Serie

Part Description:
Triple 2mm CBI® LEDs, Green Top, Green Middle, Blank Bottom


PackageDescription:
3x Green LED 2mm PCB Edge Mounting DIALIGHT 570 Serie


PackageDescription:
3x 2mm LED (Top: Green , Middle: Green, Bot: Yellow) PCB Edge Mounting DIALIGHT 570 Serie

Part Description:
Triple 2mm CBI® LEDs, Green Top, Green Middle, Yellow Bottom


PackageDescription:
3x 2mm LED (Top: Yellow , Middle: Yellow, Bot: Blank) PCB Edge Mounting DIALIGHT 570 Serie

Part Description:
Triple 2mm CBI® LEDs, Yellow Top, Yellow Middle, Blank Bottom


PackageDescription:
3x Yellow LED 2mm PCB Edge Mounting DIALIGHT 570 Serie


PackageDescription:
2x 2mm Red LED PCB Edge Mounting (With positioning pins) DIALIGHT 571 Serie

Part Description:
Dual 2mm Red LEDs CBI® Circuit Board Indicator (With positioning pins)


PackageDescription:
2x 2mm Red LED PCB Edge Mounting (Without positioning pins) DIALIGHT 571 Serie

Part Description:
Dual 2mm Red LEDs CBI® Circuit Board Indicator (Without positioning pins)


PackageDescription:
2x 2mm LED (Top: Red, Bot: Green) PCB Edge Mounting (With positioning pins) DIALIGHT 571 Serie

Part Description:
Dual 2mm  LEDs, Red Top,Green Bot, CBI® Circuit Board Indicator (With positioning pins)


PackageDescription:
2x 2mm LED (Top: Red, Bot: Green) PCB Edge Mounting (Without positioning pins) DIALIGHT 571 Serie

Part Description:
Dual 2mm  LEDs, Red Top,Green Bot, CBI® Circuit Board Indicator (Without positioning pins)


Part Description:
Dual 2mm Green LEDs CBI® Circuit Board Indicator (With positioning pins)


Part Description:
Dual 2mm Green LEDs CBI® Circuit Board Indicator (Without positioning pins)


PackageDescription:
2x 2mm LED (Top: Green, Bot: Yellow) PCB Edge Mounting (With positioning pins) DIALIGHT 571 Serie

Part Description:
Dual 2mm  LEDs, Green Top, Yellow Bot, CBI® Circuit Board Indicator (With positioning pins)


PackageDescription:
2x 2mm LED (Top: Green, Bot: Yellow) PCB Edge Mounting (Without positioning pins) DIALIGHT 571 Serie

Part Description:
Dual 2mm  LEDs, Green Top, Yellow Bot, CBI® Circuit Board Indicator (Without positioning pins)


PackageDescription:
2x 2mm LED (Top: Yellow, Bot: Green) PCB Edge Mounting (With positioning pins) DIALIGHT 571 Serie

Part Description:
Dual 2mm  LEDs, Yellow Top,Green Bot, CBI® Circuit Board Indicator (With positioning pins)


PackageDescription:
2x 2mm LED (Top: Yellow, Bot: Green) PCB Edge Mounting (Without positioning pins) DIALIGHT 571 Serie

Part Description:
Dual 2mm  LEDs, Yellow Top,Green Bot, CBI® Circuit Board Indicator (Without positioning pins)


PackageDescription:
2x 2mm Yellow LED PCB Edge Mounting (With positioning pins) DIALIGHT 571 Serie

Part Description:
Dual 2mm Yellow LEDs CBI® Circuit Board Indicator (With positioning pins)


PackageDescription:
2x 2mm Yellow LED PCB Edge Mounting (Without positioning pins) DIALIGHT 571 Serie

Part Description:
Dual 2mm Yellow LEDs CBI® Circuit Board Indicator (Without positioning pins)


PackageDescription:
Surface Mount Green LED, Body 6.1mm X4.32mm

Part Description:
Right Angle 3mm Prism® Single-color  (Green) Surface Mount LED Indicator, 591 Series


PackageDescription:
Surface Mount Red/Green LED, Body 6.1mm X4.32mm

Part Description:
Right Angle 3mm Prism® bi-color  (Red/Green) Surface Mount LED Indicator, 591 Series


PackageDescription:
3mm Bi-Level (Top: Green, Bot: Green) Prism CBI Bi-color Surface Mount LED 592 Serie

Part Description:
3mm Bi-Level (Top: Green, Bot: Green) Prism CBI Surface Mount LED 592 Series


PackageDescription:
3mm Bi-Level (Top: Yellow, Bot: Yellow) Prism CBI Bi-color Surface Mount LED 592 Serie

Part Description:
3mm Bi-Level (Top: Yellow, Bot: Yellow) Prism CBI Bi-color Surface Mount LED 592 Series


PackageDescription:
3mm Bi-Level (Top: HeRed, Bot: HeRed) Prism CBI Bi-color Surface Mount LED 592 Serie

Part Description:
3mm Bi-Level (Top: HeRed, Bot: HeRed) Prism CBI Bi-color Surface Mount LED 592 Series


PackageDescription:
3mm Bi-Level (Top: Red, Bot: Red) Prism CBI Bi-color Surface Mount LED 592 Serie

Part Description:
3mm Bi-Level (Top: Red, Bot: Red) Prism CBI Surface Mount LED 592 Series


PackageDescription:
3mm Bi-Level (Top: HeRed, Bot: Green) Prism CBI Bi-color Surface Mount LED 592 Serie

Part Description:
3mm Bi-Level (Top: HeRed, Bot: Green) Prism CBI Bi-color Surface Mount LED 592 Series


PackageDescription:
3mm Bi-Level (Top: Red, Bot: Green) Prism CBI Bi-color Surface Mount LED 592 Serie

Part Description:
3mm Bi-Level (Top: Red, Bot: Green) Prism CBI Surface Mount LED 592 Series


PackageDescription:
3mm Bi-Level (Top: Blue, Bot: Blue) Prism CBI Bi-color Surface Mount LED 592 Serie

Part Description:
3mm Bi-Level (Top: Blue, Bot: Blue) Prism CBI Bi-color Surface Mount LED 592 Series


PackageDescription:
3mm Bi-Level (Top: Red/Green, Bot: Red/Green) Prism CBI Bi-color Surface Mount LED 592 Serie

Part Description:
3mm Bi-Level (Top: Red/Green, Bot: Red/Green) Prism CBI Bi-color Surface Mount LED 592 Series


PackageDescription:
Yellow 3mm Tri-Level Prism CBI Surface Mount LED DIALIGHT 593 Serie

Part Description:
Surface Mount  Yellow 3mm Tri-Level Prism CBI LED


PackageDescription:
Blue 3mm Tri-Level Prism CBI Surface Mount LED DIALIGHT 593 Serie

Part Description:
Surface Mount  Blue 3mm Tri-Level Prism CBI LED


PackageDescription:
SMT GaAlAs Red LED,Body 3x2mm, 1208 Case,  DIALIGHT 597 Series

Part Description:
Right Angle SMT GaAIAs Red LED, 597 Series


PackageDescription:
SMT AlGaAs Red LED,Body 3x1.6mm (1208),  DIALIGHT 597 Serie


PackageDescription:
SMT Green LED,Body 3x1.6mm (1208),  DIALIGHT 597 Serie


PackageDescription:
SMT Yellow LED,Body 3x1.6mm (1208),  DIALIGHT 597 Serie


PackageDescription:
Bicolor Red/Green SMD LED, Body L 3mm x  W 2.5mm, DIALIGHT 597 Series

Part Description:
Bicolor Red/Green Surface Mount LED, 597 Series


PackageDescription:
Bicolor Yellow/Green SMD LED, Body L 3mm x  W 2.5mm, DIALIGHT 597 Series

Part Description:
Bicolor Yellow/Green Surface Mount LED, 597 Series


PackageDescription:
SMT Red LED, Body 1.6x0.8mm, 0603 Case,  DIALIGHT 598 Series


PackageDescription:
SMT Yellow-Green LED, Body 1.6x0.8mm, 0603 Case,  DIALIGHT 598 Series


PackageDescription:
7.6mm Square Domed Tricolor (RGB) Through Hole LED Lamp

Part Description:
7.6mm Square Domed Tricolor (RGB) Through Hole LED Lamp


PackageDescription:
20mm Diameter Super Bright Red (GaAlAs) Big LED Lamp

Part Description:
20mm Diameter Super Bright Red (GaAlAs) Big LED Lamp


PackageDescription:
SMT Green LED, Right Angle Mount, Body L 1.6 x W 0.6mm H 1.2mm

Part Description:
SMD Green LED, Right Angle Mount, Body L 1.6 x W 0.6mm, 1.2mm Thickness


PackageDescription:
SMT Green LED, Case 0603, Body L 1.6 x W 0.8mm H 0.65mm

Part Description:
SMD Green LED, Case 1.6mmX0.8mm(0603), 0.65mm Thickness


PackageDescription:
SMT Blue LED, Case 0603, Body L 1.6 x W 0.8mm H 0.65mm

Part Description:
SMD Blue LED, Case 1.6mmX0.8mm(0603), 0.65mm Thickness


PackageDescription:
SMT Hyper Red LED, Case 0603, Body L 1.6 x W 0.8mm H 0.65mm

Part Description:
SMD Hyper Red LED, Case 1.6mmX0.8mm(0603), 0.65mm Thickness


PackageDescription:
SMT Yellow LED, Case 0603, Body L 1.6 x W 0.8mm H 0.65mm

Part Description:
SMD Yellow LED, Case 1.6mmX0.8mm(0603), 0.65mm Thickness


PackageDescription:
Reverse Mount LED 3216, Hole 2.1x2.3mm 0.35mm Height


Part Description:
Reverse Mount LED 1.4x1.6mm Super Bright Yellow


PackageDescription:
10mm Diameter, Bicolor Red/Green LED Lamp

Part Description:
10mm Diameter, Bicolor Red/Green LED Lamp


PackageDescription:
Bi-Color Red/ Green 3mm LED, Pin spacing 2.54mm


PackageDescription:
SMD InGaN Blue LED, 2-Leads, Body 3.2x1.6mm


PackageDescription:
2x 3mm LED (Top: Red, Bot: Green) Body 10x5.08mm, Pin spacing 2.54mm

Part Description:
Dual 3mm PCB Edge Mounting LEDs (Red Top, Green Bot)


PackageDescription:
Dual 3mm Red LED, Body 10x5.08mm, Pin spacing 2.54mm


PackageDescription:
Dual 3mm Yellow LED, Body 10x5.08mm, Pin spacing 2.54mm


PackageDescription:
Dual 3mm Green LED, Body 10x5.08mm, Pin spacing 2.54mm


PackageDescription:
2 x LED 3mm  (Top: Red, Bot: Yellow) PCB Edge Mounting MENTOR 1801.1831

Part Description:
Dual 3mm  LED, PCB Edge Mounting (Top: Red, Bot: Yellow)


PackageDescription:
2 x HEFF Red LED 3mm PCB Edge Mounting MENTOR 1801.2233

Part Description:
Dual 3mm High Efficiency Red LED, PCB Edge Mounting


PackageDescription:
2 x LED 3mm  (Top: Yellow, Bot: Yellow) PCB Edge Mounting MENTOR 1801.7733


PackageDescription:
2 x LED 3mm  (Top: Red, Bot: Green) PCB Edge Mounting MENTOR 1801.8233

Part Description:
Dual PCB Edge Mounting  3mm LED (Top: Red, Bot: Green)


PackageDescription:
2 x LED 3mm  (Top: Green, Bot: Green) PCB Edge Mounting MENTOR 1801.8833


PackageDescription:
5mm Green LED, PCB Edge Mounting, Body 19.66 x 10.6mm

Part Description:
5mm Green LED, PCB Edge Mounting, Low Current Version


PackageDescription:
3x Red LED 3mm PCB Edge Mounting MENTOR 1882.2221


PackageDescription:
3x LED 3mm (Red+Yellow +Green) PCB Edge Mounting MENTOR 1882.2781

Part Description:
Triple 3mm LEDs, Red Top, Yellow Mid, Green Bot, PCB Edge Mounting


PackageDescription:
3x Green LED 3mm PCB Edge Mounting MENTOR 1882.2221

Part Description:
Triple 3mm Green LEDs, PCB Edge Mounting


PackageDescription:
Vertical 3mm Green LED, Pin spacing 2.54mm, Body 5.92mm x 3.7mm


PackageDescription:
8x Diameter 3mm Green LED Vertical Array

Part Description:
8x Diameter 3mm Green LED Vertical LED Array


PackageDescription:
3 LED of 8x Diameter 3mm Green LED Vertical Array

Part Description:
3 LED of a Vertical Array of 8 Green 3mm LED


PackageDescription:
10x Diameter 5mm Green LED Vertical LED Array

Part Description:
10x Diameter 5mm Green LED Vertical LED Array


PackageDescription:
3 LED of a Vertical Array of 10 Green 5mm LED

Part Description:
3 LED of a Vertical Array of 10 Green 5mm LED


PackageDescription:
8x Diameter 2mm Green LED Horizontal LED Array

Part Description:
8x Diameter 2mm Green LED Horizontal LED Array


PackageDescription:
Top Mount, Full-Color (RGB), 1204 Surface Mount LED (150° Viewing Angle)

Part Description:
Top Mount, Full-Color (RGB), 1204 Surface Mount LED (150° Viewing Angle)


PackageDescription:
Side Mount, Full-Color (RGB), 1204 Surface Mount LED (150° Viewing Angle)

Part Description:
Side Mount, Full-Color (RGB), 1204 Surface Mount LED (150° Viewing Angle)


PackageDescription:
Green Chip LED, 2-Leads, Body 1.7x0.8mm, IPC Medium Density


PackageDescription:
Green Chip LED, 2-Leads, Body 2.0x1.25mm, IPC Medium Density


PackageDescription:
Orange Chip LED, 2-Leads, Body 2 x1.25mm, IPC Medium Density


PackageDescription:
Chip Super Red LED, 2-Leads, Body 1.6x0.8mm


PackageDescription:
Super Red Chip LED, 2-Leads, Body 2 x1.25mm, IPC Medium Density


PackageDescription:
Molded LED, 2-Leads, Body 3.5x2.8mm, IPC Medium Density PCB Edge Mounting


PackageDescription:
Bicolor Red/Green  LED 1 Anode Red 2 Com Cathode 3 Anode Green, Body Dia. 5.08mm, Pin spacing 2.54mm


PackageDescription:
Yellow Chip LED, 2-Leads, Body 3.2 x1.6mm, IPC Medium Density


PackageDescription:
Yellow Chip LED, 2-Leads, Body 2 x1.25mm, IPC Medium Density


PackageDescription:
Chip Red LED, 2-Leads, Body 1.6x0.8mm, IPC Medium Density


PackageDescription:
Red Chip LED, 2-Leads, Body 1.6x0.8mm (0603), SML-D12x8 Series

Part Description:
High Brightness and High Reliability Chip 0603(1608mm) Red LED SML-D12x8 Series


PackageDescription:
5mm Infrared Emitting Diode, VISHAY TSAL

Part Description:
5mm High Power Infrared Emitting Diode, 940 nm, GaAlAs/GaAs


PackageDescription:
PLCC-2 Molded SMD Blue LED, Body 3.5x2.8mm


PackageDescription:
Molded SMD Green LED, 2-Leads, Body 3.5x2.8mm, VLMC3100 Series

Part Description:
Low Current Molded SMD Green LED, VLMC3100 Series


PackageDescription:
Molded SMD Orange LED, 2-Leads, Body 3.5x2.8mm, VLMO3100 Series

Part Description:
Low Current Molded SMD Orange LED, VLMO3000 Series


PackageDescription:
Molded SMD Super Red LED, 2-Leads, Body 3.5x2.8mm, VLMC3100 Series

Part Description:
Low Current Molded SMD Super Red LED, VLMS3000 Series


PackageDescription:
Molded SMD Red LED, 2-Leads, Body 3.5x2.8mm, VLMT3100 Series

Part Description:
Low Current Molded SMD Red LED, VLMT3100 Series


PackageDescription:
Right Angle Single Element 3.56mm Round Lightpipe

Part Description:
Right Angle Single Element 3.56mm Round Lightpipe


PackageDescription:
Right Angle Tri-Level 2.5mm Round Light Pipe, Body 22.9 x5.22mm

Part Description:
Right Angle Tri-Level 2.5mm Round Light Pipe


PackageDescription:
2 Array 1.9mm Round Horizontal Light Pipe, Body 55.8 x11.68mm

Part Description:
2 Array 1.9mm Round Horizontal Light Pipe


PackageDescription:
Right Angle Double Line 3mm Light Guide, 10x2-fold display, Body 49.12 x 23.6mm

Part Description:
Right Angle Double Line 3mm Light Guide, 10x2-Fold Display


PackageDescription:
Right Angle Tri-Level 3mm Round Light Pipe, Body 25.2 x 11.3mm


PackageDescription:
32-Way in Four Rows, Right Angle 3mm Diameter LED Light Pipe, Body 40.06mm x 21.9mm

Part Description:
32-Way in Four Rows, Right Angle 3mm Diameter LED Light Pipe


PackageDescription:
8-Way in Four Rows, Right Angle 2mm Diameter LED Light Pipe, Body 16.95mm x 5.7mm

Part Description:
8-Way in Four Rows, Right Angle 2mm Diameter LED Light Pipe


# Logic

PackageDescription:
BGA, 0.80mm Pitch, Square; 169 Pin,13 Columns X 13 Rows,11.00mm X 11.00mm X 1.55mm H

Part Description:
MAX 10 FPGA, Single-Supply 3.3V, 130IOs,  2K Logic Elements, 169-Pin UBGA, Commercial Temperature, Speed Grade 8, RoHS


PackageDescription:
QFP, 0.50mm Pitch, Square; 144 Pin, 20.00mm X 20.00mm (w/thermal Tab 5.15mm X 5.15mm), IPC Medium Density

Part Description:
MAX 10 FPGA, Single-Supply 3.3V, 101IOs,  8K Logic Elements, 144-Pin QFP, Commercial Temperature, Speed Grade 8, RoHS6


PackageDescription:
BGA,1.00mm Pitch, Square; 484 Pin,22 Columns X 22 Rows,23.00mm X 23.00mm X 2.00mm H

Part Description:
MAX 10 FPGA, Dual-Supply 1.2V/2.5V, 360 IOs, 50K Logic Elements, 484-Pin FBGA, Commercial Temperature, Speed Grade 6, RoHS6


PackageDescription:
SOIC 8, Pitch 1.27mm - Body 4x5mm, IPC Medium Density

Part Description:
1.7V-5.5V, 2K I2C™ Serial EEPROMs with EUI-48™ Node Identity


PackageDescription:
SOT, 0.95mm pitch; 5 pin, 1.60mm W X 2.90mm L X 1.45mm H body, IPC Medium Density

Part Description:
1.7V-5.5V, 2K I2C Serial EEPROM With EUI-48 Node Identity


Part Description:
1.7V-5.5V, 256K (32k x 8-bit) I2C Serial EEPROM


PackageDescription:
SON (DFN), 0.50mm pitch, 8 pin, 2mm X 3mm X 1.00mm H body (w/thermal tab 1.75 X 1.55mm),  IPC Medium Density

Part Description:
1.7V-5.5V, 64K  (8K x 8-bit) I2C Serial EEPROM


PackageDescription:
SOP, 0.65mm pitch; 8 pin, 3.00mm W X 3.00mm L X 1.10mm H body, IPC Medium Density


Part Description:
1.7V-5.5V, 64K (8K x 8-bit) I2C Serial EEPROM


Part Description:
2.5V-5.5V, 2K (256 x 8-bit) I2C Serial EEPROM With Half-Array Write Protect


Part Description:
2.5V-5.5V, 256K (32k x 8-bit) I2C Serial EEPROM


Part Description:
2.5V-5.5V, 64K (8K x 8-bit) I2C Serial EEPROM


PackageDescription:
BGA, 1.00mm Pitch, Square; 1517 Pin, 39 Columns X 39 Rows, Body 40.00mm X 40.00mm X 3.50mm H, IPC Medium Density

Part Description:
Arria V GT Familly FPGA, 504k Logic Elements, 1517-Pin BGA, Speed Grade 3, Industrial Temperature Grade, Pb-Free


PackageDescription:
BGA, 1.00mm Pitch, Square; 1517 Pin, 39 Columns X 39 Rows, 40.00mm X 40.00mm X 2.70mm H

Part Description:
Arria V GX Familly FPGA, 300k Logic Elements, 1517-Pin BGA, Speed Grade 4, Commercial Temperature Grade, Pb-Free


PackageDescription:
BGA,1.00mm pitch,square;484 pin,22 columns X 22 rows,23.00mm X 23.00mm X 2.00mm H

Part Description:
Cyclone V E Family FPGA, 1.07 to 1.13 V Supply, 224 I/O Pins, 4 PLLs, 484-Pin FBGA, Speed Grade 8, Commercial Grade, RoHS Compliant


Part Description:
Cyclone V E Family FPGA, 1.07 to 1.13 V Supply, 240 I/O Pins, 6 PLLs, 484-Pin FBGA, Speed Grade 8, Commercial Grade, RoHS Compliant


PackageDescription:
BGA, 1.00mm Pitch, Square; 672 Pin, 26 Columns X 26 Rows, 27.00mm X 27.00mm X 2.00mm H

Part Description:
Cyclone V E Family FPGA, 1.07 to 1.13 V Supply, 336 I/O Pins, 7 PLLs, 672-Pin FBGA, Speed Grade 8, Commercial Grade, RoHS Compliant


PackageDescription:
QFP, 144-Leads, Body 20x20mm (BSC), Pitch 0.50mm, IPC Medium Density

Part Description:
MAX V 1.8V CPLD, 114 IOs, 1270 Logic Elements, 144-Pin TQFP, Commercial Temperature, Speed Grade 5, Pb-Free


Part Description:
MAX V 1.8V CPLD, 114 IOs, 1270 Logic Elements, 144-Pin TQFP, Industrial Temperature, Speed Grade 5, Pb-Free


PackageDescription:
QFP, 0.40mm Pitch, Square; 64 Pin, 7.00mm L X 7.00mm W X 1.20mm H Body (w/Thermal Tab), IPC Medium Density

Part Description:
MAX V 1.8V CPLD, 54 IOs, 160 Logic Elements, 64-Pin EQFP, Automotive Temperature, Speed Grade 5, Pb-Free


PackageDescription:
BGA 1mm, Pitch, Square 256 Pin, 16 Columns x 16 Rows, Body 17mm X 17mm X 1.55mm H

Part Description:
MAX V 1.8V CPLD, 203 IOs, 2210 Logic Elements, 256-Pin FBGA, Commercial Temperature, Speed Grade 5, Pb-Free


PackageDescription:
BGA, 1.00mm Pitch, Square;324 Pin, 18 Columns X 18 Rows, 19.00mm X 19.00mm X 1.55mm H

Part Description:
MAX V 1.8V CPLD, 271 IOs, 2210 Logic Elements, 324-Pin FBGA, Commercial Temperature, Speed Grade 4, Pb-Free


Part Description:
MAX V 1.8V CPLD, 54 IOs, 40 Logic Elements, 64-Pin EQFP, Commercial Temperature, Speed Grade 5, Pb-Free


Part Description:
MAX V 1.8V CPLD, 114 IOs, 570 Logic Elements, 144-Pin Plastic TQFP, Commercial Temperature, Speed Grade 5, Pb-Free


Part Description:
MAX V 1.8V CPLD, 114 IOs, 570 Logic Elements, 144-Pin Plastic TQFP, Industrial Temperature, Speed Grade 5, Pb-Free


PackageDescription:
QFN, 0.40mm pitch, square; 27 pin X 27 pin, 12.00mm X 12.00mm, IPC Medium Density

Part Description:
7 Port Gigabit AVB Switch With 2 PHYs And Energy Efficient Ethernet (EEE)


PackageDescription:
SOT, 0.95mm Pitch; 6 Pin,1.55mm W X 2.90mm L X 1.45mm H body, IPC Medium Density

Part Description:
2K, 128X16-bit, 2.5V Microwire Compatible Serial EEPROM


PackageDescription:
DIP 8 Leads, Row Spacing 7.62mm; Pitch 2.54mm

Part Description:
4K, 256x16-bit, 2.5V Microwire Serial EEPROM, 8-Pin PDIP, Industrial Temperature


PackageDescription:
BGA, 288-Leads, Body 11x11mmx1.05mm, Pitch 0.50mm

Part Description:
SmartFusion Intelligent Mixed-Signal FPGA with ARM Cortex-M3, 200000 System Gates, 288-Pin CSP, Standard Speed Grade, Industrial Grade, Pb-Free


PackageDescription:
QFN, 0.40mm Pitch, Square; 48 Pin, 6.00mm L X 6.00mm W X 1.00mm H body (w/thermal tab 4.8 X 4.8mm), IPC Medium Density

Part Description:
ProASIC3 Flash Family FPGA, 34 User IOs, 30K System Gates, 1 Kbit ProASIC3 Flash ROM, 48-Pin QFN, Commercial Grade, Pb-Free


PackageDescription:
QFP,0.50mm pitch,square;100 pin,14.00mm L X 14.00mm W X 1.20mm H body, IPC Medium Density

Part Description:
ProASIC3 Flash Family FPGA, 77 User IOs, 30K System Gates, 1 Kbit Flash ROM,Commercial Grade, Pb-Free


Part Description:
ProASIC3 Flash Family FPGA, 71 User Ios, 60K System Gates, 18 Kbits RAM, 1 Kbit Flash ROM, 1 PLL, Commercial Grade, Pb-Free


PackageDescription:
SQFP, 208-Leads, Body 28x28mm (BSC), Pitch 0.50mm, IPC Medium Density

Part Description:
ProASIC3 Flash Family FPGA, 154 User IOs, 1M System Gates, 144 Kbits RAM, 1 Kbit Flash ROM, 1 PLL, 208-Pin PQFP, Industrial Grade


Part Description:
ProASIC3 Flash Family FPGA, 68 User IOs, 250K System Gates, 36 Kbits RAM, 1 Kbit Flash ROM, 1 PLL, 100-Pin VQFP, Commercial Grade, Pb-Free


Part Description:
ProASIC3 Flash Family FPGAs with Optional Soft ARM Support, 400K System Gates, 54 Kbits RAM, 1 Kbit Flash ROM, 1 PLL, Industrial Grade


Part Description:
ProASIC3 Flash Family FPGA, 154 User IOs, 600K System Gates, 108 Kbits RAM, 1 Kbit Flash ROM, 1 PLL, 208-Pin PQFP, Industrial Grade


PackageDescription:
BGA, 1.00mm Pitch, Square; 484 pin, 22 columns X 22 Rows, Body 23mm X 23mm X 2.40mm H, IPC Medium Density

Part Description:
ProASIC3E Flash Family FPGA, 280 User IOs, 1.5M System Gates, 270 Kbits RAM, 1 Kbit FlashROM, 6 PLLs, 484-Ball FBGA, Commercial Grade


Part Description:
ProASIC3E Flash Family FPGA, 147 User IOs, 1.5M System Gates, 270 Kbits RAM, 1 Kbit FlashROM, 2 PLLs, Commercial Grade


PackageDescription:
BGA, 1.00mm Pitch, Square; 896 Pin, 30 Columns X 30 Rows, 31.00mm X 31.00mm X 2.44mm H

Part Description:
ProASIC3E Flash Family FPGA, 620 User IOs, 3M System Gates, 504 Kbits RAM, 1 Kbit FlashROM, 6 PLLs, Commercial Grade


Part Description:
ProASIC3E Flash Family FPGA, 147 User IOs, 3M System Gates, 504 Kbits RAM, 1 Kbit FlashROM, 2 PLLs, Commercial Grade


Part Description:
A54SX08A FPGA, 130 User Ios, 208-Pin PQFP, Standard Speed Grade, Commercial Grade, Pb-Free


Part Description:
A54SX16A FPGA, 175 User Ios, 208-Pin PQFP, Standard Speed Grade, Commercial Grade, Pb-Free


Part Description:
A54SX32A FPGA, 174 User Ios, 208-Pin PQFP, Standard Speed Grade, Commercial Grade, Pb-Free


Part Description:
A54SX72A FPGA, 171 User Ios, 208-Pin PQFP, Standard Speed Grade, Commercial Grade, Pb-Free


PackageDescription:
QFN, 0.50mm Pitch, Square; 64 Pin, 9.00mm L X 9.00mm W X 1.00mm H Body (4.85 X 4.85mm Thermal Tab), IPC Medium Density

Part Description:
1.2 GHz Clock Distribution IC, PLL Core, Dividers, Delay Adjust, Eight Outputs


PackageDescription:
QFN, 0.50mm Pitch, Square; 48 Pin, 7.00mm L X 7.00mm W X 1mm H Body (W/Thermal Tab 5.25mm X 5.25mm), IPC Medium Density

Part Description:
1.2 GHz Clock Distribution IC, 1.6 GHz Inputs, Dividers, Delay Adjust, Five Outputs


PackageDescription:
QFN, (MO-220-VHHD-2) 0.50mm Pitch, Square; 8 pin X 8 pin, 5mm X 5mm X 1.00mm H body (w/thermal tab 3.25 X 3.25mm),  IPC Medium Density

Part Description:
800 MHz Clock Distribution IC, dividers, Delay Adjust, three Outputs


PackageDescription:
QFN, 0.50mm Pitch, Square; 64 pin,9.00mm L X 9.00mm W X 1.00mm H body (6.35mm X 6.35mm thermal tab), IPC Medium Density

Part Description:
14-Output Clock Generator with Integrated 2.8 GHz VCO


Part Description:
14-Output Clock Generator with Integrated 1.6 GHz VCO


Part Description:
12 LVPECL/24 CMOS Output Clock Generator with Integrated 2.8 GHz VCO


Part Description:
12 LVPECL/24 CMOS Output Clock Generator


PackageDescription:
QFN,0.50mm Pitch, Square;72 Pin,10.00mm L X 10.00mm W X 1.00mm H Body (W/Thermal Tab 5.45mm X 5.45mm), IPC Medium Density

Part Description:
Clock Generator with 14 LVDS/HSTL Outputs


PackageDescription:
QFN, 0.50mm Pitch, Square; 40 pin, 6.00mm L X 6.00mm W X 1.00mm H body (w/thermal tab), IPC Medium Density


PackageDescription:
SOP, 20-Leads, Body 6.6x4.5mm (max), Pitch 0.65mm, IPC Medium Density

Part Description:
8-Channel CMOS Logic to High Voltage Level Translator


PackageDescription:
BGA, 0.80mm Pitch; Square 136 Pin, 14 Columns X 14 Rows,12.00mm X 12.00mm X 1.70mm H

Part Description:
Low Cost 32-Bit Floating-Point SHARC DSP


PackageDescription:
BGA, 1mm Pitch, Square 256 Pin, 16 Columns x 16 Rows, Body 17mm X 17mm X 1.70mm H

Part Description:
3.3V Fusion Mixed Signal Flash FPGA, 600,000 System Gates, 256-Pin FBGA, Industrial Grade, Pb-Free


PackageDescription:
BGA, 0.65mm Pitch, Square; 298 Pin, 19 Columns X 19 Rows, 13.00mm X 13.00mm X 1.30mm H


PackageDescription:
BGA, 0.80mm Pitch, Square; 324 Pin, 18 columns X 18 Rows,15.00mm X 15.00mm X 1.50mm H


PackageDescription:
BGA, 0.80mm Pitch, Rect.; 90 Pin, 9 Columns X 15 Rows, 8.00mm X 13.00mm X 1.00mm H

Part Description:
512M (32Mx32), 1.8V, 166MHz, Low Power Mobile SDRAM (MSDR)


PackageDescription:
SOIC, 1.27mm Pitch; 32 Pin, 11.30mm W X 20.445mm L X 3.00mm H body, IPC Medium Density


PackageDescription:
SOP, 0.80mm Pitch; 44 pin,10.30mm W X 18.54mm L X 1.20mm H body, IPC Medium Density

Part Description:
2.7V-5V Low Power 2M (128K x 16 Bit) CMOS SRAM


Part Description:
1.8V to 5.5V, 1K (128 x 8), 2-Wire Bus Serial EEPROM With Full Memory Write Protect


Part Description:
1.8V, 64K (8192 x 8), Two-Wire Serial EEPROM


Part Description:
1.7V to 5.5V, 64K (8192 x 8), I2C-Compatible (2-Wire) Serial EEPROM


PackageDescription:
SOP, 0.65mm pitch; 8 pin, 4.40mm W X 3.00mm L X 1.20mm H body, IPC Medium Density

Part Description:
1.7V to 5.5V, I2C-Compatible (2-wire) 2-Kbit (256 x 8) Serial EEPROM with a EUI-48 Address


Part Description:
1.7V to 5.5V, I2C-Compatible (2-wire) 2-Kbit (256 x 8) Serial EEPROM with a EUI-64 Address


PackageDescription:
BGA, 1.00mm Pitch, Body 6.00x6.00x0.60mm; 9 Pin, 3 Columns X 3 Rows

Part Description:
32 Mbit 2.7V Minimum,  SPI Serial Flash Memory


PackageDescription:
SOIC 16, Pitch 1.27mm - Body 7.5x10.3mm, IPC Medium Density

Part Description:
32MBit 2.7V Minimum SPI Serial Flash Memory


PackageDescription:
SOIC 8, Pitch 1.27mm, Body 4x5mm, IPC Medium Density

Part Description:
512kBit 2.3V Minimum, SPI Serial Flash Memory with Dual-Read Support


Part Description:
512kBit 2.7V Minimum, SPI Serial Flash Memory


Part Description:
8MBit 2.7V Minimum, SPI Serial Flash Memory


PackageDescription:
QFP, 0.50mm Pitch, Square, 12 pin X 12 Pin, 7.00mm X 7.00mm X 1.20mm Body, IPC Medium Density

Part Description:
16Kb Flash/8Kb SRAM, High-performance, Low-power 32-bit Atmel® AVR® Microcontroller


PackageDescription:
QFN,0.40mm pitch,square;48 pin,5.50mm L X 5.50mm W X 0.60mm H body (w/pullback leads,thermal tab 4.5 X 4.5mm), IPC Medium Density

Part Description:
64Kb Flash/16Kb SRAM, High-performance, Low-power 32-bit Atmel® AVR® Microcontroller


PackageDescription:
ATMEL 8CN3 Case, SON, 1.27mm Pitch; 8 Pin, 8.00mm W X 6.00mm L X 1.00mm H body

Part Description:
64-Megabit, 66MHz, 2.7V to 3.6V, Dual-Interface DataFlash®


PackageDescription:
QFP, 0.80mm Pitch, Square; 64 Pin, 14.00mm L X 14.00mm W X 1.20mm H Body, IPC Medium Density

Part Description:
8-bit AVR Microcontroller, 128KB Flash and CAN Controller, 53 GPIO pins, Industrial Grade (-40° to +85°C)


PackageDescription:
BGA, 0.50mm Pitch, Square; 247 Pin, 19 Columns X 19 Rows, 10.00mm X 10.00mm X 1.37mm H

Part Description:
AT91 ARM Thumb 32-bit Embedded MPU, 400MHz, 1V, Ethernet, HS USB, LPDDR/DDR2/MLC NAND support, 247-Pin BGA, Industrial Grade (-40°C to 85°C), Pb-Free


PackageDescription:
BGA, 0.80mm Pitch, Square; 324 Pin, 18 Columns X 18 Rows,15.00mm X 15.00mm X 1.20mm H

Part Description:
AT91 ARM Thumb 32-bit Embedded MPU, 400MHz, 64KB ROM, 64KB SRAM, EBI, E-MAC, HS USB, 24-ch. PDC, Industrial Grade, Pb-Free


Part Description:
8-bit AVR Microcontroller, 2.7-5.5V, 8MHz, 128KB Flash, 4KB EEPROM, 8KB SRAM, 86 GPIO pins, 100-pin TQFP, Industrial Grade (-40°C to 85°C), Pb-Free


PackageDescription:
QFN, 0.50mm Pitch, Square; 44 pin, 7.00mm L X 7.00mm W X 1mm H body (W/Thermal Tab 5.4mm X 5.4mm),  IPC Medium Density

Part Description:
8-bit AVR Microcontroller, 128K Bytes In-System Programmable Flash, Industrial Grade (-40°C to 85°C)


PackageDescription:
QFN, 0.50mm Pitch, Square; 64 Pin, 9.00mm L X 9.00mm W X 1.00mm H Body (5.6mm X 5.6mm Thermal Tab), IPC Medium Density

Part Description:
8-bit AVR Microcontroller, 2.7-5.5V, 16MHz, 128KB Flash, 4KB EEPROM, 4KB SRAM, 64-pin MLF, Industrial Grade (-40°C to 85°C)


PackageDescription:
QFP,0.80mm Pitch, Square; 32 Pin, 7.00mm L X 7.00mm W X 1.20mm H Body, IPC Medium Density

Part Description:
8-bit AVR Microcontroller, 32KB Flash, 1KB EEPROM, 2KB SRAM, 32-pin TQFP, Industrial Grade (-40°C to 85°C)


PackageDescription:
QFN, (MO-220-VHHD-2) 0.50mm pitch,square; 8 pin X 8 pin, 5mm X 5mm X 1.00mm H body (w/thermal tab 3.25 X 3.25mm),  IPC Medium Density

Part Description:
8-bit AVR Microcontroller, 32KB Flash, 1KB EEPROM, 2KB SRAM, 32-pin MLF, Industrial Grade (-40°C to 85°C)


PackageDescription:
QFP, 0.50mm Pitch, Square, 12 pin X 12 pin, 7.00mm X 7.00mm X 1.60mm Body, IPC Medium Density

Part Description:
32-bit ARM®-based Cortex®-M4 core Microcontroller, 1.62V to 3.6V, 120MHz, 256KB Flash, 64KB of SRAM, 48 QFP, Industrial Grade (-40°C to 85°C)


PackageDescription:
QFN, 0.50mm Pitch, Square; 24 Pin, 4.00mm L X 4.00mm W X 0.90mm H Body (w/Thermal Tab 2.75 X 2.75 mm), IPC Medium Density

Part Description:
32-bit ARM®-based Cortex®-M0+ core Microcontroller, 2.4V to 3.63V, 48MHz, 16KB Flash, 4 KB SRAM, 24 QFN, Temperature Range -40°C to 85°C


Part Description:
32-bit ARM®-based Cortex®-M0+ core Microcontroller, 1.62V to 3.6V, 48MHz, 256KB Flash, 32KB SRAM, 48 QFN, Temperature Range -40°C to 125°C


PackageDescription:
SOIC 14, Pitch 1.27mm - Body 4x8.75mm, IPC Medium Density

Part Description:
8-bit AVR Microcontroller, 1.8-5.5V, 2KB Flash, 128 Bytes SRAM, 12 GPIO pins, 14-pin SOIC, Industrial Grade (-40°C to 85°C), Pb-Free


PackageDescription:
SOP, 14-Leads, Body 5.1x4.5mm (max), Pitch 0.65mm, IPC Medium Density

Part Description:
8-bit AVR Microcontroller, 1.8-5.5V, 12MHz, 2KB Flash, 128 Bytes SRAM, 12 GPIO pins, 14-pin TSSOP, Industrial Grade (-40°C to 85°C), Pb-Free


Part Description:
8-bit AVR Microcontroller, 1.8-5.5V, 12MHz, 8KB Flash, 64 Bytes EEPROM, 512 Bytes SRAM, 32-pin TQFP, Industrial Grade (-40°C to 85°C), Pb-Free,


PackageDescription:
SOT23, 6-Leads, Body 1.6x3.0mm, Pitch 0.95mm, IPC Medium Density

Part Description:
8-bit AVR Microcontroller with 1024 Bytes In-System Programmable Flash


Part Description:
8/16-bit AVR XMEGA A1U Microcontroller, 1.6-3.6V, 128KB + 8KB Flash, 2KB EEPROM, 8KB SRAM, 100-pin TQFP, Industrial Grade (-40°C to 85°C), Pb-Free


Part Description:
8/16-bit XMEGA A3BU 32MHz Microcontroller With 256KBytes of in-System Self-Programmable Flash


PackageDescription:
QFN, 0.50mm Pitch, Square; 64 Pin, 9.00mm L X 9.00mm W X 1.00mm H Body (7.8 X 7.8mm Thermal Tab), IPC Medium Density

Part Description:
8-bit AVR Microcontroller, 1.6-3.6V, 32MHz, 256KB+8KB Flash, 4KB EEPROM, 16KB SRAM, 64-pin VQFN, Industrial Grade (-40°C to 85°C)


PackageDescription:
VQFN, 0.50mm pitch, square; 8 pin X 8 pin, 5mm X 5mm X 1.00mm H body (w/thermal tab 3.45 X 3.45mm), IPC Medium Density


PackageDescription:
SOP,0.80mm pitch;44 pin,10.30mm W X 18.54mm L X 1.20mm H body, IPC Medium Density


Part Description:
1.7V-5.5V, 8K (1K × 8-Bit) I2C Serial EEPROM Memory


PackageDescription:
QFN, 0.40mm Pitch, Square; 32 Pin, 4.00mm L X 4.00mm W X 1.00mm H body (W/Thermal Tab 2.9mm X 2.9mm), IPC Medium Density

Part Description:
Powerful ARM® Cortex®-M3, SimpleLink™ Multistandard Wireless MCU


PackageDescription:
QFN, 0.50mm Pitch, Square; 48 Pin, 7.00mm L X 7.00mm W X 1mm H body (W/Thermal Tab 4.2mm X 4.2mm), IPC Medium Density


PackageDescription:
SOIC 20, Pitch 1.27mm - Body 7.5x12.8mm, IPC Medium Density


PackageDescription:
QFN, 0.50mm Pitch, Square; 48 Pin, 7.00mm L X 7.00mm W X 1mm H body (W/Thermal Tab 5.7mm X 5.7mm), IPC Medium Density

Part Description:
5/10 Outputs Clock Generator/Jitter Cleaner with Integrated Dual VCO


PackageDescription:
QFN, 0.50mm Pitch, Square; 64 Pin, 9.00mm L X 9.00mm W X 1.00mm H Body (7.5 X 7.5mm Thermal Tab), IPC Medium Density

Part Description:
Ten Output High Performance Clock Synchronizer, Jitter Cleaner, and Clock Distributor


Part Description:
3.3 V and 2.5 V LVCMOS 1:2 High-Performance Clock Buffer


Part Description:
3.3 V and 2.5 V LVCMOS 1:3 High-Performance Clock Buffer


PackageDescription:
SOP, 0.65mm pitch; 16 pin, 4.40mm W X 5.00mm L X 1.20mm H body IPC Medium Density

Part Description:
3.3V and 2.5V LVCMOS 1:8 High-Performance Clock Buffer


PackageDescription:
SOP, 0.65mm pitch; 24 pin, 4.40mm W X 7.80mm L X 1.20mm H body, IPC Medium Density

Part Description:
3.3 V and 2.5 V LVCMOS 1:12 High-Performance Clock Buffer


PackageDescription:
QFN, 0.50mm Pitch, Square; 28 pin, 5.00mm L X 5.00mm W X 1.00mm H body (w/thermal tab 3.25 X 3.25mm),  IPC Medium Density


PackageDescription:
QFN, 0.50mm Pitch, Square; 40 pin, 6.00mm L X 6.00mm W X 1.00mm H body (w/thermal tab 4.25 X 4.25mm),  IPC Medium Density


PackageDescription:
QFN, 0.50mm Pitch, Square; 4 Pin X 4 Pin, 3mm X 3mm X 1.00mm H Body (w/thermal tab 1.80 X 1.80mm),  IPC Medium Density

Part Description:
Dual 1:2 Low Additive Jitter LVDS Buffer


Part Description:
Dual 1:4 Low Additive Jitter LVDS Buffer


Part Description:
Low Jitter, 2-Input Selectable 1:16 Universal-to-LVPECL Buffer


Part Description:
16 LVPECL Output, High-Performance Clock Buffer


PackageDescription:
QFN, (MO-220-VHHD-4) 0.50mm pitch,square; 8 pin X 8 pin, 5mm X 5mm X 1.00mm H body (w/thermal tab 3.5 X 3.5mm),  IPC Medium Density

Part Description:
Two Output, Integrated VCO, Low-Jitter Clock Generator


Part Description:
Four Output, Integrated VCO, Low-Jitter Clock Generator


PackageDescription:
BGA, 0.50mm Pitch, Square; 353 Pin,23 Columns X 23 Rows, 12.00mm X 12.00mm X 1.20mm H

Part Description:
CITIROC 1A ASIC 32 Channels, 353-Ball BGA


PackageDescription:
QFP, 0.65mm pitch, square; 160 pin, 28.00mm L X 28.00mm W X 1.60mm H body, IPC Medium Density


Part Description:
MAROC3 ASIC 64 Channels PMT, 353-Ball BGA


PackageDescription:
SON, 1.27mm pitch, 8 pin, 6.00mm W X 5.00mm L X 0.80mm H body (w/thermal tab  2.40 X 4.10 mm), IPC Medium Density


PackageDescription:
SOIC 16, Pitch 1.27mm - Body 4x10mm, IPC Medium Density


PackageDescription:
SOP, 0.80mm, Pitch; 44 pin, 10.16mm W X 18.415mm L X 1.194mm H body, IPC Medium Density

Part Description:
4-Mbit (256K words × 16 bit),  2.2V to 3.6V, Static RAM with Error-Correcting Code (ECC)


PackageDescription:
SOP, 48-Leads, Body 18.45x12mm, Pitch 0.50mm, IPC Medium Density

Part Description:
16-Mbit (1M x 16 / 2M x 8), 2.2V to 3.6V Static RAM


Part Description:
16-Mbit (1M words × 16 bit / 2M words × 8 bit), 2.2V to 3.6V Static RAM with Error-Correcting Code (ECC) and ERR Pin


PackageDescription:
SOP, 0.80mm pitch; 54 pin,10.26mm W X 22.52mm L X 1.20mm H body, IPC Medium Density

Part Description:
3.3V, 10ns, 16-Mbit (1M x 16) Static RAM


Part Description:
3.3V, 12ns, 16-Mbit (1M x 16) Static RAM


Part Description:
1.8V, 15ns, 16-Mbit (1M x 16) Static RAM


PackageDescription:
BGA, 1.00mm pitch,rect.;165 pin, 11 columns X 15 rows, 13.00mm X 15.00mm X 1.40mm H

Part Description:
1.8V, 250MHz, 18-Mbit (512k X 36) QDR®II SRAM 2-Word Burst Architecture


PackageDescription:
BGA 1mm, Pitch, Rectangular 165 Pin, 11 Columns x 15 Rows, Body 15mm X 17mm X 1.4mm H

Part Description:
2.5V, 250MHz, 2.6ns,  36-Mbit (1M x 36) Pipelined SRAM with NoBL Architecture


Part Description:
2.5V, 167MHz, 3.4ns, 72-Mbit (2M x 36) Pipelined SRAM with NoBL Architecture


Part Description:
3.3V, 167MHz, 3.4ns, 72-Mbit (2M x 36) Pipelined SRAM with NoBL Architecture


PackageDescription:
QFP, 0.65mm Pitch, Rect.; 100 Pin, 20.00mm L X 14.00mm W X 1.60mm H body, IPC Medium Density

Part Description:
72-Mbit (4M × 18) Pipelined SRAM with NoBL™ Architecture


Part Description:
1.8V, 250MHz, 72-Mbit QDR® II SRAM 2-Word Burst Architecture


Part Description:
1.8V, 400MHz, 72-Mbit QDR®II+ SRAM 4-Word Burst Architecture (2.0 Cycle Read Latency)


Part Description:
144-Mbit (8M × 18) QDR® II+ SRAM Four-Word Burst Architecture (2.5 Cycle Read Latency) with ODT


PackageDescription:
36-pin Ceramic Flat Pack (CFP) (Solder Seal Lid) Package Outline 001-67583, Body 12.19mm X 23.37mm X 2.99mm H

Part Description:
4-Mbit (512 K × 8) Static RAM with RadStop Technology (CFP Package)


PackageDescription:
BGA, 0.80mm Pitch, Square; 121 Pin,11 Columns X 11 Rows,10.00mm X 10.00mm X 1.20mm H


PackageDescription:
TO-92 (TO226), Pitch 2.54mm, Flat Index, 3 In-Line, Bent Leads, Body Dia. 5.3mm


PackageDescription:
SOT223; 2,4,3,1 Pin Order , 2.30mm pitch; 3 pin, 3.70mm W X 6.70mm L, IPC Medium Density


PackageDescription:
MAXIM TSOC Case, 6 Pins, Pitch 1.27mm, 4mm W X 4.45mm L X 1.5mm H


PackageDescription:
SOT, 0.95mm, pitch; 3 pin,1.30mm W X 2.92mm L X 1.12mm H body, IPC Medium Density


PackageDescription:
SON,  0.50mm pitch, 8 pin, 3mm X 3mm X 0.8mm H body (w/thermal tab 1.3 X 2.1mm),  IPC Medium Density


PackageDescription:
QFP, 0.50mm pitch, square; 16 pin X 16 pin, 10.00mm X 10.00mm, 1.6mm H, IPC Medium Density


PackageDescription:
BGA, 0.50mm Pitch, Rect.; 153 Pin, 14 Columns X 14 Rows, 11.50mm X 13.00mm X 1.00mm H

Part Description:
e•MMC™ 5.0/5.1 (HS400) 64GB Flash Memory


Part Description:
Cyclone Family, 1.5V FPGA, 65 I/O Pins, 1 x PLL, Commercial Grade, Speed Grade 7, Pb-Free


Part Description:
Cyclone Family, 1.5V FPGA, 65 I/O Pins, 1 x PLL, Commercial Grade, Speed Grade 8, Pb-Free


PackageDescription:
BGA, 0.80mm Pitch, Square; 358 Pin, 20 Columns X 20 Rows, 17.00mm X 17.00mm X 1.70mm H

Part Description:
Arria II GX Family FPGA, 156 I/O Pins, 358-Pin UBGA, Speed Grade 5, Commercial Grade, Pb-Free


PackageDescription:
BGA, 1.00mm Pitch, Square; 572 Pin,24 Columns X 24 Rows,25.00mm X 25.00mm X 2.20mm H

Part Description:
Arria II GX Family FPGA, 252 I/O Pins, 572-Pin FBGA, Speed Grade 4, Commercial Grade, Pb-Free


Part Description:
Cyclone II Family, 1.2V FPGA, 182 I/O Pins, 2 PLLs, 256-Pin FBGA, Speed Grade 6, Commercial Grade, Pb-Free


PackageDescription:
BGA,1.00mm pitch,square;484 pin,22 columns X 22 rows,23.00mm X 23.00mm X 2.60mm H

Part Description:
Cyclone III Family FPGA, 346 I/O Pins, 4 PLLs, 484-Pin FBGA, Speed Grade 8, Commercial Grade, Pb-Free


Part Description:
Cyclone III Family FPGA, 377 I/O Pins, 4 PLLs, 484-Pin FBGA, Speed Grade 8, Commercial Grade, Pb-Free


PackageDescription:
BGA, 1.00mm Pitch, Square; 780 Pin, 28 Columns X 28 Rows, 29.00mm X 29.00mm X 2.40mm H

Part Description:
Cyclone III Family FPGA, 55,856 LEs, 377 User I/Os, 780-Pin FBGA, Speed Grade 8, Commercial Grade, Pb-Free


PackageDescription:
BGA, 1.00mm Pitch, Square; 100 Pin, 10 Columns X 10 Rows, 11.00mm X 11.00mm X 1.55mm H

Part Description:
MAX II 3.3/2.5V CPLD, 76 IOs, 570 Logic Elements, 100-Pin Fineline BGA, Commercial Temperature, Speed Grade 5, Pb-Free


Part Description:
Cyclone IV E Family, FPGA, 6272 LEs, 179 I/Os, 256-Pin FBGA, Commercial Grade, Speed Grade 8


Part Description:
Cyclone IV Family FPGA, 1.2V, 270 I/O Pins, 8 PLLs, 8 High-Speed Transceivers, 484-Pin FBGA, Speed Grade 7, Commercial Grade


PackageDescription:
BGA,1.00mm pitch, square; 896 pin, 30 columns X 30 rows, 31.00mm X 31.00mm X 2.60mm H, IPC Medium Density

Part Description:
Cyclone IV GX Family FPGA, 475 I/O Pins, 8 Transceiver, 896-Pin FBGA, Speed Grade 7, Commercial Grade, Pb-Free


Part Description:
EPCQ Series, In-system programmable 3.3V Serial or Quad-Serial Configuration Device, 16-Pin SOIC, 256-Megabit, Industrial Grade, Pb-Free


Part Description:
EPCQ Series, In-system programmable 3.3V Serial or Quad-Serial Configuration Device, 16-Pin SOIC, 64-Megabit, Active Serial X1, Industrial Grade, Pb-Free


Part Description:
EPCQ Series, In-system programmable 3.3V Serial or Quad-Serial Configuration Device, 16-Pin SOIC, 64-Megabit, Active Serial X4, Industrial Grade, Pb-Free


Part Description:
EPCS Series, In-system programmable 3.3V Serial Configuration Device, 16-Pin SOIC, 128-Megabit, Industrial Grade, Pb-Free


Part Description:
EPCS16 Series, In-System Programmable 3.3V Serial Configuration Device, 16-Megabit, Industrial Grade


Part Description:
3V Serial Configuration Device, 8-Pin SOIC, 16Mx1, Industrial Grade, Pb-Free


Part Description:
3V Serial Configuration Device, 8-Pin SOIC, 1Mx1, Industrial Grade, Pb-Free


Part Description:
EPCS4 Series, In-system Programmable 3.3V Serial Configuration Device, 8-Pin SOIC, 4-Megabit, Industrial Grade, Pb-Free


Part Description:
MAX II 3.3/2.5V CPLD, 116 IOs, 1,270 Logic Elements, 144-Pin Plastic TQFP, Commercial Temperature, Speed Grade 3, Pb-Free


Part Description:
MAX II 3.3/2.5V CPLD, 204 IOs, 2,210 Logic Elements, 256-Pin FineLine BGA, Pb-Free


PackageDescription:
BGA, 0.50mm Pitch, Square; 68 Pin, 9 Columns X 9 Rows, 5.00mm X 5.00mm X 1.20mm H

Part Description:
MAX II Family, 1.8V, Instant-On, Non-Volatile CPLD, 54 User I/Os, 68-Pin FineLine BGA, Speed Grade 6, Pb-Free


Part Description:
2.7V to 3.6V, 2Mbit (128Kx16), 60ns, Ferroelectric Nonvolatile RAM


Part Description:
2.7V to 3.6V, 4Mbit (256Kx16), 55ns, Ferroelectric Nonvolatile RAM


PackageDescription:
SON, 0.95mm Pitch; 8 Pin, 4.00mm W X 4.50mm L X 0.80mm H body (W/Thermal Tab 2.7mm x 3.7mm)

Part Description:
4Kb (512 x 8 Bits) Serial 3V F-RAM Memory


PackageDescription:
BGA 1mm, Pitch, Square 256 Pin, 16 Columns x 16 Rows, Body 17mm X 17mm X 1.50mm H


Part Description:
2.5V to 5V 200MHz Low Skew 1 to 4 Clock Buffer


Part Description:
1.5V to 2.5V 200MHz Low Skew 1 to 4 Clock Buffer


PackageDescription:
SOP, 0.635mm pitch, 28 pin,3.99mm W X 10.00mm L X 1.75mm H body

Part Description:
Low Skew, 1-To-16 LVCMOS/LVTTL Fanout Buffer


Part Description:
FEMTOCLOCKS Crystal-To-LVDS Ethernet Clock Generator


Part Description:
Low Skew, 1-to-16 Differential-to-LVDS Clock Distribution Chip


PackageDescription:
SO J-Lead, 1.27mm, Pitch; 32 Pin, 10.16mm W X 20.95mm L X 3.68mm H body, IPC Medium Density


PackageDescription:
SOP, 0.50mm, pitch; 86 pin, 10.16mm W X 22.22mm L X 1.20mm H body, IPC Medium Density

Part Description:
3.3V, 16M x 32, 512Mb Synchronous Dynamic RAM (SDRAM)


Part Description:
3.3V, 2M Words x 32 Bits x 4 Banks (256-MBIT) Synchronous Dynamic RAM (SDRAM)


Part Description:
256K x 16 High Speed Asynchronous CMOS Static RAM With 3.3V Supply


Part Description:
512K x 16 High Speed Asynchronous CMOS Static RAM With 3.3V Supply


PackageDescription:
BGA, 0.75mm Pitch, Rect.; 48 Pin, 6 Columns X 8 Rows, 9mm X 11mm X 1.20mm H, IPC Medium Density

Part Description:
1M x 16 High Speed Asynchronous CMOS Static RAM With 3.3V Supply


PackageDescription:
SOIC, 1.27mm, pitch; 28 pin, 8.60mm W X 17.75mm L X 2.80mm H body, IPC Medium Density


PackageDescription:
BGA, 0.75mm Pitch, Rect.; 48 Pin, 6 Columns X 8 Rows, 6.00mm X 8.00mm X 1.20mm H

Part Description:
3.0V, 4M x 16 (64 Mb) Core Async/Page PSRAM


PackageDescription:
BGA 0.8mm, Pitch, Square 78 Pin, 9 Columns x 13 Rows, Body 11.5mm X 9mm X 1.2mm H


PackageDescription:
SO J-Lead, 1.27mm Pitch; 44 Pin, 10.16mm W X 28.86mm L X 3.76mm H Body, IPC Medium Density

Part Description:
3.3V, 4Mbit (256K x 16 Bit) High-Speed CMOS Static RAM


PackageDescription:
SOT23 5, Pitch 0.95mm - Body 1.67x2.99mm, IPC Medium Density

Part Description:
5-Pin Microprocessor Reset Circuits  (Reset Threshold 2.32V)


Part Description:
5-Pin Microprocessor Reset Circuits  (Reset Threshold 3.08V)


PackageDescription:
QFP, 0.50mm Pitch, Square; 100 Pin,14.00mm L X 14.00mm W X 1.60mm H Body, IPC Medium Density

Part Description:
Cortex-M3, 32-Bit ARM MCU, 128kB Flash, 32kB SRAM, Ethernet, USB 2.0 Device, CAN, 12-Bit ADC


Part Description:
32-bit 100MHz ARM Cortex-M3 Microcontroller, 512kB Flash, 64kB SRAM, with Ethernet, USB 2.0 Host/Device/OTG, CAN


Part Description:
32-bit 120MHz ARM Cortex-M3 Microcontroller, 512kB Flash, 64kB SRAM, with Ethernet, USB 2.0 Host/Device/OTG, CAN


PackageDescription:
BGA, 0.80mm Pitch, Square; 180 Pin, 14 Columns X 14 Rows, Body 12.00mm X 12.00mm X 1.20mm H, IPC Medium Density

Part Description:
Cortex-M3, 32-bit ARM MCU, 256kB Flash, 80kB SRAM, Ethernet, USB 2.0 Device/Host/OTG, CAN, 12-Bit ADC


PackageDescription:
BGA, 0.80mm Pitch, Square; 780 Pin, 28 Columns X 28 Rows, 23.00mm X 23.00mm X 2.61mm H

Part Description:
QorIQ® Layerscape Four Arm Cortex-A72 Cores 1800MHz Communications Processor, 780-Pin BGA


PackageDescription:
QFP, 0.80mm Pitch, Rect.; 80 Pin, 20.00mm L X 14.00mm W X 3.00mm H body, IPC Medium Density


Part Description:
20Mbps and Slew Rate Limited 15kV RS485/RS422 Full Duplex Transceivers


PackageDescription:
TSSOP, 10-Leads, Body 3x3mm (max), Pitch 0.50mm, IPC Medium Density

Part Description:
20Mbps and Slew Rate Limited 15kV RS485/RS422 Full Duplex Transceivers With Low Power Shut Down Mode


PackageDescription:
BGA, 1.00mm Pitch, Square; 672 Pin, 26 Columns X 26 Rows, 27.00mm X 27.00mm X 3.45mm H


Part Description:
2-Kbit (256 x 8bit) Serial I2C Bus EEPROM


Part Description:
512-Kbit, Serial Flash Memory, 50 MHz SPI Bus Interface


PackageDescription:
SON,1.27mm,pitch; 8 pin,8.00mm W X 6.00mm L X 1.00mm H body (w/pullback leads,thermal tab 6.4 X 4.8mm), IPC Medium Density

Part Description:
128 Mbit (Multilevel), Low-Voltage, Serial Flash Memory With 50-MHz SPI Bus Interface


Part Description:
32 Mbit, Low-Voltage, Serial Flash Memory With 75MHz SPI Bus Interface


Part Description:
8 Mbit, 2.7V to 3.6V Serial Flash Embedded Memory


Part Description:
8Mb, 2.7V to 3.6V, Dual I/O, 4KB Subsector Erase, 3V Serial Flash Memory


PackageDescription:
40 Leads Ceramic Dual In-Line Package, Row Spacing 15.24mm; Pitch 2.54mm


Part Description:
IGLOO2 FPGA, 12084 Cells, 233 User I/Os, 2 PLLs, 912K RAM, 1 PCIe, 484-Pin FBGA, Commercial Grade


PackageDescription:
QFP, 0.50mm Pitch, Square; 144 Pin, 20.00mm L X 20.00mm W X 1.60mm H Body, IPC Medium Density

Part Description:
IGLOO2 FPGA, 12084 Cells, 84 User I/Os, 2 PLLs, 912K RAM, 1 PCIe, 144-Pin TQ144, Commercial Grade


Part Description:
IGLOO2 FPGA, 27696 Cells, 267 User I/Os,  6 PLLs, 1104K RAM, 1 PCIe, 484-Pin FBGA, Commercial Grade


Part Description:
IGLOO2 FPGA, 56340 Cells, 267 User I/Os,  6 PLLs, 1826K RAM, 2 PCIe, 484-Pin FBGA, Commercial Grade


Part Description:
IGLOO2 FPGA, 56520 Cells, 267 User I/Os,  6 PLLs, 1826K RAM, 2 PCIe, 484-Pin FBGA, Commercial Grade


PackageDescription:
BGA, 1.00mm Pitch, Square; 1152 Pin, 34 Columns X 34 Rows,35.00mm X 35.00mm X 2.90mm H, IPC Medium Density

Part Description:
IGLOO2 FPGA, 146124 Cells, 574 User I/Os,  20 PLLs, 5000K RAM, 4 PCIe, 1152-Pin FBGA, Commercial Grade


Part Description:
SmartFusion 2 SoC FPGA, ARM Cortex-M3, 10 K LUTs, 233 User I/O, Transceiver Available, Design Security, Speed Grade 1, 0 to 85 degC, RoHS


Part Description:
SmartFusion 2 SoC FPGA, ARM Cortex-M3, 12 K LUTs, 233 Users I/O, Design Security, 0 to 85 degC, RoHS


PackageDescription:
BGA, 0.50mm Pitch, Square;325 Pin, 21 Columns X 21 Rows, 11.00mm X 11.00mm X 1.01mm H

Part Description:
SmartFusion 2 SoC FPGA, ARM Cortex-M3, 200 User I/O, -40 to 85 degC, 325-Ball BGA, RoHS


Part Description:
SmartFusion 2 SoC FPGA, ARM Cortex-M3, 150 K LUTs, 574 User I/O, Design Security, 0 to 85 degC, 1152-Ball BGA, RoHS


PackageDescription:
QFP, 0.65mm Pitch, Rect.; 100 Pin,20.00mm L X 14.00mm W X 3.05mm H Body, IPC Medium Density


Part Description:
32-Bit, 1M + 4K ROM, 48K RAM Microcontroller


PackageDescription:
PLCC, 1.27mm Pitch, Square; 44 Pin, 16.60mm L X 16.60mm W X 4.57mm H Body, IPC Medium Density

Part Description:
High-Performance EE CMOS In-System Programmable Logic (ispMACH™ 4A CPLD Family)


Part Description:
1K (128 x 8 or 64 x 16 bit) Serial Microwire Bus EEPROM


Part Description:
1Kbit (128 x 8 bit or 64 x 16 bit) MICROWIRE® Serial Access EEPROM


Part Description:
2.5 to 5.5 V, 4Kbit (512 x 8 bit or 256 x 16 bit) MICROWIRE® Serial Access EEPROM


Part Description:
2.5 to 5.5V, 8Kb (1024x8) Serial SPI Bus EEPROM with High-Speed Clock


Part Description:
+3.3V, ±15kV ESD-Protected, 250kbps, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceiver


Part Description:
20Mbps, +3.3V, SOT23 RS-485/RS-422 Transmitter


PackageDescription:
SOT, 0.65mm pitch; 8 pin, 1.625mm W X 2.90mm L X 1.45mm H body, IPC Medium Density


PackageDescription:
DIP 8 Leads, Row Spacing 7.62 mm; Pitch 2.54 mm

Part Description:
±15kV ESD-Protected, ±60V Fault-Protected, 0.25Mbps, Fail-Safe RS-485 Transceiver


Part Description:
±15kV ESD-Protected, ±60V Fault-Protected, 2.5 to 10Mbps, Fail-Safe RS-485 Transceiver


Part Description:
+5V, Fail-Safe, 20Mbps, Profibus RS-485/RS-422 Transceivers


Part Description:
3.3V-Powered, ±15kV ESD-Protected, 10Mbps,True RS-485/RS-422 Half Duplex Transceiver


Part Description:
3.3V-Powered, ±15kV ESD-Protected, 12Mbps,True RS-485/RS-422 Half Duplex Transceiver


Part Description:
3.3V-Powered, ±15kV ESD-Protected, 2.5Mbps and Slew-Rate-Limited True RS-485/RS-422 half-duplex Transceiver


Part Description:
3.3V-Powered, ±15kV ESD-Protected, 12Mbps RS-485/RS-422 Full-Duplex Transceivers


Part Description:
3.3V-Powered, Full Duplex, 12Mbps True RS-485/RS-422 Transceiver


Part Description:
3.3V-Powered, Full Duplex, 10Mbps True RS-485/RS-422 Transceiver


PackageDescription:
SOT23 3-Leads, Pitch 0.95mm - Body 1.3x2.9mm, IPC Medium Density

Part Description:
3-Pin, Ultra-Low-Power μP Reset Circuits


PackageDescription:
SOT143, 4-Leads, Body 3.0x2.6mm (max), Pitch 1.92mm, IPC Medium Density


Part Description:
Microprocessor Supervisory Reset Circuits with Edge-Triggered, One-Shot Manual Reset  (Voltage Threshold 2.925V)


Part Description:
uP Reset Circuits with Capacitor-Adjustable Reset/Watchdog Timeout Delay (Voltage Threshold 2.93V)


PackageDescription:
SOT23 3-Leads, Pitch 0.95mm - Body 1.3x2.86mm, IPC Medium Density

Part Description:
3-Pin Microprocessor Reset Circuit (Reset Threshold 4.63V)


Part Description:
3-Pin Microprocessor Reset Circuit (Reset Threshold 4.38V)


PackageDescription:
SOT363, 0.65mm pitch; 6 pin, 1.25mm W X 2mm L, IPC Medium Density

Part Description:
400Mbps, Low-Jitter, Low-Noise LVDS Repeater


PackageDescription:
SOP, 0.50mm Pitch; 48 Pin, 12.40mm W X 12.00mm L X 1.20mm H body, IPC Medium Density


Part Description:
3.3V 256K (32K × 8) Bit CMOS Memory FRAM


PackageDescription:
QFN, 0.50mm Pitch, Square; 4 Pin X 4 Pin, 3mm X 3mm X 0.80mm H Body (w/Thermal tab 1.60 X 1.60mm),  IPC Medium Density

Part Description:
FPGA Bridge IC for MIPI D-PHY Systems and SLVS to LVDS Conversion


Part Description:
FPGA Bridge IC for MIPI D-PHY Systems and LVDS to SLVS Conversion


PackageDescription:
QFN, 0.50mm Pitch, Square; 48 Pin, 7.00mm L X 7.00mm W X 0.8mm H body (W/Thermal Tab 5.6mm X 5.6mm), IPC Medium Density

Part Description:
5-Channel FPGA Bridge IC for MIPI D-PHY Systems and SLVS to LVDS Conversion


Part Description:
5-Channel FPGA Bridge IC for MIPI D-PHY Systems and LVDS to SLVS Conversion


PackageDescription:
SOP, 20-Leads, Body 6.5x4.4mm, Pitch 0.65mm, IPC Medium Density

Part Description:
HCS08 Family, 32K Flash, 1K RAM, 512Byte EEPROM, 8-Bit Microcontroller Units (MCU)


PackageDescription:
QFP, 0.80mm Pitch, Square; 64 pin, 14.00mm L X 14.00mm W X 2.45mm H body, IPC Medium Density

Part Description:
128Kb Flash Memory, 32Kb SRAM, 32-Bit ColdFire Microcontroller With CAN


PackageDescription:
QFP, 0.65mm Pitch, Square; 80 Pin,14.00mm L X 14.00mm W X 1.60mm H body, IPC Medium Density

Part Description:
128Kb Flash, 24Kb RAM, 32-Bit ColdFire Microcontroller


PackageDescription:
QFP, 0.65mm Pitch, Square; 80 Pin, 14.00mm L X 14.00mm W X 1.74mm H Body, IPC Medium Density

Part Description:
128Kb Flash/16Kb SRAM, 32-Bit ColdFire Microcontroller


PackageDescription:
SOIC 8, Pitch 1.27mm - Body 3.9x4.9mm, IPC Medium Density

Part Description:
I2C Real-Time Clock/Calendar with EEPROM, SRAM, Unique ID and Battery Switchover


PackageDescription:
QFP, 0.50mm Pitch, Square; 100 Pin,14.00mm L X 14.00mm W X 1.70mm H Body, IPC Medium Density

Part Description:
32-Bit, 512Kb Flash, 128kb SRAM, 100MHz RISC Microcontroller (K60 Sub-Family)


PackageDescription:
BGA, 1.00mm Pitch, Square; 1152 Pin, 34 Columns X 34 Rows,35.00mm X 35.00mm X 3.47mm H, IPC Medium Density

Part Description:
PolarFire FPGA, 512 I/O, 300000 Logic Elements,1152-Pin FBGA, Extended Commercial Grade


PackageDescription:
SON, 1.27mm Pitch; 8 Pin, 6.00mm W X 5.00mm L X 0.90mm H Body (w/Thermal Tab 2.1mm x 2.1mm)

Part Description:
40MHz/25ns tSCK (Industrial, Extended and AEC-Q100 Grade 1 Temp Range) 4Mb SPI Interface MRAM


PackageDescription:
SOP, 0.80mm, Pitch; 44 Pins, 10.16mm W X 18.41mm L X 1.2mm H body, IPC Medium Density

Part Description:
4Mb (256K × 16) MRAM Memory, Fast 35ns R/W Cycle, Commercial Grade


PackageDescription:
SOP, 0.80mm Pitch; 54 Pin,10.26mm W X 22.52mm L X 1.20mm H body, IPC Medium Density

Part Description:
16Mb (1M × 16) MRAM Memory, Fast 35ns R/W Cycle, Commercial Grade


PackageDescription:
BGA,0.65mm Pitch, Rect. ;500 Pin, 20 Columns X 25 Rows, 14.00mm X 17.00mm X 1.80mm H

Part Description:
SCM-i.MX 6Dual processors Based on ARM® Cortex®-A9 MPCore Platform (LPDDR2 - PoP Footprint Version)


PackageDescription:
QFN, 0.50mm Pitch, Square; 48 Pin, 7.00mm L X 7.00mm W X 1mm H Body (W/Thermal Tab 5.25m x 5.25mm), IPC Medium Density


Part Description:
16Kb Flash/512Kb RAM, 16-Bit Mixed Signal Microcontroller


Part Description:
1Gbit (128MB), 1.8V, Multiple I/O Serial Flash Memory, Reset# & Hold# Pins


PackageDescription:
SON, 1.27mm Pitch; 8 Pin, 6.00mm W X 8.00mm L X 0.8mm H body (w/Thermal Tab 3.45mm x 4.35mm)

Part Description:
128Mb (16MB), 1.8V, Multiple I/O Serial Flash Memory with Hold# Pins


Part Description:
512Mbit (64MB), 1.8V, Multiple I/O Serial Flash Memory, Reset# & Hold# Pins


PackageDescription:
BGA, 0.80mm pitch, Rect.; 63 Pin, 10 Columns X 12 Rows, 9.00mm X 11.00mm X 1.00mm H


PackageDescription:
BGA, 0.80mm pitch, Rect.; 63 Pin, 10 Columns X 12 Rows, 10.50mm X 13.00mm X 1.00mm H


PackageDescription:
BGA 0.8mm, Pitch, Square 78 Pin, 9 Columns x 13 Rows, Body 13.2mm X 9mm X 1.2mm H

Part Description:
+2.5V, 8Gb (1G x 8 x 16 Banks) DDR4 SDRAM


PackageDescription:
BGA, 0.80mm Pitch, Rect.; 78 Pin, 9 Columns X 13 Rows, 8.00mm X 12.00mm X 1.20mm H


PackageDescription:
BGA 0.8mm, Pitch, Square 96 Pin, 9 Columns x 16 Rows, Body 14mm X 9mm X 1.2mm H


Part Description:
+1.2V, 16Gb (64 Meg x 8 x 16 Banks x 2 Ranks) TwinDie DDR4 SDRAM


PackageDescription:
BGA 0.8mm, Pitch, Square 96 Pin, 9 Columns x 16 Rows, Body 14mm X 8mm X 1.2mm H

Part Description:
+1.2V, 8Gb (512 Meg x 16) Automotive DDR4 SDRAM


PackageDescription:
BGA, 0.80mm Pitch, Rect.; 78 Pin, 9 Columns X 13 Rows, 9.00mm X 10.50mm X 1.20mm H


Part Description:
+1.5V, 2Gb (16 Meg x 16 x 8 Banks) DDR3 SDRAM


PackageDescription:
BGA, 0.80mm Pitch, Rect.; 96 Pin, 9 Columns X 16 Rows, 8.00mm X 14.00mm X 1.45mm H


Part Description:
+1.35V, 4Gb (32 Meg x 16 x 8 banks) DDR3L SDRAM


Part Description:
+1.35V, 4Gb (32 Meg x 16 x 8 banks) DDR3L SDRAM (Industrial temperature)


Part Description:
+1.5V, 4Gb (32Meg x 16 x 8 banks) DDR3L SDRAM


Part Description:
+1.35V, 8Gb (64 Meg x 16 x 8 banks) DDR3L SDRAM


PackageDescription:
BGA, 0.80mm Pitch, Rect.; 78 Pin, 9 Columns X 13 Rows, 8.00mm X 10.50mm X 1.20mm H


PackageDescription:
SOP, 0.65mm Pitch; 66 Pin, 10.16mm W X 22.22mm L X 1.20mm H Body, IPC Medium Density


PackageDescription:
BGA, 0.80mm pitch, Rect.; 84 Pin, 9 Columns X 15 Rows, 8.00mm X 12.50mm X 1.20mm H

Part Description:
1.8V,  2Gb (16M x 16 x 8 Banks) DDR2 SDRAM


PackageDescription:
BGA 0.8mm, Pitch, Square 84 Pin, 9 Columns x 15 Rows, Body 14mm X 8mm X 1.2mm H

Part Description:
1.8V, 256Mb (4M x 16 x 4 Banks) DDR2 SDRAM


PackageDescription:
BGA, 0.80mm pitch, Rect.; 60 Pin, 9 Columns X 11 Rows, 9.00mm X 11.50mm X 1.20mm H

Part Description:
1.8V, 2Gb (32M x 8 x 8 Banks) DDR2 SDRAM


Part Description:
1.8V, 512Mb (8M x 16 x 4 Banks) DDR2 SDRAM


Part Description:
1.8V,  1Gb (8M x 16 x 8 Banks) DDR2 SDRAM


Part Description:
3.3V, 128Mb (1M x 32 x 4 Banks) SDRAM, Speed Grade 6


PackageDescription:
SODIMM DDR3 204-Pin SDRAM Module, Body; 67.6mm L X 30mm W X 3.8mm H

Part Description:
1Gb (128Mx64) SODIMM 204-Pin DDR3 SDRAM Module


PackageDescription:
SOIC, 1.27mm Pitch; 8 Pin, 5.285mm W X 5.335mm L X 2.16mm H body, IPC Medium Density

Part Description:
128Mb (16M x 8), 3V, CMOS MXSMIO® Serial Multi I/O Flash Memory


Part Description:
32Mb (x1/x2/x4), 3V, CMOS MXSMIO® Serial Multi I/O Flash Memory


PackageDescription:
SON, 1.27mm Pitch; 8 Pin, 6.00mm W X 8.00mm L X 0.8mm H body (w/Thermal Tab 4.8mm x 4.7 mm)

Part Description:
128Mb (x1/x2/x4), 1.8V, CMOS MXSMIO® Serial Multi I/O Flash Memory


Part Description:
32Mb (4M x 8), 1.8V, CMOS MXSMIO® Serial Multi I/O Flash Memory


PackageDescription:
SON,1.27mm,pitch; 8 pin,8.00mm W X 6.00mm L X 1.00mm H body (w/thermal tab 5.15 X 4.8mm), IPC Medium Density

Part Description:
32Mb, 1.7 to 2.0V, Multiple I/O Serial Flash Memory


Part Description:
128Mb, 1.7 to 2.0V, Multiple I/O Serial NOR Flash Memory


Part Description:
128Mb, 2.7 to 3.6V, Multiple I/O Serial NOR Flash Memory


PackageDescription:
SOIC, 1.27mm Pitch; 16 Pin, Body 7.5x10.3mm, IPC Medium Density


Part Description:
256Mb, 2.7 to 3.6V, Multiple I/O Serial Flash Memory


PackageDescription:
SOIC, 1.27mm, Pitch; 32 Pin, 11.30mm W X 20.445mm L X 3.00mm H body, IPC Medium Density


PackageDescription:
QFP, 0.80mm Pitch, Square; 44 Pin, 10.00mm L X 10.00mm W X 1.60mm H body, IPC Medium Density

Part Description:
32-Bit 8-Cog Multiprocessor Microcontroller Propeller Chip


PackageDescription:
BGA, 1.00mm Pitch, Rect.; 64 Pin, 8 Columns X 8 Rows, 10.00mm X 13.00mm X 1.20mm H

Part Description:
256Mb Micron Parallel NOR Flash Embedded Memory (P30-65nm)


PackageDescription:
BGA 1mm, Pitch, Square 256 Pin, 16 Columns x 16 Rows, Body 17mm X 17mm X 1.70mm H

Part Description:
32-Bit 66MHz PCI Bus Mastering I/O Accelerator For PowerQUICC And Generic 32-Bit, 66MHz Local Bus Design


PackageDescription:
DIP 14 Leads, Row Spacing 7.62 mm; Pitch 2.54 mm

Part Description:
14 Pins 8-Bit Flash Microcontroller, Temp Range -40C to +125C


Part Description:
14 Pins 8-Bit Flash Microcontroller, Temp Range -40C to +85C


PackageDescription:
QFN, 0.65mm pitch, square; 28 pin, 6.00mm L X 6.00mm W X 1.00mm H body (w/thermal tab 4.2mm x 4.2mm), IPC Medium Density

Part Description:
Flash-Based, 8-Bit CMOS Microcontroller with nanoWatt Technology


PackageDescription:
DIP 18 Leads, Row Spacing 7.62mm; Pitch 2.54mm


PackageDescription:
SOIC, 18-Leads, Body 13.9x7.6mm (max), Pitch 1.27mm, IPC Medium Density


PackageDescription:
SOP, 0.65mm Pitch; 20 pin, 5.30mm W X 7.20mm L X 2.00mm H body, IPC Medium Density


PackageDescription:
DIP 20 Leads, Row Spacing 7.62mm; Pitch 2.54mm

Part Description:
20 Pins Flash-Based, 8-Bit CMOS Microcontrollers with nanoWatt Technology


PackageDescription:
QFP, 0.80mm Pitch, Square; 44 Pin,10.00mm L X 10.00mm W X 1.20mm H body, IPC Medium Density


PackageDescription:
DIP 28 Leads, Row Spacing 7.62mm; Pitch 2.54mm


PackageDescription:
40 Leads Dual In-Line Package, Row Spacing 15.24mm; Pitch 2.54mm


PackageDescription:
True Hole PLCC Socket Footprint, 1.27mm Pitch, Square; 44 Pin, 16.60mm L X 16.60mm W X 4.57mm H Body


PackageDescription:
QFP, 0.50mm pitch, square; 16 pin X 16 pin, 10.00mm X 10.00mm, 1.2mm H, IPC Medium Density

Part Description:
1-Mbit, Enhanced Flash Microcontrollers with 10-Bit A/D and nanoWatt Technology, 64-Pin TQFP (10x10x1.2mm), Industrial Temperature


Part Description:
20 Pins General Purpose, 16-Bit Flash Microcontroller with nanoWatt XLP Technology


PackageDescription:
SOP, 0.65mm Pitch; 28 pin, 5.30mm W X 10.20mm L X 2.00mm H body, IPC Medium Density

Part Description:
16-Bit Flash Microcontroller with nanoWatt XLP Technology, 16KB Flash, 1.5KB SRAM, 28-Pin SSOP, Industrial Temperature


Part Description:
General Purpose 16-Bit Flash Microcontroller with USB On-The-Go, 256KB Flash, 16KB SRAM, 100-Pin TQFP (14x14x1 mm), Industrial Temperature


PackageDescription:
BGA, 0.75mm Pitch, Rect.; 48 Pin, 6 Columns X 8 Rows, 7.50mm X 8.50mm X 1.20mm H, IPC Medium Density

Part Description:
16Mb Advanced LPSRAM (1M Word x 16bit / 2M Wordx8bit)


PackageDescription:
SOP, 0.40mm Pitch; 52 Pin, 8.89mm W X 10.79mm L X 1.20mm H Body, IPC Medium Density


Part Description:
3.3V, 10ns, 4M (256-kword × 16-Bit), High Speed SRAM


Part Description:
64Mb Advanced LPSRAM (4M word x 16bit / 8M word x 8bit)


Part Description:
64-Bit, 2M ROM, 128K RAM, 32K Flash, 3V Microcontroller, RX 610 Group


PackageDescription:
BGA, 0.80mm Pitch, Square; 176 Pin, 15 Columns X 15 Rows,13.00mm X 13.00mm X 1.40mm H


PackageDescription:
QFP, 0.50mm Pitch, Square; 176 Pin, 24.00mm L X 24.00mm W X 1.70mm H Body, IPC Medium Density


PackageDescription:
SOIC, 1.27mm Pitch; 8 Pin, 5.28mm W X 5.28mm L X 2.16mm H body, IPC Medium Density


PackageDescription:
SON, 1.27mm pitch, 8 pin, 6.00mm W X 5.00mm L X 0.80mm H body (w/thermal tab  3.50 X 4.10 mm), IPC Medium Density

Part Description:
128 Mbit (16 Mbyte), 3.0 V Quad SPI FL-L  NOR Flash Memory


PackageDescription:
BGA, 1.00mm Pitch, Rect.; 24 Pin, 5 Columns X 5 rows,6.00mm X 8.00mm X 1.20mm H

Part Description:
128Mbit, 133MHz, MirrorBit® Flash Non-Volatile Memory CMOS 3V Core with Versatile I/O Serial Peripheral Interface with Multi-I/O


Part Description:
512Mbit (64Mx8 bit), 133MHz, MirrorBit® SPI Flash Memory with Reset


PackageDescription:
SOP, 0.50mm, Pitch; 56 Pin, 18.40mm W X 14.00mm L X 1.20mm H body, IPC Medium Density

Part Description:
2.7V to 3.6V, 100ns, 128 Megabit Flash Memory, 90 nm MirrorBit Process Technology


Part Description:
2.7V to 3.6V, 100ns, 256 Mbit (32Mbyte), MirrorBit Eclipse Flash Memory, 65nm  Process Technology


PackageDescription:
BGA, 0.80mm Pitch, Rect.; 84 Pin, 10 Columns X 12 Rows,8.00mm X 11.60mm X 1.00mm H

Part Description:
512Mb (32Mx16 bit), 1.8V, 80MHz, Simultaneous Read/Write Burst Mode Flash Memory


PackageDescription:
SOP, 0.65mm pitch; 16 pin, 4.40mm W X 5.00mm L X 1.10mm H body IPC Medium Density

Part Description:
Master I2C-Bus Controller With UART Interface


PackageDescription:
QFN, 0.50mm Pitch, Square; 36 Pin, 6.00mm L X 6.00mm W X 0.90mm H Body (w/thermal tab 4.25mm x 4.25mm), IPC Medium Density

Part Description:
Pin-Controlled 1-350 MHz Jitter Cleaning Clock


Part Description:
Any Frequency Precision Clock Multiplier/Jitter Attenuator


PackageDescription:
QFN, 0.50mm Pitch, Square; 16 Pin, 3.00mm L X 3.00mm W X 0.90mm H Body (w/thermal tab 1.75mm x 1.75mm), IPC Medium Density

Part Description:
Low-Jitter LVDS Fanout Clock Buffers, 10-Output,  Any-Input, Any-Frequency up to 1250MHz


PackageDescription:
QFN, 0.50mm Pitch, Square; 6 Pin X 6 Pin, 4mm X 4mm Body (w/Thermal Tab 2.65 X 2.65 mm), IPC Medium Density

Part Description:
0.16 MHz to 710 MHz I2C_LSB, I2C-Programmable Quad Clock Generator


Part Description:
0.16 MHz to 710 MHz Four Inputs (2 Differential, 2 Single-ended) I2C-Programmable Quad Clock Generator


PackageDescription:
QFN, 0.50mm Pitch, Square; 64 Pin, 9.00mm L X 9.00mm W X 0.90mm H Body (5.30mm X 5.30mm Thermal Tab), IPC Medium Density

Part Description:
0.0001 to 350 MHz, Low-Jitter, 4-Input, 10-Output, Clock Generator


PackageDescription:
QFN, 0.50mm Pitch, Square; 44 Pin, 7.00mm L X 7.00mm W X 0.90mm H Body (w/thermal tab 5.3mm x 5.3mm), IPC Medium Density

Part Description:
4 Input /2 Output, 0.001 to 1028MHz, Any-Output Jitter Attenuator/Clock Multiplier


Part Description:
4 Input /4 Output, 0.001 to 1028MHz, Any-Output Jitter Attenuator/Clock Multiplier


Part Description:
4 Input /10 Output, 0.001 to 1028MHz, Any-Output Jitter Attenuator/Clock Multiplier


PackageDescription:
QFP,0.50mm Pitch, Square; 100 Pin, 14.00mm L X 14.00mm W X 1.20mm H body (w/Thermal Tab 4.15mm x 4.15mm), IPC Medium Density

Part Description:
Any-Frequency (2kHz–808 MHz) Precision Clock Multiplier/Jitter Attenuator


Part Description:
Differential Transceiver with Transient Voltage Suppression


PackageDescription:
SOIC, 1.27mm Pitch, 8 Pin, 5.25mm W X 5.26mm L X 2.03mm H Body

Part Description:
2.5V/3.0V 64 Mbit Serial Quad I/O (SQI) Flash Memory


Part Description:
2.7V, 4M x 16 (64 Mbit), Multi-Purpose Flash Plus


Part Description:
ARM Cortex-M3 32-bit MCU, 128 KB Flash, 20 KB Internal RAM, 37 I/Os, 48-pin LQFP, Industrial Grade


Part Description:
ARM Cortex-M4 32-bit MCU, 512 KB Flash, 80 KB Internal RAM, 52 I/Os, 64-pin LQFP, Industrial Grade


PackageDescription:
QFP, 0.50mm Pitch, Square; 100 Pin, 14.00mm L X 14.00mm W X 1.60mm H Body, IPC Medium Density

Part Description:
ARM Cortex-M4 32-bit MCU, 256 KB Flash, 40 KB Internal RAM, 87 I/Os, 100-pin LQFP, Industrial Grade


Part Description:
ARM Cortex-M4 32-bit MCU+FPU, 210DMIPS, 1024kB Flash, 192kB+4kB RAM, 51 I/Os, 64-pin LQFP, Industrial Grade –40 to 85°C


Part Description:
ARM Cortex-M4 32-bit MCU+FPU, 1024 KB Flash, 192 KB Internal RAM, 82 I/Os, 100-pin LQFP, Industrial Grade


Part Description:
ARM Cortex-M4 32b MCU+FPU, 210DMIP, 1024 kB Flash, 192+4 kB RAM, Camera, 114 I/Os, 144-pin LQFP, Industrial Grade


Part Description:
ARM Cortex-M7 32b MCU+FPU, 462DMIPS, 1024 kB Flash, 320+16+ 4KB RAM, USB, Ethernet, Camera, 100-pin LQFP, Industrial Grade


Part Description:
3-Pin Microprocessor Reset Circuit, Reset Threshold Voltage 2.85-3.00V


PackageDescription:
QFN,0.50mm pitch,square; 4 pin X 4 pin, 3mm X 3mm X 0.9mm H body (w/thermal tab 1.6 X 1.6mm),  IPC Medium Density

Part Description:
3.2Gbps Precision, 1:2 LVDS Fanout Buffer With Internal Termination And Fail Safe Input


PackageDescription:
SOIC, 1.27mm Pitch; 32 Pin, 10.70mm W X 21.10mm L X 2.80mm H Body, IPC Medium Density


PackageDescription:
QFP, 0.50mm Pitch, Square; 64 Pin, 10.00mm L X 10.00mm W X 1.00mm H body (w/thermal tab 3.42 X 3.42mm), IPC Medium Density


PackageDescription:
QFP,0.50mm pitch,square;16 pin X 16 pin,10.00mm X 10.00mm X 1.20mm H body (w/thermal tab 4.15 X 4.15 mm), IPC Medium Density


PackageDescription:
BGA 1mm, Pitch, Square 256 Pin, 16 Columns x 16 Rows, Body 17mm X 17mm X 2.1mm H


PackageDescription:
BGA 1mm Pitch, Square, 376 pin, 22 Columns x 22 Rows, 23.0mm x 23.0mm x 2.48mmH

Part Description:
Fixed-Point Digital Signal Processor (DSP)


PackageDescription:
BGA 1mm, Pitch, Square 256 Pin, 16 Columns x 16 Rows, Body 17mm X 17mm X 2mm H

Part Description:
32-Bit 300MHz Floating-Point Digital Signal Processor (DSP)


PackageDescription:
BGA, 1mm Pitch, Square 256 Pin, 16 Columns x 16 Rows, Body 17mm X 17mm X 2mm H

Part Description:
32-Bit 350MHz Floating-Point Digital Signal Processor (DSP)


PackageDescription:
BGA, 1.00mm Pitch, Square; 176 Pin, 14 Columns X 14 Rows, 15.00mm X 15.00mm X 2.05mm H

Part Description:
32-Bit 150MHz Digital Signal Processor (DSP)


PackageDescription:
BGA, 0.80mm pitch,square;841 pin, 29 columns X 29 rows, 24.00mm X 24.00mm X 3.42mm H

Part Description:
Multicore Fixed and Floating-Point Digital Signal Processor


PackageDescription:
QFP, 0.65mm Pitch, Rect.; 100 Pin,20.00mm L X 14.00mm W X 3.41mm H Body, IPC Medium Density


Part Description:
128M-bit Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI and QPI


PackageDescription:
QFP, 0.40mm Pitch, Square; 64 Pin, 7.00mm L X 7.00mm W X 1.20mm H Body, IPC Medium Density

Part Description:
WIZnet ARM Cortex-M0 Core 128KBflsh TCP/IP PHY


PackageDescription:
PLCC, 1.27mm Pitch, Square; 20 Pin, 8.97mm L X 8.97mm W X 4.57mm H Body, IPC Medium Density

Part Description:
XC18V00 Series, In-System Programmable Configuration 3.3V PROM, 20-Pin PLCC, 1-Megabit, Commercial Grade


Part Description:
XC18V00 Series, In-System Programmable Configuration 3.3V PROM, 44-Pin VQFP, 4-Megabit, Commercial Grade, Pb-Free


Part Description:
CoolRunner-II 1.8V, 128 Macrocell CPLD, 100 User I/Os, 144-Pin TQFP, Commercial Grade, Pb-Free


Part Description:
CoolRunner-II 1.8V, 128 Macrocell CPLD, 80 User I/Os, 100-Pin VQFP, Commercial Grade, Pb-Free


Part Description:
CoolRunner-II 1.8V, 256 Macrocell CPLD, 184 User I/Os, 256-Ball FTBGA, Commercial Grade, Pb-Free


Part Description:
CoolRunner-II 1.8V, 256 Macrocell CPLD, 118 User I/Os, 144-Pin TQFP, Commercial Grade, Pb-Free


Part Description:
CoolRunner-II, 1.8V, 384 Macrocell CPLD, 256-Ball FTBGA, Pb-Free, Commercial Grade


Part Description:
CoolRunner-II 1.8V, 384 Macrocell CPLD, 118 User I/Os, 144-Pin TQFP, Commercial Grade, Pb-Free


Part Description:
Spartan-II 2.5V FPGA, 92 User I/Os, 144-Pin TQFP, Standard Performance, Industrial Grade, Pb-Free


PackageDescription:
BGA, 1.00mm pitch, Square; 456 pin, 22 columns X 22 rows, 23.00mm X 23.00mm X 2.60mm H

Part Description:
Spartan-II 2.5V FPGA, 284 User I/Os, 456-Ball FBGA, High Performance, Commercial Grade, Pb-Free


Part Description:
Spartan-3 1.2V FPGA, 333 User I/Os, 456-Ball FBGA, Standard Performance, Commercial Grade


Part Description:
Spartan-3 1.2V FPGA, 173 User I/Os, 256-Ball FTBGA, Standard Performance, Commercial Grade


Part Description:
Spartan-3 1.2V FPGA, 333 User I/Os, 456-Ball FBGA, High Performance, Commercial Grade, Pb-Free


Part Description:
Spartan-3A I/O Optimized FPGA, 161 User I/Os, 256-Ball FTBGA, Standard Performance, Commercial Grade


Part Description:
Spartan-3 1.2V FPGA, 141 User I/Os, 208-pin PQFP, Standard Performance, Commercial Grade


Part Description:
Spartan-3AN Non-Volatile FPGA, 195 User I/Os, 256-Pin FTBGA,  Standard Performance, Commercial Grade, Pb-Free


PackageDescription:
BGA, 1.00mm pitch, square, 400 pin, 20 columns X 20 rows,21.00mm X 21.00mm X 2.43mm H, IPC Medium Density

Part Description:
Spartan-3AN Non-Volatile FPGA, 311 User I/Os, 400-Pin FBGA, Standard Performance, Commercial Grade, Pb-Free


Part Description:
Spartan-3AN Non-Volatile FPGA, 108 User I/Os, Standard Performance, Commercial Grade


Part Description:
Spartan-3AN Non-Volatile FPGA, 372 User I/Os, 484-Pin FBGA, Standard Performance, Commercial Grade


PackageDescription:
BGA,1.00mm Pitch, Square; 665 Pin, 26 Columns X 26 Rows, 27.00mm X 27.00mm X 2.90mm H

Part Description:
Virtex-5 FXT Platform FPGA, 360 User I/Os, 665-Ball FFBGA, Speed Grade 2, Commercial Grade, Pb-Free


PackageDescription:
BGA, 1.00mm pitch, square; 1136 pin, 34 columns X 34 rows,35.00mm X 35.00mm X 3.4mm H, IPC Medium Density

Part Description:
Virtex-5 FXT Platform FPGA, 640 User I/Os, 1136-Ball FFBGA, Speed Grade 1, Commercial Grade, Pb-Free


PackageDescription:
BGA, 1.00mm Pitch, Square; 1153 pin, 34 Columns X 34 Rows, Body 35.00mm X 35.00mm X 3.4mm H, IPC Medium Density

Part Description:
Virtex-5 LX Platform FPGA, 800 User I/Os, 1153-Ball FFBGA, Speed Grade 1, Commercial Grade, Pb-Free


PackageDescription:
BGA, 1.00mm Pitch, Square; 484 pin, 22 Columns X 22 Rows, Body 23.00mm X 23.00mm X 2.60mm H, IPC Medium Density

Part Description:
Spartan-6 LXT 1.2V FPGA, 296 User I/Os, 484-Ball Fine-Pitch BGA (1.0mm Pitch), Speed Grade 2, Commercial Grade, Pb-Free


PackageDescription:
BGA, 1.00mm Pitch, Square; 676 Pin, 26 Columns X 26 Rows, Body 27.00mm X 27.00mm X 2.44mm H, IPC Medium Density

Part Description:
1.2V FPGA, 376 User I/Os, 676-Ball Fine-Pitch BGA (1.0mm Pitch), Speed Grade 3, Commercial Grade, Pb-Free


PackageDescription:
BGA, 1.00mm pitch, Square; 484 pin, 22 Columns X 22 Rows, Body 23.00mm X 23.00mm X 2.60mm H, IPC Medium Density

Part Description:
Spartan-6 LX 1.2V FPGA, 338 User I/Os, 484-Ball Fine-Pitch BGA (1.0mm Pitch), Speed Grade 3, Commercial Grade, Pb-Free


PackageDescription:
BGA, 1.00mm Pitch, Square; 676 pin, 26 Columns X 26 Rows, Body 27.00mm X 27.00mm X 2.60mm H, IPC Medium Density

Part Description:
SPARTAN-6, FPGA, 396 User I/Os, 8 GTPs, 676-Ball BGA, Speed Grade 2, Commercial Grade, Pb-Free


PackageDescription:
BGA, 1.00mm Pitch, Square; 900 pin, 30 Columns X 30 Rows, Body 31.00mm X 31.00mm X 2.60mm H, IPC Medium Density

Part Description:
SPARTAN-6, FPGA, 540 User I/Os, 8 GTPs, 900-Ball BGA,  Speed Grade 2, Commercial Grade, Pb-Free


Part Description:
SPARTAN-6, FPGA, 540 User I/Os, 8 GTPs, 900-Ball BGA, Speed Grade 3, Commercial Grade, Pb-Free


PackageDescription:
BGA, 1.00mm Pitch, Square; 256 Pin, 16 Columns X 16 Rows, Body 17.00mm X 17.00mm X 1.55mm H, IPC Medium Density

Part Description:
Spartan-6 LX 1.2V FPGA, 186 User I/Os, 256-Ball Fine-Pitch Thin BGA (1.0mm Pitch), Speed Grade 2, Commercial Grade, Pb-Free


PackageDescription:
BGA, 0.80mm Pitch, Square; 324 Pin, 18 Columns X 18 Rows, Body 15.00mm X 15.00mm X 1.50mm H, IPC Medium Density

Part Description:
Spartan-6 LX 1.2V FPGA, 232 User I/Os, 324-Ball Chip-Scale BGA (0.8mm Pitch), Speed Grade 3, Commercial Grade, Pb-Free


Part Description:
Spartan-6 LXT 1.2V FPGA, 190 User I/Os, 324-Ball Chip-Scale BGA (0.8mm Pitch), Speed Grade 3, Commercial Grade, Pb-Free


PackageDescription:
BGA, 0.50mm Pitch, Square; 196 Pin, 14 Columns X 14 Rows, Body 8.00mm X 8.00mm X 1.20mm H, IPC Medium Density

Part Description:
Spartan-6 LX 1.2V FPGA, 106 User I/Os, 196-Ball Chip-Scale BGA (0.5mm Pitch), Speed Grade 2, Commercial Grade, Pb-Free


Part Description:
Spartan-6 LX 1.2V FPGA, 102 User I/Os, 144-Pin TQFP (0.5mm Pitch), Speed Grade 3, Commercial Grade, Pb-Free


PackageDescription:
BGA, 0.80mm Pitch, Square; 225 Pin, 15 Columns X 15 Rows, Body 13.00mm X 13.00mm X 1.40mm H, IPC Medium Density

Part Description:
Spartan-6 LX 1.2V FPGA, 132 User I/Os, 225-Ball Chip-Scale BGA (0.8mm Pitch), Speed Grade 3, Commercial Grade, Pb-Free


Part Description:
Spartan-6 LX 1.2V FPGA, 102 User I/Os, 144-Pin TQFP (0.5mm Pitch), Speed Grade 3, Industrial Grade, Pb-Free


Part Description:
Spartan-6 LX 1.2V FPGA, 316 User I/Os, 484-Ball Fine-Pitch BGA (1.0mm Pitch), Speed Grade 2, Commercial Grade, Pb-Free


Part Description:
Spartan-6 LXT 1.2V FPGA, 296 User I/Os, 484-Ball Fine-Pitch BGA (1.0mm Pitch), Speed Grade 3, Commercial Grade, Pb-Free


Part Description:
Spartan-6 LX 1.2V FPGA, 408 User I/Os, 676-Ball Fine-Pitch BGA (1.0mm Pitch), Speed Grade 2, Commercial Grade, Pb-Free


PackageDescription:
BGA, 1.00mm Pitch, Square; 256 Pin, 16 Columns x 16 Rows, Body 17mm X 17mm X 1.55mm H, IPC Medium Density


PackageDescription:
BGA, 1.00mm Pitch, Square; 1156 pin, 34 Columns X 34 Rows, Body 35.00mm X 35.00mm X 3.50mm H, IPC Medium Density

Part Description:
Virtex-6 FPGA, 20 GTXs, 600 User I/Os, 1156-Pin BGA, Speed Grade 1, Commercial, Pb-Free


Part Description:
Virtex-6 FPGA, 20 GTXs, 600 User I/Os, 1156-Pin BGA, Speed Grade 2, Commercial, Pb-Free


PackageDescription:
BGA, 1.00mm Pitch, Square; 484 Pin, 22 Columns X 22 Rows, Body 23.00mm X 23.00mm X 2.86mm H, IPC Medium Density

Part Description:
Virtex-6 LXT Platform FPGA, 240 User I/Os, 8 GTXs, 484-Ball FFBGA, Speed Grade 1, Commercial Grade, Pb-Free


PackageDescription:
BGA, 1.00mm Pitch, Square; 484 Pin, 22 Columns x 22 Rows, Body 23mm X 23mm X 2.60mm H, IPC Medium Density

Part Description:
Artix-7 FPGA, 285 User I/Os, 4 GTP, 484-Ball BGA, Speed Grade 2, Commercial Grade, Pb-Free


Part Description:
Artix-7 FPGA, 300 User I/Os, 8 GTP, 676-Ball BGA, Speed Grade 2, Commercial Grade, Pb-Free


Part Description:
Artix-7 FPGA, 210 User I/Os, 0 GTP, 324-Ball BGA, Speed Grade 2, Commercial Grade, Pb-Free


PackageDescription:
BGA, 1.00mm Pitch, Square; 1156 Pin, 34 Columns X 34 Rows, Body 35.00mm X 35.00mm X 3.350mm H, IPC Medium Density

Part Description:
Artix-7 FPGA, 500 User I/Os, 16 GTP, 1156-Ball BGA, Speed Grade 1, Commercial Grade, Pb-Free


PackageDescription:
BGA, 1.00mm Pitch, Square; 676 Pin, 26 Columns X 26 Rows, Body 27.00mm X 27.00mm X 2.54mm H, IPC Medium Density

Part Description:
Artix-7 FPGA, 400 User I/Os, 8 GTP, 676-Ball BGA, Speed Grade 2, Commercial Grade, Pb-Free


PackageDescription:
BGA, 1.00mm Pitch, Square; 1156 Pin, 34 Columns X 34 Rows, Body 35.00mm X 35.00mm X 3.10mm H, IPC Medium Density

Part Description:
Artix-7 FPGA, 500 User I/Os, 16 GTP, 1156-Ball BGA, Speed Grade 3, Commercial Grade, Pb-Free


Part Description:
Artix-7 FPGA, 16 GTPs, 600 User I/Os, 1156-Pin BGA, Speed Grade 2, Commercial Grade, Pb-Free


Part Description:
Artix-7 FPGA, 250 User I/Os, 4 GTP, 484-Ball BGA, Speed Grade 1, Commercial Grade, Pb-Free


Part Description:
Artix-7 FPGA, 4 GTPs, 250 User I/Os, 484-Ball Fine-Pitch Thin BGA (1.0mm Pitch), Speed Grade 1, Commercial Grade, Pb-Free


Part Description:
Artix-7 FPGA, 170 User I/Os, 256-Ball Fine-Pitch Thin BGA (1.0mm Pitch), Speed Grade 1, Commercial Grade, Pb-Free


Part Description:
KINTEX-7 FPGA, 400 User I/O, 8 GTXs, 676-Ball BGA, Speed Grade 1, Commercial Grade, Pb-Free


Part Description:
KINTEX-7 FPGA, 500 User I/O, 16 GTXs, 900-Ball BGA, Speed Grade 1, Commercial Grade, Pb-Free


PackageDescription:
BGA, 1.00mm Pitch, Square; 900 Pin, 30 Columns X 30 Rows, Body 31.00mm X 31.00mm X 3.35mm H, IPC Medium Density

Part Description:
KINTEX-7 FPGA, 400 User I/O, 32 GTXs, 900-Ball BGA, Speed Grade 1, Commercial Grade, Pb-Free


Part Description:
KINTEX-7 FPGA, 300 User I/O, 8 GTXs, 676-Ball BGA, Speed Grade 1, Commercial Grade, Pb-Free


Part Description:
KINTEX-7 FPGA, 300 User I/O, 8 GTXs, 676-Ball BGA, Speed Grade 2, Commercial Grade, Pb-Free


PackageDescription:
BGA, 0.80mm Pitch, Square; 400 Pin, 20 Columns X 20 Rows, Body 17.00mm X 17.00mm X 1.60mm H, IPC Medium Density

Part Description:
667 MHz Zynq™-7000 AP SoC, 130 PS I/O, 100 FPGA I/O, 400-Ball BGA, Speed Grade 1, Commercial Grade, Pb-Free


Part Description:
667 MHz Zynq™-7000 AP SoC, 130 PS I/O, 100 FPGA I/O, 400-Ball BGA, Speed Grade 1, Industrial Grade, Pb-Free


Part Description:
667 MHz Zynq™-7000 AP SoC, 130 PS I/O, 100 FPGA I/O, 400-Ball BGA, Speed Grade 1, Automotive Grade, Pb-Free


PackageDescription:
BGA, 0.80mm Pitch, Square; 484 Pin, 22 Columns X 22 Rows, Body 19.00mm X 19.00mm X 1.60mm H, IPC Medium Density

Part Description:
667 MHz Zynq™-7000 AP SoC, 130 PS I/O, 150 FPGA I/O, 484-Ball BGA, Speed Grade 1, Commercial Grade, Pb-Free


Part Description:
667 MHz Zynq™-7000 AP SoC, 130 PS I/O, 150 FPGA I/O, 484-Ball BGA, Speed Grade 2, Extended Grade, Pb-Free


PackageDescription:
BGA, 1.00mm Pitch, Square; 676 Pin, 26 Columns X 26 Rows, Body 27.00mm X 27.00mm X 2.60mm H, IPC Medium Density

Part Description:
Zynq™-7000 All Programmable SoC, Dual-core ARM® Cortex™-A9 CPU, 676-Ball BGA, Speed Grade 2, Industrial Grade, Pb-Free


PackageDescription:
QFP, 0.65mm Pitch, Square; 160 pin, 28.00mm L X 28.00mm W X 4.10mm H body, IPC Medium Density

Part Description:
XC9500 5V, 144 Macrocell CPLD, 133 User I/Os, 160-Pin PQFP, Commercial Grade


Part Description:
FastFLASH XC900XL, 3.3V High-Performance 144 Macrocell CPLD, 81 User I/O, 100-Pin TQFP, Speed Grade 10, Commercial Grade, Pb-Free


Part Description:
FastFLASH XC900XL, 3.3V High-Performance 144 Macrocell CPLD, 117 User I/O, 144-Pin TQFP, Speed Grade 10, Commercial Grade, Pb-Free


Part Description:
FastFLASH XC900XL, 3.3V High-Performance 144 Macrocell CPLD, 81 User I/O, 100-Pin TQFP, Speed Grade 5, Commercial Grade, Pb-Free


PackageDescription:
QFP, 0.65mm pitch, Square; 160 pin, 28.00mm L X 28.00mm W X 4.10mm H body, IPC Medium Density

Part Description:
XC9500 5V, 216 Macrocell CPLD, 133 User I/Os, 160-Pin PQFP, Commercial Grade, Pb-Free


Part Description:
XC9500, 5V CPLD with 288 Macrocells, 208-Pin HQFP, Commercial Grade


Part Description:
FastFLASH XC900XL, 3.3V High-Performance CPLD with 288 Macrocells, 208-Pin PQFP, Commercial Grade, Pb-Free


Part Description:
FastFLASH XC900XL, 3.3V High-Performance CPLD with 288 Macrocells, 144-Pin TQFP, Commercial Grade, Pb-Free


Part Description:
FastFLASH XC900XL, 3.3V High-Performance CPLD with 36 Macrocell, 34 User I/O, 44-Pin VQFP, Speed Grade 10, Commercial Grade, Pb-Free


PackageDescription:
BGA, 0.80mm Pitch, Square; 48 Pin, 7 Columns X 7 Rows, Body 7.00mm X 7.00mm X 1.80 H, IPC Medium Density

Part Description:
FastFLASH XC900XL, 3.3V High-Performance CPLD with 72 Macrocells, 48-Ball CSBGA, Commercial Grade, Pb-Free


Part Description:
FastFLASH XC900XL, 3.3V High-Performance CPLD with 72 Macrocells, 44-Pin VQFP, Commercial Grade, Pb-Free


Part Description:
XCF00S Series, Platform Flash In-System Programmable Configuration 3.3V PROM, 4-Megabit, Commercial Grade


Part Description:
XCF00P Series, Platform Flash In-System Programmable Configuration 1.8V PROM, 8-Megabit, Commercial Grade


Part Description:
XCF00P Series, Platform Flash In-System Programmable Configuration 1.8V PROM, 16-Megabit, Commercial Grade


Part Description:
XCF00P Series, Platform Flash In-System Programmable Configuration 1.8V PROM, 32-Megabit, Commercial Grade


PackageDescription:
BGA, 1.00mm Pitch, Square; 1156 Pin, 34 Columns X 34 Rows, Body 35.00mm X 35.00mm X 3.50mm H, IPC Medium Density

Part Description:
Kintex UltraScale, 40 DLL I/O, 416 HP I/O, 104 HR I/O, 1156-Pin BGA, Speed Grade 1, Commercial Grade


PackageDescription:
BGA, 1.00mm Pitch, Square; 1517 Pin, 39 Columns X 39 Rows, Body 40.00mm X 40.00mm X 3.51mm H

Part Description:
Kintex UltraScale, 48 DLL I/O, 520 HP I/O, 104 HR I/O, 1517-Pin BGA, Speed Grade 1, Commercial Grade


PackageDescription:
BGA, 1.00mm Pitch, Square; 1517 Pin, 39 Columns X 39 Rows, Body 40.00mm X 40.00mm X 4.09mm H, IPC Medium Density

Part Description:
Kintex UltraScale, 64 DLL I/O, 676 HP I/O, 156 HR I/O, 1517-Pin BGA, Speed Grade 1, Commercial Grade


PackageDescription:
BGA, 1.00mm Pitch, Square; 1924 Pin, 44 Columns X 44 Rows, Body 45.00mm X 45.00mm X 4.13mm H, IPC Medium Density

Part Description:
Kintex UltraScale, 64 DLL I/O, 676 HP I/O, 156 HR I/O, 1924-Pin BGA, Speed Grade 1, Commercial Grade


PackageDescription:
BGA, 1.00mm Pitch, Square; 2104 Pin, 46 Columns X 46 Rows, Body 47.50mm X 47.50mm X 4.11mm H, IPC Medium Density

Part Description:
Kintex UltraScale, 64 DLL I/O, 676 HP I/O, 156 HR I/O, 2104-Pin BGA, Speed Grade 2, Extended Temperature Grade


Part Description:
CoolRunner XPLA3, 3.3V, 512 Macrocell CPLD, 208-Pin PQFP, Commercial Grade


PackageDescription:
BGA, 1.00mm Pitch, Square; 2104 Pin, 46 Columns X 46 Rows, 52.50mm X 52.50mm X 4.59mm H

Part Description:
Virtex UltraScale+ FPGA, 3780000 Logic Cells, 676 HP I/O, Speed Grade 1, Extended Temperature Grade, 2104-Pin BGA


PackageDescription:
BGA, 1.00mm Pitch, Square; 2104 Pin, 46 Columns X 46 Rows, 47.50mm X 47.50mm X 4.59mm H

Part Description:
Virtex UltraScale+ FPGA, 2586150 Logic Cells, 676 HP I/O, Speed Grade 1, Extended Temperature Grade, 2104-Pin BGA


PackageDescription:
BGA, 1.00mm Pitch, Square; 1760 Pin, 42 Columns X 42 Rows, 42.50mm X 42.50mm X 3.71mm H

Part Description:
Zynq UltraScale+ MPSoC, Quad-Core ARM® Cortex™-A53 MPCore™ up to 1.5GHz, 214 PS I/O, 416 HP I/O, 96 HD I/O, 1760-Pin BGA


PackageDescription:
BGA, 1.00mm Pitch, Square; 1156 Pin, 34 Columns X 34 Rows, 35.00mm X 35.00mm X 4.01mm H

Part Description:
Zynq UltraScale+ RFSoC, Quad-Core ARM® Cortex™-A53 MPCore™ up to 1.5GHz, 214 PS I/O, 299 HP I/O, 48 HD I/O, 1156-Pin BGA


PackageDescription:
BGA, 1.00mm Pitch, Square; 1517 Pin, 39 Columns X 39 Rows, 40.00mm X 40.00mm X 4.01mm H

Part Description:
Zynq UltraScale+ RFSoC, Quad-Core ARM® Cortex™-A53 MPCore™ up to 1.5GHz, 214 PS I/O, 299 HP I/O, 48 HD I/O, 1517-Pin BGA


PackageDescription:
BGA, 1.00mm Pitch, Square; 1760 Pin, 42 Columns X 42 Rows, 42.50mm X 42.50mm X 4.01mm H

Part Description:
Zynq UltraScale+ RFSoC, Quad-Core ARM® Cortex™-A53 MPCore™ up to 1.5GHz, 214 PS I/O, 312 HP I/O, 96 HD I/O, 1760-Pin BGA


PackageDescription:
BGA,0.80mm Pitch, Square; 784 Pin, 28 Columns X 28 Rows, 23.00mm X 23.00mm X 3.32mm H

Part Description:
Zynq UltraScale+ MPSoC, Quad-Core ARM® Cortex™-A53 MPCore™ up to 1.5GHz, 214 PS I/O, 156 HP I/O, 96 HD I/O, 784-Pin BGA


PackageDescription:
BGA, 1.00mm Pitch, Square; 900 Pin, 30 Columns X 30 Rows, 31.00mm X 31.00mm X 2.97mm H, IPC Medium Density

Part Description:
Zynq UltraScale+ MPSoC, Quad-Core ARM® Cortex™-A53 MPCore™ up to 1.5GHz, 214 PS I/O, 156 HP I/O, 48 HD I/O, 900-Pin BGA


PackageDescription:
BGA, 1.00mm Pitch, Square; 1156 Pin, 34 Columns X 34 Rows, Body 35.00mm X 35.00mm X 3.35mm H, IPC Medium Density

Part Description:
Zynq UltraScale+ MPSoC, Quad-Core ARM® Cortex™-A53 MPCore™ up to 1.5GHz, 214 PS I/O, 208 HP I/O, 120 HD I/O, 1156-Pin BGA


# Operational Amplifiers

PackageDescription:
DIP; 8 Leads; row spacing 7.62 mm; Pitch 2.54 mm


PackageDescription:
SIP, 11 Pin, Pitch 2.54mm, Body 52.8mm X 6.6mm


PackageDescription:
SIP, 10 Pin, Pitch 2.54mm, Body 52.8mm X 6.6mm

Part Description:
High Precision, Low Offset, mV Input Isolation Amplifier


PackageDescription:
DIP, 12Pin, Pitch 2.54mm, Body 53.3mm X 25.4mm

Part Description:
Precision, Wide Bandwidth 3-Port Isolation Amplifier


PackageDescription:
SIP, Y12 Package Style, Pitch 2.54mm, Body 63mm X 8.3mm

Part Description:
120 kHz Bandwidth, Low Distortion, Isolation Amplifier


Part Description:
Ultralow Input Bias Current Operational Amplifier


Part Description:
Low Cost Low Power Instrumentation Amplifier


PackageDescription:
SOIC 8, Pitch 1.27mm - Body 4x5mm, IPC Medium Density


Part Description:
Single-Supply, Rail-to-Rail, Low Cost Instrumentation Amplifier


PackageDescription:
Side-Brazed Ceramic Dual In-Line Package (SBDIP) 16 Leads, Row Spacing 7.62 mm; Pitch 2.54 mm

Part Description:
High Precision, Low Noise Instrumentation Amplifier


Part Description:
High Common-Mode Voltage, Difference Amplifier


Part Description:
Dual Picoampere Input Current Bipolar Operational Amplifier


PackageDescription:
DIP 8 Leads, Row Spacing 7.62 mm; Pitch 2.54 mm

Part Description:
Ultralow Offset Voltage Dual Operational Amplifier


PackageDescription:
Ceramic DIP 8 Leads, Row Spacing 7.62 mm; Pitch 2.54 mm


Part Description:
Low Power, Low Noise Precision FET Operational Amplifier


PackageDescription:
SOIC 8, Pitch 1.27mm - Body 4x5mm, (w/thermal tab 2.29mm X 2.29mm), IPC Medium Density

Part Description:
1.5 GHz Ultrahigh Speed Operational Amplifier


PackageDescription:
SOT, 0.95mm pitch; 5 pin, 1.60mm W X 2.90mm L X 1.45mm H body, IPC Medium Density

Part Description:
800MHz, 50mW, Current Feedback Amplifier


Part Description:
1GHz, 5,500 V/us Low Distortion Amplifier


Part Description:
400 MHz, Low Power, High Performance Operational Amplifier


PackageDescription:
SOP, 14-Leads, Body 4.4x5mm (max), Pitch 0.65mm, IPC Medium Density

Part Description:
DSL Line Driver Amplifier With Power-Down


Part Description:
Low Noise, High Speed Amplifier for 16-Bit Systems


PackageDescription:
SOT23, 6-Leads, Body 1.6x3.0mm, Pitch 0.95mm, IPC Medium Density

Part Description:
Low Distortion, High Speed Rail-to-Rail Input/Output Amplifier With Disable


Library Ref:
Operational Amplifier x2 Type1 + Disable

PackageDescription:
MSOP, 10-Leads, Body 3.1x3.1mm (max), Pitch 0.50mm, IPC Medium Density

Part Description:
Dual Low Distortion, High Speed Rail-to-Rail Input/Output Amplifier


PackageDescription:
SOT363, SC70-6, SOT, 0.65mm Pitch, 6 pin, 1.25mm W X 2.00mm L X 1.10mm H, IPC Medium Density

Part Description:
Low Power, High Speed, Rail-to-Rail Input/Output Amplifier


Part Description:
Low-Power High-Speed Rail-to-Rail Input/Output Op Amplifier


Part Description:
2.7V, 800uA, 80MHz Rail-to-Rail I/O Amplifier


Part Description:
2.7V, 800 uA, 80 MHz Rail-to-Rail I/O Amplifiers


Part Description:
Dual 2.7V, 800uA, 80MHz Rail-to-Rail I/O Amplifier


PackageDescription:
SOT, 0.65mm pitch; 8 pin, 1.625mm W X 2.90mm L X 1.45mm H body, IPC Medium Density

Part Description:
Low Cost, 80 MHz FastFET Operational Amplifier


Part Description:
Low Cost, 300 MHz Voltage Feedback Amplifier


Part Description:
High Performance, 145 MHz FastFET Operational Amplifier


PackageDescription:
SOP, 0.65mm pitch; 8 pin, 3.00mm W X 3.00mm L X 1.10mm H body, IPC Medium Density


Part Description:
Ultralow Distortion, High Speed 0.95nV/sqrt Hz Voltage Noise Operational Amplifier


Part Description:
High Performance Video Operational Amplifier


Part Description:
Low Cost270 MHz Differential Receiver Amplifier


Part Description:
Lost Cost, 270MHz Differential Receiver Amplifier


Part Description:
Lost Cost, High Speed Differential Driver


Part Description:
Low Noise, Rail-to-Rail, Differential ADC Driver


PackageDescription:
QFN, (MO-220-VHHD-2) 0.50mm pitch,square; 8 pin X 8 pin, 5mm X 5mm X 1.00mm H body (w/thermal tab 3.45 X 3.45mm),  IPC Medium Density

Part Description:
High Speed, Triple Differential Receiver With Comparators


Part Description:
High Speed Low Power Wide Supply Range Amplifier


Part Description:
Low Cost, Low Power Video Operational Amplifier


Part Description:
Zero-Drift, High Voltage, Bidirectional Difference Amplifier


Part Description:
Single-Supply, Rail-to-Rail, Low Power, FET Input Operational Amplifier


Part Description:
JFET Input Instrumentation Amplifier with Rail-to-Rail Output


Part Description:
Precision Gain of 5 Instrumentation Amplifier


Part Description:
Single-Supply, Rail-to-Rail, Low Power FET-Input Operational Amplifier


Part Description:
16 V Rail-to-Rail, Zero-Drift, Precision Instrumentation Amplifier


Part Description:
Dual, 16 MHz, Rail-to-Rail FET Input Amplifier


Part Description:
10MHz, 20V/us, G= 1, 2, 5, 10 iCMOS Programmable Gain Instrumentation Amplifier


Part Description:
10MHz, 20V/us, G= 1, 10, 100, 1000 iCMOS Programmable Gain Instrumentation Amplifier


PackageDescription:
SOIC 14, Pitch 1.27mm - Body 4x8.75mm, IPC Medium Density

Part Description:
Very Low Distortion, Dual-Channel, High Precision Difference Amplifier


Part Description:
G = 0.2, Level Translation, 16-Bit ADC Driver


Part Description:
Low Power, Wide Supply Range, Low Cost Unity-Gain Difference Amplifier


Part Description:
Low Power, Wide Supply Range, Low Cost Difference Amplifier, G = ½, 2


Part Description:
Dual, Low Power Video Operational Amplifier


Part Description:
High Speed, Low Noise Video Operational Amplifier


PackageDescription:
QFN, 0.50mm pitch,square; 4 pin X 4 pin, 3mm X 3mm X 0.80mm H body (w/thermal tab 1.65 X 1.65mm),  IPC Medium Density

Part Description:
Low Cost, DC to 150MHz Variable Gain Amplifier


PackageDescription:
QFN, 0.65mm pitch,square; 4 pin X 4 pin, 4mm X 4mm X 1mm H body (w/thermal tab 2.25 X 2.25mm),  IPC Medium Density

Part Description:
Wide Bandwidth, DC Coupled Variable Gain Amplifier


PackageDescription:
QFN, (MO-220-WHHD-4) 0.50mm pitch,square; 8 pin X 8 pin, 5mm X 5mm X 0.80mm H body (w/thermal tab 3.25 X 3.25mm),  IPC Medium Density


PackageDescription:
SOIC 8, Pitch 1.27mm - Body 3.9x4.9mm, (w/thermal tab 2.41mm X 3.098mm), IPC Medium Density

Part Description:
Rail-to-Rail, High Output Current Amplifier


Part Description:
G = 20, Bidirectional, Zero Drift, Current Sense Amplifier


Part Description:
3nV/sqrt Hz Low Noise Instrumentation Amplifier


Part Description:
1nV/sqrt Hz Low Noise Instrumentation Amplifier


Part Description:
Precision, Selectable Gain, Fully Differential Funnel Amplifier


Part Description:
Low Power, Unity Gain, Fully Differential Amplifier and ADC Driver


Part Description:
Precision, Very Low Noise, Low Input Bias Current, Wide Bandwidth JFET Operational Amplifier


Part Description:
Dual, Precision, Very Low Noise, Low Input Bias Current, Wide Bandwidth JFET Operational Amplifier


Part Description:
Quad, Precision, Very Low Noise, Low Input Bias Current, Wide Bandwidth JFET Operational Amplifier


Part Description:
Low Cost, 250 mA Output, Single-Supply Amplifier


PackageDescription:
SOT353, SC70-5, SOT, 0.65mm Pitch, 5 pin, 1.25mm W X 2.00mm L X 1.10mm H, IPC Medium Density


Part Description:
Quad CMOS Rail-to-Rail General-Purpose Amplifiers


Part Description:
Zero-Drift, Single-Supply, Rail-to-Rail Input/Output Operational Amplifier


PackageDescription:
SOT23, 0.95mm Pitch; 5 Pin, 1.625mm W X 2.9mm L, IPC Medium

Part Description:
Precision Micropower, Low Noise CMOS, Rail-to-Rail Input/Output Operational Amplifier


Part Description:
Precision Micropower, Low Noise CMOS, Rail-to-Rail Input/Output Operational Amplifiers


Part Description:
Low Power, Precision Rail-to-Rail Output Operational Amplifier


PackageDescription:
SOP, 14-Leads, Body 5.1x4.5mm (max), Pitch 0.65mm, IPC Medium Density

Part Description:
Quad Low Power, Precision Rail-to-Rail Output Operational Amplifier


Part Description:
16 V Auto-Zero, Rail-to-Rail Output Operational Amplifier


Part Description:
16 V Auto-Zero, Rail-to-Rail Output Operational Amplifiers


Part Description:
Low Power, Rail-to-Rail Output, Precision JFET Amplifier


Part Description:
Dual Low Power, Rail-to-Rail Output, Precision JFET Amplifier


Part Description:
50 MHz, Precision, Low Distortion, Low Noise CMOS Amplifier


Part Description:
Precision, Very Low Noise, Low Input Bias Current Operational Amplifier


Part Description:
Precision, Very Low Noise, Low Input Bias Current Dual Operational Amplifier


Part Description:
Precision, Very Low Noise, Low Input Bias Current Quad Operational Amplifier


Part Description:
36V Precision, 2.8nV/sqrt Hz Rail-to-Rail Output Operational Amplifier


Part Description:
Ultraprecision, 36 V, 2.8 nV/sqrt Hz Dual Rail-to-Rail Output Operational Amplifier


Part Description:
Ultraprecision, 36V, 2.8 Nv/sqrt Hz Dual Rail-to-Rail Output Operational Amplifier


Part Description:
Dual Low Power, High Speed JFET Operational Amplifiers


Part Description:
Quad Low Power, High Speed JFET Operational Amplifier


Part Description:
Dual Low Cost, Precision JFET Input Operational Amplifier


Part Description:
Quad Low Cost, Precision JFET Input Operational Amplifier


Part Description:
Quad 4 MHz, 7 nV/sqr Hz, Low Offset and Drift, High Precision Amplifier


Part Description:
30V, Micropower, Overvoltage Protection, Dual Rail-to-Rail Input/Output Amplifier


PackageDescription:
QFN, 0.65mm Pitch, Square; 16 Pin, 4.00mm L X 4.00mm W X 0.80mm H Body (w/Thermal tab 2.4 X 2.4mm),  IPC Medium Density

Part Description:
Wideband, Differential, High Output Current Line Driver with Shutdown


Part Description:
55V, EMI Enhanced, Zero Drift, Ultralow Noise, Rail-to-Rail Output Operational Amplifier


Part Description:
55V, EMI Enhanced, Zero Drift, Ultralow Noise, Dual Rail-to-Rail Output Operational Amplifier


Part Description:
Precision, Ultralow Noise, RRIO, Zero-Drift Operational Amplifier


Part Description:
30V, High Speed, Low Noise, Low Bias Current, JFET Operational Amplifier


Library Ref:
Operational Amplifier Type1 + Exposed Pad

Part Description:
High Voltage, Precision Operational Amplifier


Part Description:
3.1nV/sqrt Hz, 1mA, 180MHz, Rail-to-Rail Input/Output Amplifier


Part Description:
3.1 nV/sqrt Hz, 1 mA, 180 MHz, Rail-to-Rail Input/Output Amplifiers


PackageDescription:
SON (DFN), 0.50mm pitch, 8 pin, 3mm X 3mm X 0.9mm H body (w/thermal tab 1.6 X 1.89mm),  IPC Medium Density

Part Description:
Low Noise, 1GHz FastFEET Operational Amplifier


Part Description:
Low Noise, 1GHz FastFET Operational Amplifier


Part Description:
Low Power, Low Noise and Distortion, Rail-to-Rail Output Amplifier


Part Description:
Dual Low Power, Low Noise and Distortion, Rail-to-Rail Output Amplifier


Part Description:
High Speed, Low Cost, Triple Operational Amplifier


Part Description:
1 nV/sqrt Hz, Low Power, Rail-to-Rail Output Amplifiers


Part Description:
1nV/sqrt Hz, Low Power, Rail-to-Rail Output Amplifier


Part Description:
Single, High Voltage, Low Noise, Low Distortion, Unity-Gain Stable, High Speed Operational Amplifier


Part Description:
Double, High Voltage, Low Noise, Low Distortion, Unity-Gain Stable, High Speed Operational Amplifier


Part Description:
Unity-Gain Stable, Ultralow Distortion, 1nV/sqrt Hz Voltage Noise, High Speed Operational Amplifier


Part Description:
High Voltage, Differential 18-Bit ADC Driver


PackageDescription:
QFN,0.50mm pitch,square; 4 pin X 4 pin, 3mm X 3mm X 1.00mm H body (w/thermal tab 1.45 X 1.45mm),  IPC Medium Density

Part Description:
Ultralow Distortion Current Feedback Differential ADC Driver


PackageDescription:
QFN,0.50mm Pitch, Square; 4 pin X 4 Pin, 3mm X 3mm X 0.80mm H Body (w/Thermal Tab 1.45 X 1.45mm),  IPC Medium Density

Part Description:
Ultralow Noise Drivers For Low Voltage ADCs


PackageDescription:
QFN, 0.50mm Pitch, Square; 6 Pin X 6 Pin, 4mm X 4mm Body (w/Thermal tab 2.4 X 2.4 mm), IPC Medium Density


Part Description:
Single Ultralow Distortion Differential ADC Driver


Part Description:
Ultralow Power, Low Distortion, Fully Differential ADC Driver


Part Description:
Single-Supply, Differential 18-Bit ADC Driver


PackageDescription:
SOP, 0.635mm Pitch; 20 Pin, 3.90mm W X 8.65mm L X 1.75mm H Body, IPC Medium Density


PackageDescription:
SOP, 0.635mm pitch; 16 pin, 3.9mm W X 4.895mm L X 1.75mm H Body, IPC Medium Density


PackageDescription:
QFN,0.50mm Pitch, Square; 4 Pin X 4 Pin, 3mm X 3mm X 1.00mm H Body (w/Thermal Tab 1.45 X 1.45mm), IPC Medium Density

Part Description:
Ultrafast 3.3V/5V Single-Supply SiGe Comparator


Part Description:
Rail-to-Rail, Very Fast, 2.5 V to 5.5 V Single-Supply TTL/CMOS Comparator


Part Description:
Rail-to-Rail, Very Fast, 2.5V to 5.5V Single-Supply LVDS Comparators


PackageDescription:
QFN,0.50mm pitch,square;12 pin,3.00mm L X 3.00mm W X 1.00mm H body (w/Thermal Tab 1.45 X 1.45mm),  IPC Medium Density


Part Description:
3.3GHz Ultralow Distortion RF/IF Differential Amplifier


Part Description:
Quad Low Cost JFET Input Operational Amplifier


PackageDescription:
SOIC, 1.27mm Pitch;16 Pin, 7.49mm W X 10.21mm L X 2.64mm H body, IPC Medium Density

Part Description:
200kHz High Stability Isolated Error Amplifier


Part Description:
DC-6000MHz, Single Voltage Supply Buffer Amplifier


Part Description:
0.5-8GHz Amplifier With HeatSink, AMF Series


PackageDescription:
MINI-CIRCUITS DQ849 Case, 0.66mm pitch, 8 pin, 3mm X 3mm X 0.99mm H body (w/thermal tab 1.7 X 1.7mm)

Part Description:
5 to 18GHz, 50 Ohm, Monolithic Amplifier


PackageDescription:
MINI-CIRCUITS WW107 Case, Body 2.16mm Diameter X 1.52mm H


PackageDescription:
MINI-CIRCUITS VV105 Case, Body 2.16mm Diameter X 1.22mm H


PackageDescription:
QFN, 0.50mm Pitch, Square; 8 Pin X 8 Pin, 5mm X 5mm X 0.8mm H Body (w/Thermal Tab 3.2 X 3.2mm),  IPC Medium Density


PackageDescription:
MINI-CIRCUITS DF782 Case, 1.50mm pitch; 4 pin, 2.44mm W X 4.49mm L

Part Description:
DC-8GHz Surface Mount Monolithic Amplifier


Part Description:
DC-7GHz, 5Volt-Surface Mount Monolithic Amplifier


Part Description:
110MHz, High Slew Rate, High Output Current Buffer


Part Description:
850MHz, Low Distortion Current Feedback Operational Amplifier


PackageDescription:
SOIC 16, Pitch 1.27mm, Body 7.5x10.5mm, IPC Medium Density

Part Description:
Low Noise, Low Distortion Instrumentation Amplifier


PackageDescription:
SOIC 8, Pitch 1.27mm, Body 4x5mm, IPC Medium Density


PackageDescription:
DIP; 16 Leads; Row Spacing 7.62 mm; Pitch 2.54 mm

Part Description:
Fast-Settling FET-Input Very High Accuracy Instrumentation Amplifier


PackageDescription:
SOIC 16, Pitch 1.27mm, Body 7.5x10.3mm, IPC Medium Density


Part Description:
High Speed FET-Input Instrumentation Amplifier


Part Description:
FET-Input, Low Power Instrumentation Amplifier


Part Description:
Precision, Low Power Instrumentation Amplifier


Part Description:
Audio Differential Line Receiver 0dB (G = 1)


Part Description:
Precision, Low Power, G = 10, 100 Instrumentation Amplifier


Part Description:
High-Speed, Precision, G = 10 or G = 0.1 Difference Amplifier


Part Description:
High-Voltage, Programmable Gain Difference Amplifier


Part Description:
±200V Common-Mode Voltage Difference Amplifier


Part Description:
High Common-Mode Voltage Difference Amplifier


PackageDescription:
SOIC 14, Pitch 1.27mm, Body 4x8.75mm, IPC Medium Density


Part Description:
Low-and High-Side Voltage Output, Current-Sense Amplifier


Part Description:
Bidirectional, Low- and High-Side Voltage Output, Current-Sense Amplifier


Part Description:
Dual, Low Power Instrumentation Amplifier


Part Description:
Dual Low Power, Single Supply Differential Amplifier


Part Description:
Dual High-Speed, Precision Difference Amplifier


Part Description:
Dual Audio Differential Line Receiver 0dB (G = 1)


Part Description:
Dual Low-and High-Side Voltage Output, Current-Sense Amplifier


PackageDescription:
SOP, 0.65mm pitch; 8 pin, 3.00mm W X 3.00mm L X 1.10mm H Body, IPC Medium Density

Part Description:
Micro-Power (50μA), Zerø-Drift, Rail-to-Rail Out Instrumentation Amplifier


PackageDescription:
SOP, 0.65mm Pitch; 24 Pin, 4.40mm W X 7.80mm L X 1.20mm H Body, IPC Medium Density

Part Description:
40V Precision Instrumentation Amplifier with Differential ADC Driver


PackageDescription:
DIP;  8 Pin of 16 Leads; Row Spacing 7.62 mm; Pitch 2.54 mm

Part Description:
Precision Lowest Cost Isolation Amplifier


PackageDescription:
SOIC, Pitch 1.27mm; 8 Pin of 28, 7.50mm W X 17.90mm L X 2.65mm H body, IPC Medium Density


Part Description:
Precision Switched Integrator Transimpedance Amplifier


PackageDescription:
SOIC 14, Pitch 1.27mm - Body 4x8.75mm, (Customized Version with Pin 2,3,4,5,6 Folded Up), IPC Medium Density

Part Description:
Precision Switched Integrator Transimpedance Amplifier (Customized Version with Pin 2,3,4,5,6 Folded Up)


PackageDescription:
SOIC 16, Pitch 1.27mm - Body 4x10mm, IPC Medium Density


PackageDescription:
MINI-CIRCUITS FG873 Case, 4 pin, 3.0mm W X 3.0mm L


Part Description:
Wide bandwidth Single JFET Operational Amplifier


Part Description:
Quad Low Power JFET Input Operational Amplifier


Part Description:
Precision High Speed Operational Amplifier


Part Description:
Quad Precision High Speed Operational Amplifier


PackageDescription:
DIP; 14 Leads; Row Spacing 7.62 mm; Pitch 2.54 mm


Part Description:
Low Power Low Offset Voltage Dual Comparators


Part Description:
Single General Purpose Voltage Comparator


Part Description:
Dual Low Power 10 MHz Rail-to-Rail I/O Operational Amplifier


Part Description:
High Speed Low Power Low Distortion Voltage Feedback Amplifier


Part Description:
TFT-LCD Quad, 16V RRIO High Output Current Operational Amplifier


Part Description:
Very High Speed, High Output Current, Voltage Feedback Amplifier


Part Description:
Dual Rail-to-Rail Input/Output 30V, Wide Voltage Range, High Output Operational Amplifier


PackageDescription:
SOIC,1.27mm,pitch;8 pin,3.905mm W X 4.895mm L X 1.68mm H body (w/thermal tab 3.1mm X 2.4mm), IPC Medium Density

Part Description:
High Speed, High Output Current, Dual Operational Amplifier


Part Description:
Dual High-Speed Audio Operational Amplifier


Part Description:
Quad Micropower, Rail-to-Rail Input and Output CMOS Operational Amplifier


Part Description:
Tiny CMOS Comparator with Rail-to-Rail Input and Open Drain Output


PackageDescription:
TO-263, 5 Leads, 1.70mm pitch; TO, 14.35mm L X 8.64mm W X 4.65mm H body IPC Medium Density

Part Description:
High Performance, High Fidelity, High Current Audio Buffer


Part Description:
300mA High Speed Buffer with Adjustable Current Limit


PackageDescription:
TO-263, TO,1.27mm pitch;7 pin,14.10mm L X 8.64mm W X 4.64mm H body, IPC Medium Density


Part Description:
Differential, High Speed Operational Amplifier


PackageDescription:
SOP, 0.65mm pitch; 8 pin,3.00mm W X 3.00mm L X 1.09mm H bodyI, PC Medium Density


Part Description:
Ultra-Low Noise, High-Speed Operational Amplifier With Shutdown


PackageDescription:
0.95mm, pitch; 6 pin, 1.65mm W X 2.97mm L X 1.00mm H body IPC Medium Density


PackageDescription:
QFN, 0.50mm Pitch, Square; 6 Pin X 6 Pin, 4mm X 4mm Body (w/Thermal Tab 2.65 X 2.65 mm), IPC Medium Density

Part Description:
Dual 700ps High Speed Comparator with RSPECL Outputs


PackageDescription:
QFN, 0.50mm pitch,square; 4 pin X 4 pin, 5mm X 5mm X 0.8mm H body (w/thermal tab 3.20 X 3.20mm),  IPC Medium Density

Part Description:
Quad 700ps High Speed Comparator With RSPECL Outputs


Part Description:
Zero Drift, Low Noise, EMI Hardened Amplifier


PackageDescription:
SOT23 5, Pitch 0.95mm, Body 1.67x2.99mm, IPC Medium Density

Part Description:
Single Precision, 17 MHz, Low Noise, CMOS Input CMOS Input Amplifier from the PowerWise® Family


Part Description:
Femtoampere Input Bias Current Precision Amplifier


PackageDescription:
SOT, 0.95mm Pitch; 6 Pin, 1.60mm W X 2.90mm L X 1.10mm H Body, IPC Medium Density

Part Description:
Precision High Voltage Current Sense Amplifier


Part Description:
Low Cost, Low Power, Input/Output Rail-To-Rail Operational Amplifiers


Part Description:
Quad Low-Voltage Rail-To-Rail Output Operational Amplifier


Part Description:
Dual General Purpose, Low Voltage, Tiny Pack Comparator


Part Description:
Single 1.8V, RRIO Operational Amplifiers


Part Description:
Low Noise, High Speed Precision Operational Amplifier


Part Description:
Picoamp Input Current, Microvolt Offset, Low Noise Operational Amplifier


PackageDescription:
SOIC, 1.27mm pitch; 16 pin, 7.50mm W X 10.4mm L X 2.65mm H body, IPC Medium Density


Part Description:
Dual Low Power Precision, Picoamp Input Operational Amplifiers


Part Description:
Fast Settling, JFET Input Operational Amplifier


Part Description:
Quad Decompensated Low Noise, High Speed Precision Op Amps


Part Description:
Dual Low Noise, Picoampere Bias Current, JFET Input  Operational Amplifier


Part Description:
500MHz, 3nV/sqrt Hz, AV≥10, Operational Amplifie, – 40°C to 85°C


Part Description:
90MHz, 22V/us 16-Bit Accurate Operational Amplifier


Part Description:
Dual 125mA, 50MHz Current Feedback Amplifier


Part Description:
Dual Low Noise, Rail-to-Rail, Precision Operational Amplifier


Part Description:
Quad Low Noise, Rail-to-Rail, Precision Operational Amplifier


Part Description:
4ns, 150MHz Dual Comparator with Independent Input/Output Supplies


PackageDescription:
SOT, 0.95mm Pitch; 6 Pin, 1.625mm W X 2.90mm L X 0.90mm H body, IPC Medium

Part Description:
4.5ns Dual Supply 3V/5V Comparator with Rail-to-Rail Output


Part Description:
Dual 4.5ns, Single Supply 3V/5V Comparators With Rail-to-Rail Outputs


PackageDescription:
SOP,0.65mm,pitch;20 pin,4.40mm W X 6.50mm L X 1.20mm H body (w/thermal tab 2.74mm X 4.95mm  ) IPC Medium Density

Part Description:
Dual 500mA, 200MHz xDSL Line Driver Amplifier


PackageDescription:
SON, (DFN) 0.50mm,pitch;12 pin,3.00mm W X 4.00mm L X 0.80mm H body (w/thermal tab 1.8 X3.4mm), IPC Medium Density


Part Description:
Dual 80MHz, 25V/us Low Power Rail-to-Rail Input and Output Precision Operational Amplifier


Part Description:
325MHz, Rail-to-Rail Input and Output, Low Distortion, Low-Noise, Precision Operational Amplifier


Part Description:
Quad 3mA, 100MHz, 750V/us Operational Amplifier


Part Description:
500mA Power Operational Amplifier with Adjustable Precision Current Limit


Part Description:
Dual 135uA, 14nV/sqrt Hz, Rail-to-Rail Output Precision Operational Amplifier


Part Description:
Quad 135uA, 14nV/sqrt Hz, Rail-to-Rail Output Precision Operational Amplifier


PackageDescription:
SON, 0.50mm pitch; 10 pin, 3.00mm W X 4.00mm L X 0.80mm H body (w/thermal tab 0.25 X3.65mm), LINEAR DE12(10) Package

Part Description:
33V, Ultralow Noise, Precision Operational Amplifier


PackageDescription:
SOP, 0.65mm pitch; 8 pin,3.00mm W X 3.00mm L X 1.10mm H body, IPC Medium Density

Part Description:
Precision, Gain Selectable High Side Current Sense Amplifier


PackageDescription:
SON, (DFN) 0.50mm,pitch; 8 pin,3.00mm W X 3.00mm L X 0.80mm H body (w/thermal tab 1.75 X2.48mm), IPC Medium Density

Part Description:
Dual 100MHz, Rail-to-Rail Input and Output, Ultralow 1.9nV/sqrt Hz Noise, Low Power Operational Amplifier


Part Description:
Single 60MHz, 20V/us, Low Power, Rail-to-Rail Input and Output Precision Operational Amplifier


Part Description:
Rail-to-Rail Output, 1.1nV/sqrt Hz, 3.5mA Dual Operational Amplifier


Part Description:
Rail-to-Rail Output, 1.1nV/sqrt Hz, 3.5mA Quad Operational Amplifier


Part Description:
High Voltage, Low Noise, Zero-Drift Operational  Amplifier


Part Description:
Precision Quad CMOS Rail-to-Rail Input/Output Amplifiers


PackageDescription:
SOIC,1.27mm pitch;8 pin,3.899mm W X 4.903mm L X 1.75mm H body ((w/thermal tab 2.489mm X 3.505mm), IPC Medium Density

Part Description:
140V CMOS Rail-to-Rail Output, Picoamp Input Current Operational Amplifier


Part Description:
High Voltage (5V to 100V), High-Side Current Sense Amplifier


Part Description:
500MHz Ultra-Low Bias Current FET Input Operational Amplifier


Part Description:
500MHz Precision, Low Power, Rail-to-Rail Output, Differential Op Amp


PackageDescription:
SOP, 0.65mm Pitch; 8 Pin, 3.00mm W X 3.00mm L X 1.10mm H body, (w/Thermal Tab 1.68X 1.88mm), IPC Medium Density

Part Description:
2.7GHz, 5V, Low Noise, Rail-to-Rail Input Differential Amplifier/Driver


PackageDescription:
QFN,0.50mm pitch,square; 4 pin X 4 pin, 3mm X 3mm X 0.80mm H body (w/thermal tab 1.55 X 1.55mm),  IPC Medium Density

Part Description:
3GHz, Low Noise, Rail-to-Rail Input Differential Amplifier/Driver


Part Description:
280MHz, 2.9ns Comparator with Rail-to-Rail Input and CMOS Output


Part Description:
High Speed Rail-to-Rail Input Comparator with LVDS Compatible Outputs


PackageDescription:
QFN, 0.50mm pitch, square; 3 pin X 3 pin, 3mm X 3mm X 0.80mm H body (w/thermal tab 1.70 X 1.70mm),  IPC Medium Density


Part Description:
Quad, 28MHz, Low-Noise, Low-Voltage, Precision Operational Amplifier


Part Description:
High-Output-Drive, Precision, Low-Power, Single-Supply, Rail-to-Rail I/O Dual Operational Amplifier


Part Description:
Low-Cost, Precision, High-Side Current-Sense Amplifier


Part Description:
High-Speed, Single-Supply, Gain of 2, Closed-Loop, Rail-to-Rail Buffers with Enable


Part Description:
Ultra-Low Offset/Drift, Low-Noise, Precision Amplifiers


Part Description:
Ultra-Low Offset/Drift, Low-Noise, Precision Amplifier


Part Description:
3V/5V, Low-Cost, Low-Power, Ultra-Small, 500MHz, Single-Supply Op Amps with Rail-to-Rail Outputs


PackageDescription:
SOP, 0.50mm, Pitch; 10 Pin, 3.00mm W X 3.00mm L X 1.10mm H Body (w/Thermal Tab  1.88 X 2.52 mm), IPC Medium Density

Part Description:
180MHz, Low-Noise, Low-Distortion,  Fully Differential Op Amp/SAR ADC Driver


Part Description:
36V, Low-Noise, Precision, Dual Operational Amplifier


PackageDescription:
SOT363, 0.65mm pitch; 6 pin, 1.25mm W X 2mm L, IPC Medium Density

Part Description:
1.8V, 15MHz Low-Offset, Low-Power, Rail-to-Rail I/O Operational Amplifier


Part Description:
Ultra-High-Speed, Low-Distortion, Differential-to-Single-Ended Line Receivers With Enable


Part Description:
Low-Cost, Ultra-Small, Dual Single-Supply Comparator


Part Description:
Dual, Ultra-Fast, Low-Power Precision TTL Comparators


Part Description:
Single, Ultra-Fast, Low-Power Precision TTL Comparator


PackageDescription:
QFN, 0.50mm pitch, square; 3 pin X 3 pin, 3mm X 3mm X 0.80mm H body (w/thermal tab 1.25 X 1.25mm),  IPC Medium Density

Part Description:
Low-Noise, Low-Distortion, 1.35GHz Fully Differential Amplifiers


Part Description:
36V, Precision, Low-Noise, Wide-Band Amplifier


PackageDescription:
SON, 0.65mm pitch, 8 pin, 3mm X 3mm X 0.80mm H body (w/thermal tab 1.60 X 2.4mm),  IPC Medium Density

Part Description:
Dual 36V Operational Amplifier for 18-Bit SAR ADC Front-End


Part Description:
High Performance Dual Operational Amplifier


PackageDescription:
QFN, 0.65mm Pitch, Square; 16 Pin, 4mm X 4mm X 1mm H body (w/thermal tab 2.8 X 2.8mm),  IPC Medium Density

Part Description:
Quad 20 MHz, 200 μV Operational Amplifier With mCal


Part Description:
Quad 50 MHz, 200 μV Operational Amplifier With mCal


PackageDescription:
SOT89A, 3-Leads, Body 2.5x4.5mm, NXP 2142-01 Case

Part Description:
0-6GHz, 19dB, 5V, Broadband High Linearity Amplifier, InGaP HBT Technology


Part Description:
0-6GHz, 19.3dB, 5V, Broadband High Linearity Amplifier, InGaP HBT Technology


Part Description:
Ultralow Offset Voltage Operational Amplifier


Part Description:
150uV Maximum Offset Voltage Operational Amplifier


Part Description:
Precision Rail-to-Rail Input and Output Operational Amplifier


Part Description:
Micropower Single-Supply Rail-to-Rail Input/Output Operational Amplifier


Part Description:
Dual Low Noise, Low Drift, Single-Supply Operational Amplifier


Part Description:
Precision, Dual, Low Noise Low Input Bias Current Operational Amplifier


Part Description:
Dual Bipolar/JFET, Audio Operational Amplifier


Part Description:
Low Noise Precision Operational Amplifier


Part Description:
Dual Low Bias Current Precision Operational Amplifier


Part Description:
Low Noise, Precision, High Speed Operational Amplifier


Part Description:
Quad Low-Offset, Low-Power Operational Amplifier


PackageDescription:
SOIC 16, Pitch 1.27mm - Body 7.5x10.5mm, IPC Medium Density


Part Description:
Precision Low Noise, Low Input Bias Current Quad Operational Amplifier


Part Description:
High Speed, Fast Settling Precision Operational Amplifier


Part Description:
Low Voltage, Micropower, Quad Operational Amplifier


Part Description:
Quad Micropower Single-Supply Rail-to-Rail Input/Output Operational Amplifier


Part Description:
Dual Precision Micropower Single-Supply Operational Amplifier


Part Description:
Precision Micropower Single-Supply Operational Amplifier


Part Description:
Low Cost Precision Difet ® Operational Amplifier


Part Description:
Low Noise Precision Difet ® Operational Amplifier


Part Description:
Dual, SoundPlus™, High-Performance, Bipolar-Input Audio Operational Amplifier


PackageDescription:
SOP,0.65mm,pitch; 8 pin,3.00mm W X 3.00mm L X 1.10mm H body (w/thermal tab 1.57 X 1.89 mm), IPC Medium Density

Part Description:
High-Performance, Fully-Differential Audio Operational Amplifier


Part Description:
Quad High-Performance, JFET-Input, Audio Operational Amplifier


Part Description:
36V, Precision, Rail-to-Rail Input/Output, Low Offset Voltage, Low Input Bias Current Operational Amplifier With e-trim™


Part Description:
36-V, Precision, Rail-to-Rail Input/Output, Low Offset Voltage, Low Input Bias Current Op Amplifier With E-Trim


Part Description:
36-V, Precision, Rail-to-Rail Input/Output, Low Offset Voltage, Operational Amplifiers


Part Description:
2.2nV/sqrt Hz, Low-Power, 36-V Operational Amplifier


Part Description:
1.1nV/sqrt Hz Noise, Low Power, Precision Operational Amplifier


Part Description:
Dual, High Performance Audio Operational Amplifier


Part Description:
High-Precision, Low-Noise, Rail-to-Rail Output,11-MHz JFET Op Amp


Part Description:
Dual 36V, Precision, Rail-to-Rail Input/Output, Low Offset Voltage, Low Input Bias Current Operational Amplifier With e-trim™


Part Description:
Dual 2.2nV/sqrt Hz, Low-Power, Operational Amplifier


PackageDescription:
SON,  0.50mm Pitch, 8 Pin, 3mm X 3mm X 0.8mm H Body (w/Thermal Tab 1.55 X 2.5mm),  IPC Medium Density

Part Description:
1.1nV/sqrt Hz Noise, Low Power, PrecisionOperational Amplifier


Part Description:
Dual, High Precision, Low Noise Operational Amplifier


Part Description:
Dual High Precision, Low Noise Operational Amplifier


Part Description:
Dual High Precision, Operational Amplifier


Part Description:
High Precision, Low Noise Operational Amplifier


Part Description:
Dual Low Power, Single-Supply, Rail-To-Rail Operational MicroAmplifier Series


Part Description:
High-Speed, Single-Supply, Rail-to-Rail Operational Amplifier


Part Description:
Dual Low-Noise, Low Quiescent Current, Precision Operational Amplifier (e-trim Series)


Part Description:
Dual FET-Input, Low-Distortion Operational Amplifier


Part Description:
Ultra-Low Noise, Precision Operational Amplifier


Part Description:
Dual, Wideband, Low-Noise Operational Amplifier


Part Description:
Triple, Wideband, Fixed Gain Video BUFFER AMPLIFIER With Disable


Part Description:
36V, Precision, Rail-to-Rail Input/Output, Low Offset Voltage, Low Input Bias Current Quad Operational Amplifier with e-trim


Part Description:
Quad, 36-V, Precision, Rail-to-Rail Input/Output, Low Offset Voltage, Operational Amplifiers


Part Description:
Low-Power, Precision Single-Supply Quad Operational Amplifier


Part Description:
Quad High Precision Operational Amplifier


Part Description:
Quad 250-MHz, Rail-to-Rail I/O, CMOS Operational Amplifier


PackageDescription:
SOIC 8, Pitch 1.27mm - Body 4x5mm, (w/thermal tab 2.49mm X 3mm), IPC Medium Density

Part Description:
High-Voltage (100V), High-Current (50mA) Operational Amplifier, G=1 Stable


PackageDescription:
TO-3, 8 Pins, Texas LMF (O-MBCY-W8) Case

Part Description:
High Power Monolithic Operational Amplifier


PackageDescription:
DDPAK TO-263, TO, 1.70mm pitch; 5 pin, 15.24mm L X 8.925mm W X 4.83mm H body, IPC Medium Density


PackageDescription:
TO, 1.27mm Pitch; 7 Pin, 15.24mm L X 8.89mm W X 4.65mm H Body, IPC Medium Density


PackageDescription:
SOIC 20, Pitch 1.27mm - Body 7.5x12.9mm, (w/thermal tab 3.81mm X 4.32mm), IPC Medium Density

Part Description:
Power Operational Amplifier, 1.5A, 24V, 17MHz


Part Description:
High-Speed Precision Difet ® Operational Amplifier


Part Description:
Precision High-Speed Difet ® Operational Amplifier


PackageDescription:
TEXAS Case Style DRB(S-PVSON-N8), SON, 0.65mm pitch, 8 pin, 3mm X 3mm X 1.00mm H body (w/thermal tab 1.60 X 1.85mm)

Part Description:
Wideband, Fixed Gain, JFET-Input Amplifier


Part Description:
Wideband, Unity-Gain Stable, FET-Input Operational Amplifier


Part Description:
Wideband, Unity-Gain Stable, JFET-Input Operational Amplifier


Part Description:
Wideband, Voltage-Feedback Operational Amplifier With Disable


Part Description:
Wideband, Low-Power, Current Feedback Operational Amplifier


Part Description:
Ultra-Wideband, Current-Feedback Operational Amplifier With Disable


Part Description:
Very Low-Power, Rail-to-Rail Out, Negative Rail In, VFB Operational Amplifier


Part Description:
Wideband, Low-Noise, Voltage-Feedback Operational Amplifier


PackageDescription:
JEDEC MO-127, APEX Package Style CR, 12 Pin Power DIP, Pitch 5.08mm


PackageDescription:
TO-220 7 Leads - Vertical Mount - APEX CX Outline


PackageDescription:
Power 12 Pin SIP, EE Package Style, Pitch 2.54mm, Right Angle Formed Leads For Horizontal Mount

Part Description:
8A 400V High Voltage Power Operational Amplifier (EE Case Style)


PackageDescription:
Power 12 Pin SIP, DP Package Style, Pitch 2.54mm, Straight Leads For Vertical Mount

Part Description:
8A 400V High Voltage Power Operational Amplifier (DP Case Style)


PackageDescription:
Power SIP, EC Package Style, Pitch 2.54mm, Right Angle Formed Leads For Horizontal Mount

Part Description:
100mA 900V High Voltage Power Operational Amplifier (EC Case Style)


PackageDescription:
Power SIP, DQ Package Style, Pitch 2.54mm, Reverse Right Angle Formed Original Straight Leads For Flipped  Horizontal Mount

Part Description:
100mA 900V High Voltage Power Operational Amplifier (DQ Case Style)


PackageDescription:
Power SIP, DQ Package Style, Pitch 2.54mm, Straight Leads For Vertical Mount


Part Description:
Zerø-Drift, High-Voltage, Programmable Gain Instrumentation Amplifier


PackageDescription:
SOP, 0.65mm pitch; 16 pin, 4.40mm W X 5.00mm L X 1.20mm H body IPC Medium Density

Part Description:
Precision, Zero-Drift, High-Voltage, Programmable Gain Instrumentation Amplifier


Part Description:
0.05-1.5GHz Surface Mount Monolithic Amplifier


Part Description:
0.05-6GHz Surface Mount Monolithic Amplifier


PackageDescription:
MINI-CIRCUITS DL1636 Case, 1.27mm pitch; 8 pin, 6.00mm W X 4.90mm L

Part Description:
0.03 to 2.7GHz, 50 Ohm, Ultra High Dynamic Range Monolithic Amplifier


Part Description:
Low Noise, High IP3, 0.05 to 5GHz, 50 Ohm, Monolithic Amplifier


PackageDescription:
ST Microelectronic  5 Leads PENTAWATT Verttical Case


Library Ref:
Operational Amplifier Type5 + Exposed Pad

PackageDescription:
SOP, 8-Leads, Body 3x3mm (max), Pitch 0.65mm, (w/thermal tab 1.52 X 1.9 mm), IPC Medium Density


Part Description:
Low Distorsion,High Slew Rate, Current-Feedback Amplifier


Part Description:
Low Distorsion,High Slew Rate, Dual Current-Feedback Amplifiers


PackageDescription:
SOIC, 1.27mm pitch; 8 pin, 4.00mm W X 5.00mm L X 1.68mm H body (w/thermal tab), IPC Medium Density

Part Description:
High-Voltage, Low Distorsion, Current-Feedback Operational Amplifier


PackageDescription:
SOIC 8, Pitch 1.27mm - Body 4x5mm, (w/Thermal Tab 2.41mm X 3.1mm), IPC Medium Density

Part Description:
Dual, High Output Current, 120-MHz Amplifier


Part Description:
1.8GHz, Low Distorsion, Current-Feedback Amplifier


Part Description:
2GHz, Low Distorsion, Dual Current-Feedback Amplifier


Part Description:
Dual 100MHz Low-Noise High-Speed Amplifier


Part Description:
3.3V, 100MHz, 43V/us, Fully Differential CMOS Amplifier w/Shutdown


Part Description:
Fully Differential Input/Output Low Noise Amplifier With Shutdown


Part Description:
High-Speed, Low Noise, Fully-Differential I/O Amplifier


PackageDescription:
SOP, 0.65mm Pitch; 8 pin, 3.00mm W X 3.00mm L X 1.10mm H body (w/thermal tab 1.57 X 1.89 mm), IPC Medium Density

Part Description:
High-Speed Differential I/O Amplifier With Shutdown


Part Description:
Very Low-Power High Speed Rail-To-Rail Input/Output Voltage Feedback Operational Amplifier


PackageDescription:
QFN,0.50mm pitch,square; 4 pin X 4 pin, 3mm X 3mm X 1.00mm H body (w/thermal tab 1.55 X 1.55mm),  IPC Medium Density


PackageDescription:
TEXAS Case Style W(R-GDFP-F16), CFP, 1.27mm Pitch, Ceramic Dual FlatPacka 16 Pins, 6.73mm L X 10.16mm W X 2.03mm H body

Part Description:
Rad-Tolerant Class V, Wideband, Fully Differential Amplifier


Part Description:
Very Low Power, Negative Rail Input, Rail-to-Rail Output, Fully Differential Amplifier


PackageDescription:
SOP, 0.50mm pitch; 38 pin, 4.40mm W X 9.70mm L X 1.20mm H body, IPC Medium Density

Part Description:
Very Low Power Quad Channel Rail-to-Rail Output Fully Differential Amplifier


Part Description:
Ultra Low Power, Rail-to-Rail Output, Fully-Differential Amplifier


Part Description:
High-Voltage, High Slew Rate, Wideband FET-Input Operational Amplifier


PackageDescription:
SOP, 0.65mm pitch; 28 pin, 4.50mm W X 9.70mm L (thermal tab 6.46 X 2.35mm), IPC Medium Density


Part Description:
Enhanced-JFET Low-Offset Dual Operational Amplifier


Part Description:
Enhanced-JFET Precision Quad Operational Amplifier


Part Description:
Dual Low-Power JFET-Input Operational Amplifier


Part Description:
Dual Low-Noise JFET-Input Operational Amplifier


Part Description:
Low Noise JFET Dual Operational Amplifiers


Part Description:
Quad Low-Noise JFET-Input Operational Amplifier


Part Description:
LinCMOS Precision Quad Operational Amplifier


Part Description:
Dual MicroPower LinCMOS Voltage Comparator


Part Description:
Quad Excalibur Low-Noise, High-speed JFET-Input Operational Amplifier


Part Description:
500uA, 3MHz Rail-to-Rail Input/Output Operational Amplifier With Shutdown


PackageDescription:
SOT, 0.95mm Pitch; 5 pin, 1.60mm W X 2.90mm L X 1.45mm H body, IPC Medium Density

Part Description:
Low-Power Rail-to-Rail Input/Output Operational Amplifier


Part Description:
600uA 2.8MHz Rail-to-Rail Input/Output High-Drive Operational Amplifier With Shutdown


Part Description:
2.7-V Quad High-Slew-Rate Rail-to-Rail Output Operational Amplifier


Part Description:
Dual 40-ns, microPOWER, Push-Pull Output Comparator


Part Description:
Dual Nanopower Push-Pull Output Comparator


Part Description:
Dual Channel, 4.5ns Rail-to-Rail, High-Speed Comparator


Part Description:
Dual 4.5ns Rail-to-Rail, High-Speed Comparator


PackageDescription:
SOT, 0.95mm Pitch; 5 Pin, 1.50mm W X 3.00mm L X 1.10mm H Body, IPC Medium Density


Part Description:
Rail-to-Rail Output Current Quad Operational Amplifier


Part Description:
Input/Output Rail-to-Rail Low-Power Operational Amplifier


Part Description:
Input/Output Rail-to-Rail Low-Power Dual Operational Amplifier


PackageDescription:
QFN, 0.50mm pitch,square; 4 pin X 4 pin, 3mm X 3mm X 1mm H body (w/thermal tab 1.80 X 1.80mm),  IPC Medium Density

Part Description:
Quad High Merit Factor (1.15MHz for 45uA) CMOS Operational Amplifier


# Optocouplers

PackageDescription:
SOIC, 1.27mm Pitch; 16 Pin,4.40mm W X 10.15mm L X 2.20mm H Body, IPC Medium Density

Part Description:
DC Input Quad Channel Half-Pitch Phototransistor Optocoupler


PackageDescription:
SOIC, 2.54mm Pitch; 16 Pin, 6.50mm W X 19.84mm L X 4.60mm H body, IPC Medium Density

Part Description:
DC-input Quad Channel Full-Pitch Phototransistor Optocoupler


PackageDescription:
6-Leads Stretched Surface Mount SO Package, Pitch 1.27mm, Body 4.4x3.6mm, Pitch 1.27mm


Part Description:
High Speed, Low Power Digital Optocoupler


PackageDescription:
SOIC, 1.27mm Pitch; 6 Pin, 6.81mm W X4.58mm L X 3.307mm H Body, BROADCOM ACPL-P347

Part Description:
1A Output Current SiC/GaN MOSFET and IGBT Gate Drive Optocoupler in Stretched SO6


PackageDescription:
SOIC, 1.27mm Pitch; 6 Pin, 6.90mm W X 4.70mm L X 3.60mm H Body, IPC Medium Density

Part Description:
High Speed LVTTL Compatible 3.3Volt/5Volt Optocoupler


PackageDescription:
SOIC 16, Pitch 1.27mm - Body 4x10mm, IPC Medium Density

Part Description:
Quad-Channel, All-In-One 15 MBd Digital Logic Gate Optocoupler


PackageDescription:
DIP; 6 Leads; Row Spacing 7.62 mm; Pitch 2.54 mm

Part Description:
500mA, 60V, Short Circuit Protection (Non-latch Type), Only For DC Load, GU 1 Form A, PhotoMOS Relay


PackageDescription:
PANASONIC_AQV21(DIP) 2.54mm pitch; 6 pin, 6.45mm W X 8.85mm L X 3.40mm H body


PackageDescription:
PANASONIC_AQV21(SOP) 2.54mm pitch; 6 pin, 4.40mm W X 6.30mm L X 2.20mm H body


PackageDescription:
SOIC,2.54mm pitch;6 pin,6.44mm W X 8.80mm L, IPC Medium Density

Part Description:
High Sensitivity And Low On-Resistance HE PhotoMOS Relay


PackageDescription:
PANASONIC_AQV25(SOP) 2.54mm pitch; 6 pin, 4.40mm W X 6.30mm L X 2.20mm H body


PackageDescription:
DIP Gull Wing Surface Mount, 8-Leads, Body 9.86x6.4mm (nom), Pitch 2.54mm, IPC Medium Density

Part Description:
General Use and Economy Type (2 Form A) Reinforced Insulation, GU-E PhotoMOS Relay


PackageDescription:
DIP; 8 Leads; Row Spacing 7.62 mm; Pitch 2.54 mm

Part Description:
High Cost-Performance DIP8-Pin Type With Reinforced Insulation ,60V, 2 Form A, GU-E PhotoMOS Relay


PackageDescription:
PANASONIC AQW21 Gull Wing Surface Mount, 8-Leads, Body 9.78mm x 6.4mm, Pitch 2.54mm


Part Description:
Optocoupler, Phototransistor Output, With Base Connection


PackageDescription:
DIP Gull Wing Surface Mount, 6-Leads, Body 8.89x6.60mm (max), Pitch 2.54mm, IPC Medium Density

Part Description:
Optocoupler, Photodarlington Output, Low Input Drive Current


PackageDescription:
TT ELECTRONICS 4N49U Series, LCC,1.27mm Pitch, Rect.; 6 Pin, 6.22mm L X 4.32mm W X 1.85mm H Body

Part Description:
Surface Mount Optically Coupled Isolator


Part Description:
High Speed Optocoupler, 100 kBd, Low Input Current, Photodiode Darlington Output


PackageDescription:
DIP 8 Leads, Row Spacing 10.16mm; Pitch 2.54 mm

Part Description:
5.0 Amp High Output Current IGBT Gate Drive Optocoupler


PackageDescription:
SOIC, 1.27mm, pitch; 4 pin, 2.60mm W X 4.40mm L X 2.42mm H body, IPC Medium Density

Part Description:
DC Input, Half-Pitch Phototransistor Optocoupler


PackageDescription:
PANASONIC AQW21 Gull Wing Surface Mount, 8-Leads, Body 9.86mm x 6.4mm, Pitch 2.54mm

Part Description:
High cost-performance, 60V 500mA, 5000V Reinforced Insulation, GU-E 2 Form A, PhotoMOS Relay


Part Description:
GE 2 Form A, PhotoMOS Relay, DIP8-Pin Type With Reinforced Insulation


PackageDescription:
DIP; 4 Leads; Row Spacing 7.62 mm; Pitch 2.54 mm


PackageDescription:
PANASONIC AQY21(DIP), Gull Wing Surface Mount, 4-Leads, Body 4.78mm x 6.4mm, Pitch 2.54mm


PackageDescription:
PANASONIC Serie AQY22(SON)  Small Outline No Lead, 4 pins, 2.2x2.95mm

Part Description:
120mA 40V, 1 Form A Micro-miniature PhotoMOS Relay (SON Package)


PackageDescription:
PANASONIC Serie AQY22(SSOP) Flat Leads SSOP  4 pins, 4.45x2.65mm

Part Description:
Lower Output Capacitance and On Resistance (CXR10), 40 V Load Voltage PhotoMOS Relay


Part Description:
150mA 25V, 1 Form A Micro-miniature PhotoMOS Relay (SON Package)


Part Description:
Lower Output Capacitance and On Resistance (CXR5), 25V Load Voltage PhotoMOS Relay


Part Description:
250mA 40V, 1 Form A Micro-miniature PhotoMOS Relay (SON Package)


PackageDescription:
PANASONIC Serie AQY2, TSON Super Miniature Outline No Lead, 4 pins, 1.95x1.8mm

Part Description:
Vin 3.3V/5V, Capacitor Coupled Isolation Type


PackageDescription:
SOIC,2.54mm,pitch;4 pin,4.40mm W X 4.30mm L X 2.20mm H body, IPC Medium Density

Part Description:
1 Form A, Solid State Relay (Photo MOSFET), 60V/0.2A/1 Ohm


PackageDescription:
PCB Mount Mini-SIP Solid State Relay , Body 28mm x 5mm


Part Description:
Phototransistor Optocoupler High Collector-Emitter Voltage Type


PackageDescription:
DIP Gull Wing Surface Mount, 6-Leads, Body 7.3x6.5mm, Pitch 2.54mm, IPC Medium Density


PackageDescription:
SOIC, 2.54mm Pitch; 4 Pin, 3.81mm W X 4.089mm L X 2.184mm H body, IPC Medium Density

Part Description:
60V Blocking Voltage, 700mA Load Current, Ron 0.55 Ohm, 1-Form-A Normally-Open Single Channel OptoMOS Relay


Part Description:
100V Blocking Voltage, 150mA Load Current, Ron 8 Ohm, 1-Form-A (normally open) Single Channel  OptoMOS Relay


Part Description:
400V Blocking Voltage, 120mA Load Current, Ron 30 Ohm, 1-Form-A Normally-Open Single Pole OptoMOS Relay


PackageDescription:
CRYDOM CX Serie, 4 Leads, Body 43.1 x 7.6mm, SIP Solid State Relay

Part Description:
4-15VDC Control Voltage, 48-530VAC Operating Voltage, 5A Load Current, SIP Solid State Relay, CX Serie


PackageDescription:
SOIC, 1.27mm pitch; 8  pin, 3.91mm W X 4.88mm L, IPC Medium Density

Part Description:
LVTTL/LVCMOS 3.3V High Speed-10 MBit/s Logic Gate Optocoupler


PackageDescription:
DIP Gull Wing Surface Mount, 8-Leads, Body 9.65x6.6mm, Pitch 2.54mm, FAIRCHILD 8LD MDIP

Part Description:
3A Output Current, High Speed MOSFET Gate Driver Optocoupler


PackageDescription:
SOIC, 2.54mm Pitch, 4 Pin, Body 6.5mm W X 4.6mm L X 4.6mm H

Part Description:
4-Pin High Operating Temperature Phototransistor Optocoupler


PackageDescription:
4-Leads Surface Mount SOIC Package, Body 5.3x4.4mm, Pitch 2.54mm

Part Description:
4-Pin Full Pitch Mini-Flat Package Transistor Output Optocoupler


PackageDescription:
SOTFL, 1.27mm Pitch; 4 Pin, 3.80mm W X 2.04mm L X 1.90mm H body

Part Description:
100V, 80mA, 8 ohm, SPST-NO (1 Form A) MOS FET Relay


PackageDescription:
SOIC,2.54mm,pitch;4 pin,4.40mm W X 3.90mm L X 2.10mm H body, IPC Medium Density


PackageDescription:
SOIC, 2.54mm Pitch, 6 Pin, Body 6.35mm W X 8.5mm L X 5.08mm H, FAIRCHILD MDIP 6L


PackageDescription:
DIP8 Gull Wing Surface Mount, 8-Leads, Body 11.15x9mm, Pitch 2.54mm


Part Description:
Low Input Current, High Gain Optocoupler


PackageDescription:
SOIC, 1.27mm pitch;8  pin, 4.00mm W X 5.00mm L, IPC Medium Density

Part Description:
Very High CMR, Wide VCC Logic Gate Optocoupler


Part Description:
High CMR, High Speed TTL Compatible Optocouplers


Part Description:
Dual-Channel, High CMR (10000V/us), High Speed  10 Mbit/s TTL Compatible Optocouplers


Part Description:
Dual-Channel, High CMR, High Speed  10 Mbit/s TTL Compatible Optocouplers


Part Description:
Dual-Channel, High Speed LVTTL Compatible 3.3 Volt Optocoupler


Part Description:
Dual-Channel, High CMR, High Speed  10 MBit/s TTL Compatible Optocouplers


Part Description:
Dual Channel Low Input Current, High Gain Optocouplers


Part Description:
Very High CMR, Wide VCC, Dual Channel Logic Gate Optocoupler


PackageDescription:
DIP8 Gull Wing Surface Mount, 8-Leads, Body 9.65 x 6.35mm (nom), Pitch 2.54mm, IPC Medium Density


PackageDescription:
DIP Gull Wing Surface Mount, 8-Leads, Body 9.65 x 6.35mm (nom), Pitch 2.54mm, IPC Medium Density

Part Description:
High Speed LVTTL Compatible 3.3V Optocouplers


Part Description:
High CMR, High Speed TTL Compatible Optocoupler


PackageDescription:
DIP Gull Wing Surface Mount, 8-Leads, Body 9.9x6.9mm (max), Pitch 2.54mm, IPC Medium Density

Part Description:
Dual-Channel High Speed 10 MBit/s Logic Gate Output Optocoupler


Part Description:
Dual-Channel High-Speed 10 MBit/s Logic Gate Optocouplers


Part Description:
0.4A Output Current IGBT Gate Drive Optocoupler


PackageDescription:
SOIC 12 Pin of 16, Pitch 1.27mm - Body 7.493x10.312mm, BROADCOM HCPL-315J

Part Description:
Dual Channel 0.5A Output Current IGBT Gate Drive Optocoupler


PackageDescription:
SOIC, 2.54mm Pitch, 8 Pin, Body 6.35mm W X 9.65mm L X 4.45mm H, AVAGO 8-pin DIP Package With Gull Wing Surface Mount Option 300


PackageDescription:
Side-Brazed Ceramic Dual In-Line Package (SBDIP) 8 Leads, Row Spacing 7.62 mm; Pitch 2.54 mm

Part Description:
Hermetically Sealed, Transistor Output Optocoupler for Analog and Digital Applications


Part Description:
40ns Propagation Delay, CMOS Optocoupler


PackageDescription:
SOIC, 1.27mm Pitch;8  Pin, 3.91mm W X 4.88mm L, IPC Medium Density

Part Description:
Optocoupler, Photodarlington Output, Low Input Current, High Gain, with Base Connection


Part Description:
Linear Optocoupler, High Gain Stability, Wide Bandwidth


PackageDescription:
SOIC, 2.54mm Pitch, 8 Pin, Body 6.64mm W X 9.77mm L X 4.059mm H, VISHAY SMD-8 Option 9


Part Description:
Dual Channel Optocoupler, Phototransistor Output


PackageDescription:
DIP; 16 Leads; Row Spacing 7.62 mm; Pitch 2.54 mm

Part Description:
Quad Channel Optocoupler, Phototransistor Output


PackageDescription:
CRYDOM LC Serie, 4 Leads, Body 24.1mm x 5.1mm, Mini-SIP SSR (Solid State Relay)

Part Description:
4-10VDC Control Voltage, 12-280VAC Operating Voltage, 2A Operating Current, Mini-SIP Solid State Relay(SSR), LC Serie


PackageDescription:
SOIC, 2.54mm, Pitch; 6 Pin, 6.35mm W X 8.382mm L X 4.699mm H body, CLARE LCA701S Serie

Part Description:
100V Blocking Voltage, ±1.5A Load Current, Ron 0.3 Ohm, Single Pole Normaly Open (1-Form-A) OptoMOS Relay


Part Description:
Single-Pole, Normally Open OptoMOS® Relay


PackageDescription:
SOIC, 2.54mm, Pitch; 6 Pin, 6.35mm W X 8.382mm L X 4.699mm H body, CLARE LCA717S Serie


PackageDescription:
SOIC, 4-Leads, Body 3.6x4.4mm, Pitch 2.54mm, IPC Medium Density


Part Description:
High Isolation Voltage Photocoupler (Photodarlington Transistor Output)


Part Description:
Quad High Isolation Voltage Photocoupler (Photodarlington Transistor Output)


PackageDescription:
SOIC, 1.27mm Pitch; 16 Pin,4.40mm W X 10.15mm L X 2.30mm H Body, IPC Medium Density

Part Description:
Low Input Current, High CRT, Quad Channel Photocoupler


PackageDescription:
DIP 6 Leads, Row Spacing 7.62 mm; Pitch 2.54 mm

Part Description:
0-400V, 140mA AC/DC HEXFET® Power MOSFET Single Pole Normally Open Photovoltaic Relay


PackageDescription:
DIP Gull Wing Surface Mount, 6-Leads, Body 8.7x6.5mm (max), Pitch 2.54mm, IPC Medium Density


PackageDescription:
SOIC, 2.54mm pitch; 4 pin, 6.65mm W X 4.69mm L, IPC Medium Density

Part Description:
Optocoupler, Phototransistor Output, High Reliability, 5300 VRMS


Part Description:
5000 VRMS High Reliability Optocoupler, Phototransistor Output


Part Description:
Optocoupler, Phototransistor Output, Low Input Current


PackageDescription:
SOIC, 1.27mm Pitch; 16 Pin, 4.575mm W X 10.77mm L X 2.16mm H Body, IPC Medium Density


PackageDescription:
CELDUC SKD Serie, 4 Leads, Body 43.6 x 10.55mm, DC Solid State Relay

Part Description:
DC Solid State Relay, 3-30VDC Input, 3A/60VDC Output, Bipolar Technology, SKD Serie


PackageDescription:
SOIC, 16-Leads, Body 10.4x4.6mm (max), Pitch 1.27mm, IPC Medium Density


Part Description:
Quad Channel Optocoupler, Phototransistor Output, AC Input


PackageDescription:
SOIC, 1.27mm, pitch; 4 pin, 4.40mm W X 3.60mm L X 2.80mm H body, IPC Medium Density

Part Description:
Photocoupler GaAs Ired & Photo-Transistor


PackageDescription:
SOIC,1.27mm Pitch; 4 pin, TOSHIBA Case (5mm Creepage)

Part Description:
Photocoupler InGaAs Infrared LED & Photo-Transistor


Part Description:
Photocoupler GaAlAs Infrared Led & Photo Darlington Transistor


PackageDescription:
SOIC, 1.27mm Pitch; 16 Pin, 4.40mm W X 10.30mm L X 2.10mm H Body, IPC Medium Density


Part Description:
Ion 120mA, Voff 40V, Ron 14 ohm,  1 Form A Photorelay


Part Description:
Ion 200mA, Voff 20V, Ron 5 ohm,  1 Form A Photorelay


Part Description:
Ion 3A, Voff 20V, Ron 0.08 ohm, 1 Form A Photorelay


PackageDescription:
SOIC, 2.54mm Pitch; 4 pin SO6L TOSHIBA Case

Part Description:
Photocoupler InGaAs Infrared LED & Photo Transistor


PackageDescription:
DIP 4 Leads, Row Spacing 7.62 mm; Pitch 2.54 mm

Part Description:
Photocoupler GaAs IRED & Photo−Transistor


PackageDescription:
VISHAY SOIC 4 Pin, Pitch 2.54mm Package, Body 4.39mm x 4.7mm


PackageDescription:
VISHAY SMD 6 Option 7, Pitch 2.54mm Package, Body 6.4mm x 8.6mm


# PCB Modules

PackageDescription:
Controls Interlocks Beam Interface Receiver (CIBIR) 1V2 Printed Circuit Board Module

Part Description:
Controls Interlocks Beam Interface Receiver (CIBIR) 1V2 Printed Circuit Board Module


PackageDescription:
Controls Interlocks Beam Optical B (CIBOB) 0V3 Printed Circuit Boar Module

Part Description:
Controls Interlocks Beam Optical B (CIBOB) 0V3 Printed Circuit Boar Module


PackageDescription:
Radiation And Magnetic Field Tolerant 10W DC/DC Converter Module

Part Description:
Radiation And Magnetic Field Tolerant 10W DC/DC Converter Module


PackageDescription:
Full Kit of Radiation and Magnetic Field Tolerant 10W DC/DC Converter Module

Part Description:
Full Kit of Radiation and Magnetic Field Tolerant 10W DC/DC Converter Module


Part Description:
Versatile Transceiver Module VTRX V2.1 Multi-Mode Configuration (MM)


Part Description:
Versatile Transceiver Module VTRX V2.1 Single-Mode Configuration (SM)


PackageDescription:
"Wideband Solid State Switch" Printed Circuit Board Module EDA-00278-V1

Part Description:
"Wideband Solid State Switch" Printed Circuit Board Module


PackageDescription:
"CCD HVPS Controller" Printed Circuit Board Module EDA-03143-V1-0

Part Description:
"CCD HVPS Controller" Printed Circuit Board Module


PackageDescription:
"CCD HVPS Controller" Printed Circuit Board Module EDA-03143-V2-0


PackageDescription:
Controls Interlocks Beam SFP (CIBSFP) Printed Circuit Board Module

Part Description:
Controls Interlocks Beam SFP (CIBSFP) Printed Circuit Board Module


PackageDescription:
Controls Interlocks Beam Optical (CIBO) Printed Circuit Board Module

Part Description:
Controls Interlocks Beam Optical (CIBO) Printed Circuit Board Module


PackageDescription:
Controls Interlocks Beam Interface Receiver (CIBIR) Printed Circuit Board Module

Part Description:
Controls Interlocks Beam Interface Receiver (CIBIR) Printed Circuit Board Module


PackageDescription:
Generic WiFi-BT-BLE MCU Module (IPEX antenna) ,Body 18.00mm x 31.4mm

Part Description:
Generic WiFi-BT-BLE MCU Module (IPEX antenna, 32-Mbit PSRAM)


PackageDescription:
Module With ESP8266EX Wi-Fi SoC With Memory Controller Including SRAM And ROM

Part Description:
Module With ESP8266EX Wi-Fi SoC With Memory Controller Including SRAM And ROM


Manufacturer:
FUTURE TECHNOLOGY DEVICES INTERNATIONAL (FTDI)


PackageDescription:
USB to Full-Handshake UART Development Module

Part Description:
USB to Full-Handshake UART Development Module


PackageDescription:
Processor and Processor Power Management IC, RAM, eMMC, and Wi-Fi/BT Module

Part Description:
Processor and Processor Power Management IC, RAM, eMMC, and Wi-Fi/BT Module


PackageDescription:
Quad Serial to Ethernet Module Body 48.26mm x 35.56mm

Part Description:
Quad Serial to Ethernet Module Based on W5300 & Cortex-M3


PackageDescription:
Embedded Web Server Module base on W5500 TCP/IP Chip

Part Description:
Embedded Web Server Module base on W5500 TCP/IP Chip


# Power Supplies

PackageDescription:
Body 39.6x15.7mm, 1W High Voltage Power Supply APS-series

Part Description:
12 V (11.5V up to 15.5V) To -1000V 1W High Voltage Power Supply APS-series


Part Description:
12 V (11.5V up to 15.5V) To +200V, 1W High Voltage Power Supply APS-series


PackageDescription:
50V to 90V Bias Power Supply with Built-in High Precision Temperature Compensation for MPPCs (Multi-Pixel Photon Counter)

Part Description:
50V to 90V Bias Power Supply with Built-in High Precision Temperature Compensation for MPPCs (Multi-Pixel Photon Counter)


PackageDescription:
QFN, 1.5mm pitch, Square; 20 Pin, 11.5mm X 11.5mm X 2mm H body (With Pullback Leads,Thermal Tab 3.5 X 3.5mm)

Part Description:
5V Input, 40V to 90V (2mA) Output, Power Supply for MPPC (Multi-Pixel Photon Counter)


PackageDescription:
HAMAMATSU C4900 Series, High Voltage Power Supply , Body 46x12mm

Part Description:
+12VDC Input, 0V to -1250VDC (0.5mA) Output, High Voltage Power Supply, C4900 RS Series


Part Description:
+15VDC Input, 0V to +1250VDC (0.6mA) Output, High Voltage Power Supply, C4900 RS Series


PackageDescription:
HAMAMATSU C9619 Series, High Voltage Power Supply , Body 62x45mm

Part Description:
+12VDC Input, 0V to -2000VDC (2mA) Output, High Voltage Power Supply, C9619 Series


PackageDescription:
EMCO CA-T Series, High Performance, Precision Regulated, High-Voltage Power Supply , Body 45.72x28.45mm

Part Description:
+12VDC Input, 0V to -1000VDC (0 to 1mA) Output, Precision Regulated, High-Voltage Power Supply, CA-T Series


Part Description:
+12VDC Input, 0V to -2000VDC (0 to 0.5mA) Output, Precision Regulated, High-Voltage Power Supply, CA-T Series


PackageDescription:
CU10 Series , Body 65.02x45mm, Power Supply


PackageDescription:
CU15 Series , Body 69.9x48mm, Power Supply


PackageDescription:
ECL10-P Series , Body 50.8x25.4mm, Power Supply


PackageDescription:
ECL15-P Series , Body 63.5x31.75mm, Power Supply


PackageDescription:
ECL25-P Series , Body 76.2x35.6mm, Power Supply


PackageDescription:
IRM-02 Series, Body 33.7x22.2mm, Power Supply

Part Description:
85-305VAC to 24VDC (83mA) 2W Power Supply


PackageDescription:
IRM-05 Series, Body 45.7x25.4mm, Power Supply

Part Description:
85-264VAC to 12VDC (420mA) 5W Power Supply


PackageDescription:
IRM-10 Series, Body 45.7x25.4mm, Power Supply

Part Description:
85-264VAC to 12VDC (850mA) 10.2W Power Supply


PackageDescription:
MYRRA 2.5W Single Output Series, Body 32.2x27.2mm, Power Supply

Part Description:
85-265VAC to 3.3VDC (750mA) 2.5W Power Supply


PackageDescription:
MYRRA 7.5W Single Output Series, Body 41.5x35.5mm, Power Supply

Part Description:
85-265VAC to 5VDC (1.5A) 7.5W Power Supply


Part Description:
85-265VAC to 3.3VDC (2.27A) 7.5W Power Supply


PackageDescription:
BELLNIX OHV Series, Ultracompact, Adjustable Output High-Voltage Power Supply , Body 44x16mm

Part Description:
+12VDC Input, 0 to -1000VDC (0 to 1.5mA) Output,  Ultracompact, Adjustable Output High-Voltage Power Supply, OHV Series


PackageDescription:
PBK-1 Series. Body 35x11mm, Height 27mm, Power Supply

Part Description:
85-264VAC to 5VDC (200mA) 1W Power Supply


PackageDescription:
PFE500F Outline, Body 122x70mm, AC-DC Power Module

Part Description:
85-264VAC to 12VDC (42A) 500W AC-DC Power Module


Part Description:
85-264VAC to 28VDC (18A) 500W AC-DC Power Module


PackageDescription:
15W AC/DC Power Module, Body 76x50.8mm, PMA 15 Series

Part Description:
90-264VAC to ±12VDC(+0.6A, -0.4A) ) 15W AC/DC Power Module, PMA 15 Series


PackageDescription:
24W AC/DC Power Module, Body 96x50.7mm, PMAS24 Series

Part Description:
90-264VAC to 48VDC (0.5A) 24W AC/DC Power Module, PMAS24 Series


PackageDescription:
TC Serie, Body 50.8x35.5mm, High Voltage Power Supply

Part Description:
+15VDC to 0-1kV 1.5mA Ultra-Compact, Low Ripple, Positive High Voltage Power Supply


PackageDescription:
TG Serie, Body 40.64x25.4mm, PMT High Voltage Power Supply

Part Description:
+5VDC to 0-1kV 1.5mA Ultra-Compact Negative High Voltage Power Supply


Part Description:
287-242VAC to 5VDC (1.5A) and ±15VDC(100mA) Triple Output Power Supply


PackageDescription:
TMG Series, Body 74.1 x 54.1mm, 50W Power Supply

Part Description:
90-264VAC to 24VDC (2.083A) 50W Power Supply


PackageDescription:
TML 10 Series, Dual Sym Outputs Power Supply, Body 64x45mm

Part Description:
85-264VAC to ±12VDC (±380mA) 10W Power Supply


PackageDescription:
TML 20 Single Output Series, Body 70.5x48.5mm, Power Supply


PackageDescription:
TML 20 Triple Output Series , Body 70.5x48.58mm, Power Supply

Part Description:
90-264VAC to  5VDC (2.8A) and ±15VDC (200mA), 20W Triple Output Power Supply


PackageDescription:
TML 40 Series, Dual Sym Outputs, Body 89.5x64mm, Power Supply

Part Description:
90-264VAC to ±15VDC (1333mA) 40W Power Supply


PackageDescription:
TMLM 04 Series , Body 36.5x27mm, Power Supply

Part Description:
90–264VAC to 5VDC (800 mA) 4W Power Supply


PackageDescription:
TMLM 05 Series , Body 50.9x25.5mm, Power Supply


PackageDescription:
TMLM 05 Series , Body 50.8x25.4mm, Power Supply


PackageDescription:
TMM  60W Model For PCB Mount, Body 81.3x67.5mm

Part Description:
85-264VAC to 15VDC/4A Encapsulated 60W Power Supply (PCB Mount Version)


PackageDescription:
TMP 07 Series, Body 50.8x25.4mm, Power Supply

Part Description:
85-264VAC to 24VDC (291mA) 7W Power Supply


PackageDescription:
TMP Series 10W Model For PCB Mount, Body 45x64mm, Height 19.2mm

Part Description:
85-264VAC to ±12VDC (±380mA) 10W Dual Outputs Power Supply


Part Description:
85-264VAC to ±15VDC (500mA) 15W Power Supply


PackageDescription:
TMP Series 30W Model For PCB Mount, Body 88.9x63.5mm

Part Description:
85-264VAC to 48VDC (625mA) 30W Single Output Power Supply


PackageDescription:
TMP  30W Model For PCB Mount, Body 88.9x63.5mm

Part Description:
85-264VAC to 5VDC (3A) and ±15VDC (500mA) 30W Triple Output Power Supply


PackageDescription:
TMPM 10 Series, Body 52.4x27.2mm, Power Supply

Part Description:
85-264VAC to 24VDC (417mA) 10W Power Supply


PackageDescription:
TMPS 05 Series, Body 25.4 x 25.4mm, 5W Power Supply


PackageDescription:
TMS 6 Series , Body 50x40mm, Height 20mm

Part Description:
85-264VAC to ±15VDC (350mA) 6W Power Supply


PackageDescription:
TMS 25 Series , Body 76x51mm, Height 28mm

Part Description:
85-264VAC to ±15VDC (800mA) 25W Power Supply


PackageDescription:
TMT  15W Model For PCB Mount, Body 55x45mm


PackageDescription:
TOM12W Single Output Series , Body 65x32mm, Power Supply


PackageDescription:
TOM25W Single Output Series , Body 85x41mm, Power Supply


PackageDescription:
TOP 100 Series 100W Power Supplies, Body 101.6 x 50.8mm

Part Description:
85-264VAC to 15VDC (6.7A) 100W Power Supply


PackageDescription:
TOP 200 Series 200W Power Supplies, Body 127 x 76.2mm

Part Description:
85-264VAC to 48VDC (4.2A) 200W Power Supply


PackageDescription:
TPM  30/40W Model For PCB Mount, Body 90x65mm


PackageDescription:
TPP 65 Series Power Supply, Body 76.2 x 50.8mm

Part Description:
85-264VAC to 12VDC (5.42A) 65W Power Supply


PackageDescription:
TS Serie, Body 30.2x15.5mm, High Voltage Power Supply

Part Description:
+12VDC to 0-200VDC, 50mA, Low Ripple, Ultra-Compact Negative High Voltage Power Supply


Part Description:
85-264VAC to 5VDC (600mA) and +3.3VDC (120mA) 4W Power Supply


Part Description:
85-264VAC to ±15VDC (±300mA) 10W Dual Outputs Power Supply


# Regulators

PackageDescription:
TO99, 8 Leads, Body Dia. 9.4mm (max), Lead Diameter 5.08mm

Part Description:
Pin Programmable Precision Voltage Reference


PackageDescription:
DIP 8 Leads, Row Spacing 7.62 mm; Pitch 2.54 mm


PackageDescription:
SOIC 8, Pitch 1.27mm, Body 4x5mm, IPC Medium Density

Part Description:
5V ±20mV High Precision Voltage Reference


Part Description:
10V ±10mV High Precision Voltage Reference


PackageDescription:
SON, (DFN) 0.50mm,pitch; 8 pin,3.00mm W X 3.00mm L X 0.80mm H body (w/thermal tab 1.7 X2.44mm), IPC Medium Density

Part Description:
Adjustable 1.5V to 5.1V, 800 mA Ultralow Noise, High PSRR, RF Linear Regulator


PackageDescription:
SOIC 8, Pitch 1.27mm - Body 3.9x4.9mm, (w/thermal tab 2.41mm X 3.098mm), IPC Medium Density


Part Description:
1.2V, 600 mA, Ultralow Noise,  High PSRR, RF Linear Regulator


Part Description:
1.8V, 600 mA, Ultralow Noise,  High PSRR, RF Linear Regulator


Part Description:
3.3V, 600 mA, Ultralow Noise,  High PSRR, RF Linear Regulator


PackageDescription:
SON, 0.50mm Pitch; 8 Pin, 2.00mm W X 2.00mm L X 0.65mm H body (w/thermal tab 1.1 X 1.7 mm), IPC Medium Density

Part Description:
0.8V to 5.5 V, 500 mA, Low Quiescent Current, CMOS Adjustable Linear Regulator


PackageDescription:
SOP, 0.65mm Pitch; 8 Pin, 3.00mm W X 3.00mm L X 1.10mm H Body, (w/Thermal Tab 1.76X 1.82mm), IPC Medium Density


PackageDescription:
SOT23, 0.95mm pitch; 5 pin, 1.75mm W X 3.00mm L, IPC Medium Density

Part Description:
3.3V, 150mA, Ultralow Noise, CMOS Linear Regulator


Part Description:
1.2V, 200mA, Ultralow Noise, CMOS Linear Regulator


Part Description:
1.5V, 200mA, Ultralow Noise, CMOS Linear Regulator


Part Description:
2.5V, 200mA, Ultralow Noise, CMOS Linear Regulator


Part Description:
3.3V, 200mA, Ultralow Noise, CMOS Linear Regulator


PackageDescription:
QFN, 0.65mm pitch,square; 4 pin X 4 pin, 4mm X 4mm X 1mm H body (w/thermal tab 2.25 X 2.25mm),  IPC Medium Density


Part Description:
2A, 0.75V to 3.0V Adjustable, Low-Dropout Linear Regulator


PackageDescription:
QFN, 0.50mm Pitch, Square; 16 Pin, 3.00mm L X 3.00mm W X 0.80mm H Body (w/Thermal Tab 1.75 X 1.75mm),  IPC Medium Density

Part Description:
0.5V to 1.5V, 3A, Low VIN, Low Noise, CMOS Linear Regulator


PackageDescription:
SOT23, 0.95mm pitch; 6 pin, 1.6mm W X 2.90mm L X 1.00mm H body, IPC Medium Density

Part Description:
1.2A, 20V, 700KHz, Nonsynchronous Step-Down Regulator


PackageDescription:
SOIC 8, Pitch 1.27mm, Body 4x5mm, (w/thermal tab 2.29mm X 2.29mm), IPC Medium Density

Part Description:
1.2V to 2.3V, 600 mA, Ultralow Noise, High PSRR, RF Adjustable Linear Regulator


Part Description:
3A, 20V, 700kHz Nonsynchronous Step-Down Regulator


PackageDescription:
SOT23, 0.95mm pitch; 6 pin, 1.6mm W X 2.9mm L X 1.45mm H body, IPC Medium Density

Part Description:
3.3V High Accuracy anyCAP® 50 Ma Low Dropout Linear Regulator


Part Description:
3V High Accuracy anyCAP® 50 Ma Low Dropout Linear Regulator


Part Description:
5V High Accuracy anyCAP® 50 Ma Low Dropout Linear Regulator


Part Description:
Adjustable Output Ultralow IQ, 200 mA, anyCAP® Low Dropout Regulator


PackageDescription:
SOT223, 2.30mm pitch; 3 pin, 3.70mm W X 6.70mm L, IPC Medium Density

Part Description:
1.8V, 1.5A, High Accuracy, UltraLow Iq, AnyCAP Low Dropout Regulator


PackageDescription:
QFN, 0.50mm pitch,square; 12 pin X 12 pin, 7mm X 7mm X 0.8mm H body (w/thermal tab 5.70 X 5.70mm),  IPC Medium Density

Part Description:
5-Channel Integrated Power Solution with Quad buck Regulators and 200mA LDO Regulator


Part Description:
Quad Buck Regulator Integrated Power Solution


PackageDescription:
SOP, 0.65mm Pitch; 20 Pin, 4.40mm W X 6.50mm L X 1.20mm H Body (w/Thermal Tab 3.05mm X 4.25mm), IPC Medium Density

Part Description:
1A/0.6A, DC-to-DC Switching Regulator with Independent Positive and Negative Outputs


Part Description:
5V, 300mA, Low Noise, CMOS LDO Linear Regulator


Part Description:
1.22V to 19V, 300mA, Low Noise, CMOS LDO Adjustable Linear Regulator


Part Description:
20V, 500mA, Low Noise, CMOS LDO Linear Regulator


Part Description:
1.2 to 3.3V, 2A, Ultralow Noise, High PSRR, RF Linear Regulator


Part Description:
–5V, -200mA, Low Noise, Linear Regulator


Part Description:
-1.22V to -27V, -200mA, Adjustable, Low Noise, Negative Linear Regulator


Part Description:
Ultracompact, Precision 10.0V Voltage References


PackageDescription:
SOT353, Pitch 0.65mm, 5-Leads, 1.40mm W X 2.15mm L, IPC Medium Density

Part Description:
Ultracompact, Precision 5.0V Voltage References


Part Description:
Ultracompact, Precision 2.5V Voltage References


PackageDescription:
SOT23, 0.95mm pitch; 6 pin, 1.625mm W X 2.90mm L X 1.00mm H body, IPC Medium Density

Part Description:
0.35% Accuracy, ±25ppm/°C, Precision Series Sub-Band Gap Voltage Reference


Part Description:
1.2V Micropower, High Accuracy Voltage References


Part Description:
3V ±6mV Low Power, Low Noise Voltage References with Sink/Source Capability


Part Description:
5V Micropower, Low Noise Precision Voltage References with Shutdown


PackageDescription:
SOP, 0.65mm pitch; 8 pin, 3.00mm W X 3.00mm L X 1.10mm H body, IPC Medium Density

Part Description:
2.5V ±3mV 10ppm, Ultraprecision, Low Noise, XFET® Voltage References


Part Description:
2.5V Output,  3mV ±0.12% Accuracy, 10ppm/°C Ultralow Noise XFET Voltage References with Current Sink and Source Capability


Part Description:
2.5V Output,  1mV ±0.04% Accuracy, 3ppm/°C Ultralow Noise XFET Voltage References with Current Sink and Source Capability


Part Description:
3V Output,  ±1.5mV ±0.05% Accuracy, 3ppm/°C Ultralow Noise XFET Voltage Reference with Current Sink and Source Capability


Part Description:
4.096V Output,  ±1.5mV ±0.04% Accuracy, 3ppm/°C Ultralow Noise XFET Voltage References with Current Sink and Source Capability


Part Description:
5V Output,  ±6mV ±0.12% Accuracy, 10ppm/°C Ultralow Noise XFET Voltage References with Current Sink and Source Capability


Part Description:
5V Output,  ±2mV ±0.04% Accuracy, 3ppm/°C Ultralow Noise XFET Voltage References with Current Sink and Source Capability


Part Description:
5V Output,  ±2mV ±0.04% Accuracy, 3ppm/°C Low Noise XFET Voltage References with Current Sink and Source Capability


Part Description:
2.048V Output, ±1mV ±0.05% Accuracy, 3ppm/°C Ultralow Noise XFET Voltage References with Current Sink and Source Capability


Part Description:
2.5V Output, ±3mV ±0.12% Accuracy, 10ppm/°C Ultralow Noise, LDO XFET Voltage References with Current Sink and Source


Part Description:
2.5V Output, ±1mV ±0.04% Accuracy, 3ppm/°C Ultralow Noise, LDO XFET Voltage References with Current Sink and Source


Part Description:
3V Output, ±4mV ±0.13% Accuracy, 10ppm/°C Ultralow Noise, LDO XFET Voltage References with Current Sink and Source


Part Description:
3V Output, ±1.2mV ±0.04% Accuracy, 3ppm/°C Ultralow Noise, LDO XFET Voltage References with Current Sink and Source


Part Description:
4.096V Output, ±1.6mV ±0.04% Accuracy, 3ppm/°C Ultralow Noise, LDO XFET Voltage References with Current Sink and Source


Part Description:
5V Output, ±6mV ±0.12% Accuracy, 10ppm/°C Ultralow Noise, LDO XFET Voltage References with Current Sink and Source


Part Description:
5V Output, ±2mV ±0.04% Accuracy, 3ppm/°C Ultralow Noise, LDO XFET Voltage References with Current Sink and Source


PackageDescription:
Power-over-Ethernet Plus (POE+) Module, Body L 57.3mm x W 18mm x H 14mm


PackageDescription:
DPAK TO-252, 2.28mm pitch; 2 pin, 9.7mm L X 6.7mm W X 2.40mm H body


Part Description:
1.25V To 5V, 1A Low-Dropout Positive Adjustable Voltage Regulator


PackageDescription:
SOT23, 0.95mm pitch; 5 pin, 1.6mm W X 3.0mm L X 1.45mm H body, IPC Medium Density

Part Description:
300mA, Low Quiecent Current, Fast Transient Low Dropout Linear Regulator


PackageDescription:
SOT23, 0.95mm pitch; 5 pin, 1.6mm W X 3.0mm L X 1.40mm H body, IPC Medium Density

Part Description:
1.8V 600mA CMOS Low Dropout Linear Regulator with Enable


Part Description:
3.3V 600mA CMOS Low Dropout Linear Regulator with Enable


PackageDescription:
SOIC, 1.27mm Pitch, 8 Pin, 3.90mm W X 4.90mm L X 1.70mm H Body (w/Thermal Tab 2.71 X 3.40mm), IPC Medium Density

Part Description:
4.5V to 18V Input, 3A Synchronous DC-DC Buck Converter


Part Description:
Light Load Improved 1.5A Synch DC/DC Buck Converter


PackageDescription:
SOIC, 1.27mm Pitch; 8 Pin, 3.90mm W X 4.90mm L X 1.75mm H body, (w/thermal tab 2.71mm X 3.35mm), IPC Medium Density

Part Description:
1.5A, 0.8V to 3.3V Low-Dropout Linear Regulator with Programmable Soft-Start


PackageDescription:
SOT23 3-Leads, Pitch 0.95mm - Body 1.3x2.9mm, IPC Medium Density

Part Description:
3.3V, 150mA Low Quiescent Current, Fast Transient Low Dropout Linear Regulator


PackageDescription:
SON, 0.65mm Pitch, 6 Pin, 2.00mm W X 2.00mm L X 0.80mm H body (W/Thermal Tab 0.65mm X 1.45mm), IPC Medium Density

Part Description:
0V to 6V Input, 1A, 1.5MHz, Step-Down DC-DC Converter


Part Description:
Precision, Adjustable Shunt Regulator (2.5V to 36V)


Part Description:
Precision, Adjustable Shunt Regulator, Low Voltage (1.25V)


PackageDescription:
SOT23, 0.95mm pitch; 5 pin, 1.6mm W X 2.9mm L X 1.00mm H body, IPC Medium Density

Part Description:
Precision, Adjustable Shunt Regulator (600mV Reference)


Part Description:
(Up to 5.5V) Input  to (0 to 38V) Output, 600mA, 1MHz DC-DC  Step-Up DC-DC (Ideal For Driving LEDs)


PackageDescription:
QFN, 0.65mm pitch, square; 44 pin, 10mm L X 7.5mm W X 1.9mm H body (w/thermal tab 2.425mm x 4.15mm)

Part Description:
3A Voltage Mode Synchronous Buck PWM DC-DC Converter With Integrated Inductor External Feedback Output Voltage Programming


PackageDescription:
QFN, 0.65mm pitch, square; 58 pin, 12mm L X 10mm W X 1.95mm H body (w/thermal tab 6.955mm x 4.425mm)

Part Description:
6A Voltage Mode Synchronous Buck PWM DC-DC Converter With Integrated Inductor 3-Pin VID Output Voltage Select


PackageDescription:
QFN, 0.50mm pitch, square; 30 pin, 5mm L X 4mm W X 1.9mm H body (w/thermal tab 1.215mm x 2.6mm)

Part Description:
1A Voltage Mode Synchronous Buck PWM DC-DC Converter With Integrated Inductor


PackageDescription:
QFN, 0.5mm pitch, Rectangular, 38 Pin, 7mm L X 4mm W X 1.85mm H Body (w/Thermal Tab 1.93mm x 2.6mm)

Part Description:
4A PowerSoC Voltage Mode Synchronous PWM Buck with Integrated Inductor


Part Description:
8A PowerSoC Highly Integrated Synchronous DC-DC Buck with Integrated Inductor


PackageDescription:
QFN, 0.50mm pitch, square; 56 pin, 8mm L X 8mm W X 3mm H body (w/multiple thermal tab)

Part Description:
6A Highly Integrated Synchronous DC-DC Buck with Integrated Inductor


PackageDescription:
QFN, 0.50mm pitch, square; 76 pin, 11mm L X 10mm W X 3mm H body (w/thermal tab 2.6mm x 8.1mm)

Part Description:
12A Highly Integrated Synchronous DC-DC Buck with Integrated Inductor


PackageDescription:
QFN, 0.50mm Pitch, Square; 4 Pin X 4 Pin, 3mm X 3mm X 1.00mm H Body (w/thermal Tab 1.95 X 1.95mm), IPC Medium Density

Part Description:
Quad Low Noise High PSRR Linear Voltage Regulator


Part Description:
8V-55V To 3.3V-50V, 1.5A Step Down Switching Regulator


PackageDescription:
D2PAK TO-263, TO, 2.54mm pitch; 2 pin,15.425mm L X 9.15mm W X 4.60mm H body, IPC Medium Density


PackageDescription:
D2PAK TO-263, TO, 2.54mm Pitch; 3 Pin, 15.24mm L X 10.4mm W X 4.6mm H Body, IPC Medium Density

Part Description:
3.3V 1.5A Low-Dropout Positive Voltage Regulator


PackageDescription:
TO-252AA DPAK TO, 2.28mm pitch; 2 pin,9.905mm L X 6.095mm W X 2.39mm H body, IPC Medium Density

Part Description:
2.5V 1.5A Low-Dropout Positive Voltage Regulator


PackageDescription:
DPAK TO-252, 2.28mm pitch; 2 pin, 9.725mm L X 6.10mm W X 2.40mm H body, IPC Medium Density

Part Description:
1.2V 800mA Low drop fixed and adjustable positive voltage regulators


Part Description:
3.3V 800mA Low drop fixed and adjustable positive voltage regulators


Part Description:
5V 800mA Low drop fixed positive voltage regulators


Part Description:
1.8V, 800mA Low-Dropout Positive Voltage Regulator


Part Description:
2.5V, 800mA Low-Dropout Positive Voltage Regulator


Part Description:
1.25V To 15V Adjustable, 800mA Low-Dropout Positive Voltage Regulator


PackageDescription:
SOT, 0.95mm pitch; 5 pin, 1.60mm W X 2.90mm L X 1.45mm H body, IPC Medium Density

Part Description:
3.3V, 150mA Ultra low drop-low noise BiCMOS voltage regulators low ESR capacitors compatible


Part Description:
3.3V 100mA Very Low Dropout Voltage Regulator with Inhibit Function


PackageDescription:
SOIC, 1.27mm Pitch; 20 Pin, 11.00mm W X 15.70mm L X 3.50mm H body (w/Thermal Tab on Top Side

Part Description:
3A Low-Dropout Positive Adjustable Voltage Regulator With Inhibit Function


Part Description:
3A Low-Dropout Negative Adjustable Voltage Regulator With Inhibit Function


PackageDescription:
TO-220 3-Terminal + Tab - Horizontal Mount


PackageDescription:
TO-220 3-Terminal + Tab - Vertical Mount


PackageDescription:
TO-263, TO, 2.54mm pitch; 3 pin,14.35mm L X 8.64mm W X 4.64mm H body IPC Medium Density

Part Description:
3.3V 3A Low Dropout Positive Voltage Regulator


Part Description:
1.5A, 1.2V to 15V Adjustable Low Dropout Positive Regulator


Part Description:
1.25V to 13.8V, 800mA, Adjustable Low-Dropout Linear Regulator


PackageDescription:
TO-18  3 Leads, Pitch 2.54mm, Body Dia. 5.84mm, Leads Dia. 0.5mm

Part Description:
1V To 40V, 1uA To 10mA Adjustable Current Source


PackageDescription:
TO-92 (TO226), Pitch 2.54mm, Flat Index, 3 In-Line, Bent Leads, Body Dia. 5.3mm

Part Description:
1V To 40V, 1uA to 10mA Adjustable Current Source


PackageDescription:
SOT, 0.95mm Pitch; 5 Pin, 1.60mm W X 2.90mm L X 1.45mm H body, IPC Medium Density


PackageDescription:
SOT23 5, Pitch 0.95mm - Body 1.67x2.99mm, IPC Medium Density

Part Description:
2.7V-14V, 1.8A, 0.6MHz Boost Converters With 22V Internal FET Switch


Part Description:
0.6/1.6 MHz Boost Converters With 40V Internal FET Switch in SOT-23


PackageDescription:
SOT, 0.95mm Pitch; 6 Pin, 1.60mm W X 2.90mm L X 1.10mm H Body, IPC Medium Density


Part Description:
1.24V to 5.30V Adjustable Micropower Voltage References


Part Description:
12V 1A Low Dropout Positive Voltage Regulator


Part Description:
5V 1A Low Dropout Positive Voltage Regulator


Part Description:
15V 1A Low Dropout Positive Voltage Regulator


PackageDescription:
TO-263, 5 Leads, 1.70mm pitch; TO, 14.35mm L X 8.64mm W X 4.65mm H body IPC Medium Density

Part Description:
5V to 20V, 1A Low Dropout Adjustable Regulator


Part Description:
3.3V 3A Low Dropout Fast Response Regulators


Part Description:
3-Terminal 12V 1A Negative Voltage Regulator


Part Description:
-3V to -24V, 1A Negative Low Dropout Adjustable Regulator


Part Description:
3-Terminal High-Voltage 1.2V To 37V 1.5A Positive Adjustable Regulator


PackageDescription:
D2PAK TO-263, TO, 2.54mm pitch; 3 pin, 14.199mm L X 9.195mm W X 4.57mm H body, IPC Medium Density

Part Description:
1.2V To 37V, 1.5A Adjustable Positive Voltage Regulator


Part Description:
3-Terminal 1.2V To 37V 1A Positive Adjustable Regulator


Part Description:
3-Terminal High-Voltage 1.2V To 57V 1.5A Positive Adjustable Regulator


Part Description:
1.25V To 32V, 100mA Adjustable  Positive Voltage Regulator


Part Description:
1.2V to 37V, 100mA Adjustable Positive Voltage Regulator


Part Description:
1.2V to 37V, 100mA, 3-Terminal Positive Adjustable Regulator


Part Description:
1.2V To 37 V, 1.5A Adjustable Negative Voltage Regulator


Part Description:
3-Terminal -1.2V To -37V 1A Adjustable Negative Regulator


Part Description:
1.2V to 37V, 100mA Adjustable Negative Voltage Regulator


Part Description:
1.5 A, −1.2V to −37 V Adjustable Output, Negative Voltage Regulator


Part Description:
3-Terminal 5V 1A Positive Voltage Regulator


Part Description:
3-Terminal 15V 1A Positive Voltage Regulator


PackageDescription:
SOT, 0.95mm, pitch; 3 pin,1.30mm W X 2.92mm L X 1.12mm H body, IPC Medium Density

Part Description:
3.3V, 100 mA Quasi Low-Dropout Linear Voltage Regulator


Part Description:
1.24V to 5.30V Adjustable Micropower Voltage Reference


Part Description:
10.0V ±0.1% 100 ppm/°C Precision Micropower Shunt Voltage Reference


Part Description:
1.24V To 5.3V ±2.0%, 150ppm/°C max Adjustable Micropower Voltage Reference


Part Description:
1A Low Dropout Regulator for 5V to 3.3V Conversion


Part Description:
2.5V ±0.1% 100 ppm/°C Precision Micropower Shunt Voltage Reference


Part Description:
2.048V ±0.2% 100 ppm/°C Precision Micropower Shunt Voltage Reference


Part Description:
10.0V ±0.5% 100 ppm/°C Precision Micropower Shunt Voltage Reference


Part Description:
5V ±1% 30ppm/°C Precision Micropower Shunt Voltage Reference


Part Description:
1.225V ±0.1% 100 ppm/°C Precision Micropower Shunt Voltage Reference


Part Description:
1.233V To 10V ±1% 150 ppm/°C Adjustable Precision Micropower Shunt Voltage Reference


PackageDescription:
TO-92 (TO-226), Pitch 1.27mm, Flat Index, 3 In-Line, Axial Leads, Body Dia. 5.3mm, Leads Dia. 0.5mm (max)

Part Description:
1.233V To 10V ±1.0%, 150ppm/°C max Adjustable Precision Micropower Shunt Voltage Reference


PackageDescription:
SOT, 0.95mm Pitch; 5 Pin, 1.60mm W X 2.90mm L X 1.45mm H Body, IPC Medium Density

Part Description:
2.048V Precision Micropower Low Dropout Voltage Reference


Part Description:
3.0V Precision Micropower Low Dropout Voltage Reference


Part Description:
1.2V 0.1% 3 ppm/°C, High Precision Low Noise Low Dropout Voltage Reference


Part Description:
2.5V 0.1% 3 ppm/°C, High Precision Low Noise Low Dropout Voltage Reference


Part Description:
4.096V 0.1% 3 ppm/°C, High Precision Low Noise Low Dropout Voltage Reference


Part Description:
2.5V 0.1% 10ppm/°C, High Precision Low Noise Low Dropout Voltage Reference


Part Description:
3-Terminal 10V 1A Positive Voltage Regulator


Part Description:
3-Terminal 12V 1A Positive Voltage Regulator


Part Description:
3-Terminal 5V 1A Negative Voltage Regulator


Part Description:
3-Terminal 10V 1A Negative Voltage Regulator


Part Description:
3-Terminal 15V 1A Negative Voltage Regulator


PackageDescription:
BGA, 0.50mm Pitch, Body 2.48x3.68x0.68mm; 28 Pin, 4 Columns X 7 Rows

Part Description:
1A SIMPLE SWITCHER® 42Vin, Step-Down Voltage Regulator


Part Description:
1.5V 3A Low Dropout Fast Response Regulators


PackageDescription:
uSIP 9 Pin Package, TEXAS Package SIL0008A, 0.65mm pitch; 2.6mm L X 3.0mm W X 1.5mm H body

Part Description:
1A SIMPLE SWITCHER® Nano Module with 5.5V Maximum Input Voltage


PackageDescription:
TO-PMOD 7 Pin Package, NATIONAL Package TZA07A, 1.70mm pitch; 9.85mm L X 10.16mm W X 4.67mm H body

Part Description:
3A SIMPLE SWITCHER® Power Module with 5.5V Maximum Input Voltage


Part Description:
3A SIMPLE SWITCHER® Power Module with 20V Maximum Input Voltage


PackageDescription:
TEXAS PackagePFM (NDY), 1.27mm pitch; 15mm X 15mm X 6mm body

Part Description:
10A SIMPLE SWITCHER® Power Module with 36V Maximum Input Voltage


Part Description:
1A SIMPLE SWITCHER® Power Module with 42V Maximum Input Voltage


PackageDescription:
TEXAS Package TO-PMOD (NDW), 1.27mm pitch; 9.85mm X 10.16mm X4.57m body

Part Description:
3A SIMPLE SWITCHER® Power Module with 36V Maximum Input Voltage


Part Description:
5A SIMPLE SWITCHER® Power Module with 36V Maximum Input Voltage


PackageDescription:
TEXAS Case Style B3QFN, QFN, 0.80mm Pitch, Square; 42 Pin, 10mm L X 10mm W X 4.4mm H body (w/thermal tab 5.95 X 3.19mm + 1.3 X 3.19mm )

Part Description:
4A SIMPLE SWITCHER® Power Module with 2.95V-17V Input and Current Sharing in QFN Package


Part Description:
7A SIMPLE SWITCHER® Power Module with 2.95V-17V Input and Current Sharing in QFN Package


Part Description:
5V Adjustable Micropower Low-Dropout Voltage Regulators


Part Description:
3.3V Micropower, 50mA Ultra Low-Dropout Voltage Regulator


Part Description:
3V, 150mA Low-Noise Low-Dropout Regulator Whit Shutdown


Part Description:
3.3V, 150mA Low-Noise Low-Dropout Regulator Whit Shutdown


Part Description:
3.3V Micropower, 200mA Ultra Low-Dropout Fixed or Adjustable Voltage Regulator


PackageDescription:
SOP, 8-Leads, Body 3.1x3.1mm (max), Pitch 0.65mm, IPC Medium Density


Part Description:
2.5V Micropower/Low Noise, 500 mA Ultra Low-Dropout Regulator


Part Description:
2.5V Micropower/Low-Noise, 250 mA Ultra Low-Dropout Regulator


Part Description:
1.8V 3A Fast Response Ultra Low Dropout Linear Regulators


Part Description:
2.5V 3A Fast-Response Ultra Low Dropout Linear Regulators


PackageDescription:
SOT223, SOT,1.50mm pitch; 5 pin, 3.56mm W X 6.50mm L X 1.80mm H body, IPC Medium Density

Part Description:
1A Low Dropout CMOS Linear Regulators Stable With Ceramic Output Capacitors


PackageDescription:
SON, 0.95mm Pitch; 6 Pin, 3.00mm W X 3mm L X 0.80mm H body (w/Thermal Tab 1.7mm x 2.2mm)

Part Description:
5V, 1A Low Dropout CMOS Linear Regulators Stable With Ceramic Output Capacitors


PackageDescription:
SOIC, 1.27mm pitch; 8 pin, 4.00mm W X 5.00mm L X 1.68mm H body (w/thermal tab), IPC Medium Density

Part Description:
1.0V Micropower 800mA Low Noise "Ceramic Stable" Voltage Regulator for Low Voltage Applications


Part Description:
1.2V Micropower 800mA Low Noise "Ceramic Stable" Voltage Regulator for Low Voltage Applications


Part Description:
1.2V 3A Fast-Response Ultra Low Dropout Linear Regulators


Part Description:
1.2V 3A Fast-Response High-Accuracy LDO Linear Regulator With Enable From The PowerWise® Family


PackageDescription:
SOIC,1.27mm,pitch;8 pin,3.905mm W X 4.895mm L X 1.68mm H body (w/thermal tab 3.1mm X 2.4mm), IPC Medium Density

Part Description:
1.2V, 0.8A Fast-Response Ultra Low Dropout Linear Regulator


Part Description:
2.5V, 800mA Fast Ultra Low Dropout Linear Regulators


Part Description:
1.8V, 150mA Linear Voltage Regulator For Digital Applications


PackageDescription:
BGA, 0.50mm Pitch, Rect.; 4 Pin, 2 Columns X 2 Rows, 0.96mm X 1.43mm X 0.675mm H

Part Description:
1.65V to 4V Input, 1.2V 300mA Output, LDO Linear Regulator for Digital Applications


PackageDescription:
SON, 0.65mm, Pitch; 6 Pin, 2.50mm W X 2.20mm L X 0.80mm H Body (W/Thermal Tab 0.75 X 1.2mm),  IPC Medium Density

Part Description:
3.3V,150mA Ultra Low Noise, Linear Regulator for RF/Analog Circuits Requires No Bypass Capacitor


PackageDescription:
SON, 0.65mm, Pitch; 6 Pin,2.00mm W X 2.00mm L X 0.80mm H body (W/Thermal Tab 1.1mm X 1.7mm),  IPC Medium Density

Part Description:
3.3V, 500mA Low-Noise, Low-IQ, LDO Linear Regulator


Part Description:
3V,  150mA Micropower Low-Dropout CMOS Voltage Regulator


Part Description:
5A Low Dropout  (1.5V) Positive Adjustable Regulators


PackageDescription:
TO-247 3-Terminal - Flipped Horizontal Mount


Part Description:
5V, 5A, Low Dropout (1.5V) Positive Fixed Regulators


Part Description:
5V 5A Low Dropout (1.5V) Positive Fixed Regulators


Part Description:
5A Low Dropout (1.5V) Positive Adjustable Regulator


Part Description:
5V 5A Low Dropout (1.5V) Positive Fixed Regulator


Part Description:
3A Low Dropout (1.5V) Positive Adjustable Regulator


Part Description:
5V 3A Low Dropout (1.5V) Positive Fixed Regulator


Part Description:
5V, 800mA Low-Dropout Positive Regulator


Part Description:
3.75V, 150mA Micropower Low Dropout Regulators with Shutdown


Part Description:
3.3V, 150mA Micropower Low-Dropout Regulator


PackageDescription:
TO, 1.70mm Pitch; 5 Pin, 13.945mm L X 8.89mm W X 4.572mm H body, IPC Medium Density

Part Description:
3.3V, 700mA Micropower Low Dropout Regulator with Shutdown


Part Description:
5V, 700mA Micropower Low Dropout Regulator with Shutdown


Part Description:
3.8V to 30V, 700mA Micropower Low Dropout Regulator with Shutdown


Part Description:
5V 500mA Negative Low Dropout Micropower Regulator


PackageDescription:
TO-263, 7 Leads, 1.70mm pitch; TO, 13.945mm L X 10.2mm W X 4.57mm H body IPC Medium Density

Part Description:
500kHz High Efficiency 6A Switching Regulator


Part Description:
4.5A 500kHz Step-Down Switching Regulator


Part Description:
4.096V 50mA Micropower Precision Low Dropout, Voltage Reference


Part Description:
5V 50mA Micropower Precision Low Dropout, Voltage Reference


Part Description:
1.25V, 10ppm/°C, Micropower Precision Shunt Voltage Reference


Part Description:
2.5V, 10ppm/°C, Micropower Precision Shunt Voltage Reference


PackageDescription:
SOT23, 0.95mm pitch; 5 pin, 1.6mm W X 2.9mm L, IPC Medium Density

Part Description:
3.3V, 100mA, Low Noise, LDO Micropower Regulator


Part Description:
5V, 100mA, Low Noise, LDO Micropower Regulator


Part Description:
1.22V to 20V, 100mA, Low Noise, LDO Adjustable Micropower Regulator


Part Description:
150mA, 1.22V to 20V, Low Noise, Adjustable LDO Micropower Regulator


Part Description:
1.22V to 20V 500mA, Low Noise, LDO Adjustable Micropower Regulator


PackageDescription:
SON, (DFN) 0.50mm,pitch;12 pin,3.00mm W X 4.00mm L X 0.80mm H body (w/thermal tab 1.8 X3.4mm), IPC Medium Density

Part Description:
1.8V 500mA, Low Noise, LDO Adjustable Micropower Regulator


Part Description:
Adjustable, 3A, Fast Transient Response, Low Noise, LDO Regulators


Part Description:
2.5V 3A, Fast Transient Response, Low Noise, LDO Regulators


Part Description:
3.3V 3A, Fast Transient Response, Low Noise, LDO Regulators


Part Description:
1.21V to 20V, 3A, Fast Transient Response, Low Noise, LDO Adjustable Regulator


PackageDescription:
SOIC 16, Pitch 1.27mm - Body 4x10mm, IPC Medium Density

Part Description:
1A Low Noise Step-Down Switching Regulator


Part Description:
(2.6V to +16V) Input  to (-0.4V to 36V) Output, 1A, 1.2MHz Step-Up DC-DC Converters


Part Description:
+16V to (-0.4V to -36V), 2.2MHz Inverting DC-DC Converters


Part Description:
+16V to (-0.4V to -36V), 1.2MHz Inverting DC-DC Converters


Part Description:
(2.3V to +16V) Input  to (-0.4V to 40V) Output, 1.2MHz Boost DC-DC Converter with 2A Switch


PackageDescription:
SOP, 0.65mm pitch; 28 pin, 4.50mm W X 9.70mm L (thermal tab 4.75 X 2.74mm), IPC Medium Density

Part Description:
3.5V to 25V, Triple Monolithic Switching Regulator


Part Description:
1.8V, 1.5A, Low Noise, Fast Transient Response LDO Regulator


Part Description:
3.3V, 1.5A, Low Noise, Fast Transient Response LDO Regulator


Part Description:
1.5A, 1.21V to 20V, Fast Transient Response, Adjustable LDO Regulator


Part Description:
-1.22V to -20V, 200mA, Low Noise, Low Dropout Negative Micropower Regulator


PackageDescription:
SON, (DFN) 0.50mm,pitch; 8 pin,3.00mm W X 3.00mm L X 0.80mm H body (w/thermal tab 1.75 X2.48mm), IPC Medium Density

Part Description:
(3V to 20V) Input to (1.2V to 19.5V) Output, 1.1A, Low Noise, Low Dropout Linear Regulator


Part Description:
(3V to 20V) Input to 2.5V Output, 1.1A, Low Noise, Low Dropout Linear Regulator


Part Description:
–1.22V to –29.3V, 1.5A, Low Noise, Negative Linear Regulator with Precision Current Limit


Part Description:
1.2V, 500mA, Low Voltage, Very Low Dropout Linear Regulator


PackageDescription:
DFN, 14-Leads, Body 3x4mm, Pitch 0.50mm, LINEAR DE14MA Package

Part Description:
Dual 20V 150mA Positive/Negative Low Noise Low Dropout Linear Regulator


PackageDescription:
SOP, 0.50mm, Pitch; 10 pin, 3.00mm W X 3.00mm L X 1.10mm H body (w/thermal tab  1.68 X 1.98 mm), IPC Medium Density

Part Description:
20V, 200mA, Ultralow Noise, Ultrahigh PSRR RF Linear Regulator


PackageDescription:
SON, 0.50mm Pitch, 10-pin, 3.00mm W  X 3.00mm L X 0.80mm Height, (w/thermal tab 1.75 X 2.48 mm), IPC Medium Density

Part Description:
20V, 500mA, Ultralow Noise, Ultrahigh PSRR Linear Regulator


PackageDescription:
SON, (DFN) 0.50mm,pitch; 10 pin,3.00mm W X 3.00mm L X 0.80mm H body (w/thermal tab 1.75 X2.48mm), IPC Medium Density

Part Description:
0.6V to 40V, 500mA, Low Noise, Adjustable Linear Regulator With Programmable Current Limit And Power Good


PackageDescription:
QFN, 0.50mm pitch, Rectangular, 6 pin X 8 pin, 4mm X 5mm body (w/thermal tab 2.75 X 3.75 mm), IPC Medium Density

Part Description:
0.8V to 1.8V Programmable Output, 5A, Low Noise, 85mV Dropout, Linear Regulator


Part Description:
0 To 36V Adjustable 1.1A Single Resistor Low Dropout Regulator


PackageDescription:
SOP, 0.65mm Pitch; 16 Pin, 4.40mm W X 5.00mm L X 1.10mm H body (w/thermal tab 2.94mm X 3.58mm), IPC Medium Density

Part Description:
1.2 To 36V, 1.5A Single Resistor Rugged Linear Regulator With Monitors


Part Description:
1.2V to 36V Input, 0 to 34.5V Output, 1.5A Single Resistor Rugged Adjustable Linear Regulator with Monitors


PackageDescription:
SON, 0.50mm Pitch; 14 Pin 4.00mm W X 4.00mm L X 0.80mm H body (w/thermal tab 2.75 X 3.5 mm), IPC Medium Density

Part Description:
Adjustable, 3A, Single Resistor Low Dropout Regulator


PackageDescription:
SON (DFN), 0.50mm pitch, 6 pin, 3mm X 2mm X 0.8mm H body (w/thermal tab 1.75 X 1.45mm),  IPC Medium Density

Part Description:
Adjustable 0V to 36V, 500mA Single Resistor Low Dropout Regulator


PackageDescription:
SOP, 0.65mm Pitch; 8 Pin, 3.00mm W X 3.00mm L X 1.10mm H body, (w/Thermal Tab 1.68X 1.88mm), IPC Medium Density


Part Description:
40V, 2.1A Low Dropout Adjustable Linear Regulator with Monitoring and Cable Drop Compensation


PackageDescription:
SOP,0.65mm pitch;12 pin,3.00mm W X 4.039mm L X 1.10mm H body, (w/thermal tab 1.75 X 2.94 mm), IPC Medium Density

Part Description:
–36V, 600mA Negative Linear Regulator with Programmable Current Limit


Part Description:
-1.5V to 36V Input, 0 to -32V Output, 1.5A Negative Linear Regulator with Programmable Current Limit


PackageDescription:
SON, 0.50mm Pitch, 10-pin, 2.00mm W  X 3mm L X 0.80mm Height, (w/thermal tab 0.69 X 2.44 mm Max), IPC Medium Density

Part Description:
2.5V-16V to Up to 40V, 650mA Micropower Low Noise Boost Converter with Output Disconnect


Part Description:
1A, 2.2MHz Step-Down Switching Regulator


PackageDescription:
QFN, 0.50mm Pitch, Square; 6 Pin X 6 Pin, 4mm X 4mm Body (w/Thermal Tab 2.55 X 2.55 mm), IPC Medium Density

Part Description:
Dual Monolithic 1.4A Step-Down Switching Regulator


PackageDescription:
SOP, 0.50mm Pitch; 16 Pins with 4 Pins Removed, 3.00mm W X 4.039mm L X 1.10mm H Body, IPC Medium Density

Part Description:
Monolithic High Voltage Isolated Flyback Converter


PackageDescription:
36-Lead Plastic QFN (5mm × 6mm), LINEAR UHE Package Variation: UHE28MA

Part Description:
Boost, Flyback, SEPIC and Inverting Converter with 5A, 40V Switch


Part Description:
Micropower, 400mV Reference with Rail-to-Rail Buffer Amplifier


Part Description:
1.25V, 0.05%, 10ppm/°C, 1uA Precision Voltage Reference


Part Description:
3.3V, 0.05%, 10ppm/°C, 1uA Precision Voltage Reference


PackageDescription:
QFN, 0.50mm Pitch, Rect.; 28 pin, 6.00mm L X 3.00mm W X 0.80mm H bodY (w/thermal tab 1.80 X 4.85mm), IPC Medium Density

Part Description:
42V, 6A Synchronous Step-Down Regulator with 3µA Quiescent Current


PackageDescription:
LQFN 24-Lead, 0.50mm pitch; 4.00mm W X 4.00mm L X 0.83mm H body (with 4 Thermal Tab 1.125 X1.125mm), LTC DWG # 05-08-1511

Part Description:
42V, 6A Synchronous Step-Down Silent Switcher 2 with 2.5µA Quiescent Current


Part Description:
1.19V to 30V, 2A, High Efficiency N-Channel Switching Regulator Controller


Part Description:
1.14V to 5.5V Input, 0.4V to 2.6V Output, 1.5A Low Input Voltage VLDO Linear Regulator


Part Description:
500mA Output Current Low Noise Dual Mode Step-Up Charge Pumps


PackageDescription:
MSOP16, Pitch 0.5mm - Body 3x4mm, (w/thermal tab 1.75mm X 2.9mm), IPC Medium Density

Part Description:
Low Noise Dual Supply, Inverting Charge Pump


PackageDescription:
QFN, 0.40mm Pitch, Rect.; 38 Pin, 6.00mm L X 4.00mm W X 0.80mm H Body (W/Thermal Tab 2.4mm X 4.4mm), IPC Medium Density

Part Description:
High Efficiency USB Power Manager with Boost, Buck-Boost and Dual Bucks


Part Description:
3.6V-15V to 15V Dual 3A Monolithic Step-Down Regulator for DDR Power


PackageDescription:
SOP, 0.65mm Pitch; 28 pin, 5.30mm W X 10.20mm L X 2.00mm H body, IPC Medium Density

Part Description:
100V Current Mode Synchronous Switching Regulator Controller


PackageDescription:
QFN, (MO-220WHHD-X) 0.50mm pitch,square; 8 pin X 8 pin, 5mm X 5mm X 1.00mm H body (w/thermal tab 3.55 X 3.55mm),  IPC Medium Density

Part Description:
60V Current Mode Synchronous Switching Regulator Controller


Part Description:
Current Mode Synchronous Step-Down Switching Regulator for Sub Milliohm DCR Sensing


Part Description:
PolyPhase Step-Down Slave Controller for Digital Power System Management


PackageDescription:
QFN, 0.50mm Pitch, Square; 40 Pin, 6.00mm L X 6.00mm W X 0.80mm H body (w/Thermal Tab 4.52 x 4.52mm), IPC Medium Density

Part Description:
Dual Output PolyPhase Step-Down DC/DC Controller with Digital Power System Management


PackageDescription:
QFN, 0.50mm pitch, Rectangular, 47 Pin, 8.5mm L X 7.5mm W X 0.8mm H Body (w/thermal tab 3.9 X 4.9mm), LINEAR_UKG52(46) Package

Part Description:
60V Dual Output, Step-Down Controller with Digital, Power System Management


Part Description:
1.25V, 0.25ppm Noise, Low Drift Precision Buffered Voltage Reference


Part Description:
3V3, 0.25ppm Noise, Low Drift Precision Buffered Voltage Reference


Part Description:
5V, 0.25ppm Noise, Low Drift Precision Buffered Voltage Reference


Part Description:
60V, 4A Synchronous  Step-Down Regulator for Inverting Outputs


PackageDescription:
LGA,1.27mm Pitch,Square;118 Pin,12 Columns X 12 Rows,15.00mm X 15.00mm X 2.92mm H

Part Description:
4.5V-20V To 0.6V-5V, Iout 12A DC/DC uModule® With PLL, Output Tracking And Margining


PackageDescription:
BGA, 1.27mm Pitch, Square; 118 Pin, 12 Columns X 12 Rows, 15.00mm X 15.00mm X 3.62mm H


PackageDescription:
LGA, 1.27mm Pitch, Rect.; 84 Pin, 7 Columns X 12 Rows, 9.00mm X 15.00mm X 4.42mm H

Part Description:
4.5V-26.5V to 0.8V-5V, 6A DC/DC μModule Regulator with Tracking and Frequency Synchronization


PackageDescription:
LGA,1.27mm pitch,square;144 pin,12 columns X 12 rows,15.00mm X 15.00mm X 2.92mm H (w/reversed pins)

Part Description:
4.5V-26.5V To 0.8V-5V, Iout 4A Dual DC-DC uModule Regulator


PackageDescription:
BGA, 1.27mm Pitch, Square; 25 Pin, 5 Columns X 5 Rows, 6.25mm X 6.25mm X 2.62mm H

Part Description:
3.6V-20V To 1.5V-12V, Dual 2A or Single 4A  Ultrathin Step-Down DC/DC μModule Regulator


PackageDescription:
LGA, 1.27mm Pitch, Square; 25 Pin, 5 Columns X 5 Rows, 6.25mm X 6.25mm X 1.92mm H

Part Description:
4V-20V to 0.6V-5.5V, Iout 3A Step-Down DC/DC uModule Regulator


PackageDescription:
LGA, 1.27mm Pitch, Square; 133 Pin, 12 Columns X 12 Rows, 15.00mm X 15.00mm X 4.42mm H

Part Description:
4.5V-20V To 0.6V-5V, 15A DC/DC μModule Regulator


PackageDescription:
LGA, 1.27mm Pitch, Square; 144 Pin, 12 Columns X 12 Rows, 15.00mm X 15.00mm X 4.42mm H (w/Reversed Pins)

Part Description:
4.5V-26.5V To 0.6V-5V, Dual 8A or Single 16A DC/DC μModule Regulator


PackageDescription:
BGA, 1.27mm Pitch, Rect.; 77 Pin, 7 Columns X 11 Rows, 9.00mm X 15.00mm X 5.21mm H

Part Description:
4V-14V to 0.6V-5.5V Quad DC/DC uModule (Power Module) Regulator with Configurable 4A Output Array


PackageDescription:
BGA, 1.27mm Pitch, Square; 144 Pin, 12 Columns X 12 Rows,16.00mm X 16.00mm X 5.21mm H

Part Description:
4.5V-26.5V to 0.5V-5.5V, Dual 13A or Single 26A uModule Regulator with Digital Power System Management


Part Description:
4.5V-26.5V to 0.5V-5.4V, Dual 13A or Single 26A uModule Regulator with Digital Power System Management


Part Description:
4.5V-16V to 0.5V-1.8V, Dual 18A or Single 36A uModule Regulator with Digital Power System Management


PackageDescription:
LGA, 1.27mm pitch,rect.; 50 pin,7 columns X 8 rows, 9.00mm X 11.25mm X 2.92mm H

Part Description:
3.6V-36V To 0.8V-10V, Iout 2A DC-DC uModule


PackageDescription:
LGA, 1.27mm pitch, rect., 70 pin, 7 columns X 11 rows, 9mm X 15mm X 4.42mm H

Part Description:
3.6V-36V To 0.8V-24V, Iout 3A Step Down uModule® Converter


PackageDescription:
LGA, 1.27mm pitch, rect., 71 pin, 7 columns X 11 rows, 9mm X 15mm X 2.97mm H

Part Description:
3V-36V To 0.8V-10V, Iout 2A, Ultralow Noise EMC Compliant DC-DC uModule


PackageDescription:
BGA, 1.27mm Pitch, Rect.; 77 Pin, 7 Columns X 11 Rows, 9.00mm X 15.00mm X 2.62mm H

Part Description:
Dual SEPIC or Inverting uModule DC/DC Converter


PackageDescription:
BGA, 1.27mm Pitch, Rect.; 70 Pin,7 Columns X 11 Rows,9.00mm X 15.00mm X 5.12mm H

Part Description:
3.6V-58V To 0.8V-24V, Iout 2A Step Down uModule® Regulator


PackageDescription:
SON, 0.50mm Pitch, 10-pin, 3.00mm W  X 3.00mm L X 0.80mm Height, (w/thermal tab 1.60 X 2.40 mm), IPC Medium Density

Part Description:
1.425V to 3.6V Input, 1A Low-Dropout Regulators with BIAS Input


Part Description:
2.5V, 200mA, Negative-Output, Low-Dropout Linear Regulator


Part Description:
3V, 200mA, Negative-Output, Low-Dropout Linear Regulator


Part Description:
5V, 200mA, Negative-Output, Low-Dropout Linear Regulator


Part Description:
12V or Adjustable, High-Efficiency, Low IQ, Step-Up DC-DC Controller


Part Description:
2.5V, 15mA, Ultra-High-Precision Voltage References


Part Description:
3V, 0.06%, 3ppm/°C, Ultra-High-Precision, Ultra-Low-Noise, Voltage References


Part Description:
3V, 0.02%, 3ppm/°C, Ultra-High-Precision, Ultra-Low-Noise, Voltage References


Part Description:
4.1V, 0.02%, 3ppm/°C, Ultra-High-Precision, Ultra-Low-Noise, Voltage References


Part Description:
2.5V, 0.06%, 3ppm/°C, High-Precision Voltage Reference with Temperature Sensor


Part Description:
4.096V, 0.06%, 3ppm/°C, High-Precision Voltage Reference with Temperature Sensor


Part Description:
5V, 0.06%, 3ppm/°C, High-Precision Voltage Reference with Temperature Sensor


Part Description:
10V, 0.05%, 3ppm/°C, High-Precision Voltage Reference with Temperature Sensor


Part Description:
3.3V, 0.06%, 3ppm/°C, High-Precision Voltage Reference with Temperature Sensor


Part Description:
1ppm/°C, Low-Noise, Precision, +5.000V Voltage Reference


Part Description:
1ppm/°C, Low-Noise, +2.500V Voltage References


Part Description:
1ppm/°C, Low-Noise, +4.096V Voltage References


Part Description:
1ppm/°C, Low-Noise, +5.000V Voltage References


Part Description:
4V-11.5V To 5V, Iout 225mA, High-Efficiency, Low Iq, Step-Down DC-DC Converter


Part Description:
+12V, 30mA Inductorless, Flash Memory Programming Supply


PackageDescription:
SOP, 0.635mm pitch; 16 pin, 3.9mm W X 4.895mm L X 1.75mm H Body, IPC Medium Density

Part Description:
Fan-Speed Regulators and Monitors with SMBus/I²C-Compatible Interface


PackageDescription:
SON, 0.50mm Pitch; 8 Pin,2.00mm W X 2.00mm L X 0.80mm H Body, (w/thermal tab 0.8 X 1.4mm), IPC Medium Density

Part Description:
1.8V, 120mA, Ultra-Low-Noise, High PSRR, Low-Dropout Linear Regulator


Part Description:
3.3V, 120mA, Ultra-Low-Noise, High PSRR, Low-Dropout Linear Regulator


PackageDescription:
SOT353, SC70-5, SOT, 0.65mm Pitch, 5 pin, 1.25mm W X 2.00mm L X 1.10mm H, IPC Medium Density

Part Description:
3V, 120mA, Ultra-Low-Noise, High PSRR, Low-Dropout Linear Regulator


PackageDescription:
QFN, 0.80mm Pitch, Square; 16 Pin, 5.00mm L X 5.00mm W X 0.80mm H body (w/thermal tab 3.2 X 3.2mm),  IPC Medium Density

Part Description:
0.5V to 3.4V 4A Ultra-Low-Input-Voltage (1.425V to 3.6V) LDO Regulator


PackageDescription:
SON, 0.50mm,pitch; 6 pin,1.00mm W X 1.50mm L X 0.80mm H body (w/pullback leads),  IPC Medium Density

Part Description:
3V, 150mA Ultra-Low-Noise, High PSRR, Low-Dropout, Linear Regulators


PackageDescription:
SOP, 0.65mm Pitch; 16 Pin, 4.40mm W X 5.00mm L X 1.10mm H body (w/thermal tab 3.10mm X 3.10mm), IPC Medium Density

Part Description:
1.8V, 1A, Microcap, Low-Dropout, Linear Regulator


Part Description:
High-Frequency (0.5MHz), Regulated, 200mA, Inverting Charge Pump


Part Description:
2.8V, 120mA, Low-Noise, High PSRR, Low-Dropout Linear Regulator


Part Description:
3V, 120mA, Low-Noise, High PSRR, Low-Dropout Linear Regulator


Part Description:
3V to 40V 1.5A Peak Boost/Buck/Inverting Switching Regulator


Part Description:
3-Terminal 24V 1A Positive Voltage Regulator


Part Description:
3-Terminal 5V 100mA Positive Voltage Regulator


Part Description:
3-Terminal 5V 500mA Positive Voltage Regulator


Part Description:
3-Terminal 24V 1A Negative Voltage Regulator


Part Description:
0.8V to 4.5V, 500mA, 2.0 MHz, Adjustable Synchronous Buck Regulator


Part Description:
30V Input, 2V to 24V Output, 1A High-Efficiency, Integrated Synchronous Switch Step-Down Regulator


PackageDescription:
SOT, 0.95mm Pitch; 3 Pin, 1.50mm W X 2.90mm L X 1.45mm H Body, IPC Medium Density

Part Description:
5V 250mA Low Quiescent Current LDO Positive Voltage Regulator


PackageDescription:
SON, 0.65mm pitch, 8 pin, 3mm X 3mm X 1.00mm H body (w/thermal tab 1.60 X 2.4mm),  IPC Medium Density

Part Description:
1A, 0.8V to 5.0V Adjustable, Low Quiescent Current LDO Regulator


PackageDescription:
SOT, 0.95mm Pitch; 5 Pin,1.55mm W X 2.90mm L X 1.45mm H body, IPC Medium Density

Part Description:
3V, 300mA, High PSRR, Low Quiescent Current LDO


Part Description:
1.2V 300mA, Low Voltage, Low Quiescent Current LDO Regulator


PackageDescription:
SOT223, 6-Leads, Body 6.6x7.3mm (max), Pitch 1.27mm, IPC Medium Density

Part Description:
0.8V to 5.0V, 1A Low Voltage, Low Quiescent Current, Adjustable Positive LDO Regulator


PackageDescription:
DDPAK TO-263, TO, 1.70mm Pitch; 5 Pin, 15.24mm L X 8.781mm W X 4.597mm H body, IPC Medium Density

Part Description:
1.25V to 26V, 1.5A Low Dropout Adjustable Regulator


Part Description:
3-Terminal 3.3V 3A High-Current Low-Dropout Regulator


Part Description:
3-Terminal 3.3V 3A High-Current Low-Dropout Regulator (RoHS)


PackageDescription:
D2PAK TO-263, TO, 2.54mm Pitch; 3 Pin, 15.24mm L X 10.36mm W X 4.597mm H Body, IPC Medium Density


Part Description:
1.25V to 26V Adjustable, 5A, High-Current Low-Dropout Regulator


PackageDescription:
TO, 1.70mm Pitch; 5 Pin,10.54mm L X 8.00mm W X 2.03mm H body, IPC Medium Density

Part Description:
3.0A, Adjustable (1.24V to 5.5V) Low Voltage uCap LDO Regulator


PackageDescription:
MICROCHIP_H3QFN88-52LD-PL-3, 0.50mm Pitch, Square, 52 Pin, 8mm L X 8mm W X 3mm H Body

Part Description:
0.8V to 85% PVIN (4.75-19V), 6A Synchronous Step-Down Regulator Module


PackageDescription:
SOIC 14, Pitch 1.27mm - Body 4x8.75mm, IPC Medium Density


Part Description:
5V, Low Quiescent Current 500mA uCap LDO Regulator


PackageDescription:
TO, 1.27mm Pitch; 7 Pin,10.54mm L X 8.00mm W X 2.03mm H body, IPC Medium Density

Part Description:
5A, Low VIN, Low VOUT uCap LDO Regulator


Part Description:
1.5V 1A Low-Dropout Positive Voltage Regulator


Part Description:
3.3V 1A Low-Dropout Positive Voltage Regulator


Part Description:
5V 1A Low-Dropout Positive Voltage Regulator


PackageDescription:
SOT23 3-Leads, Pitch 0.95mm - Body 1.4x3mm, IPC Medium Density

Part Description:
3.3V, 20mA Micropower Precision Voltage Reference


PackageDescription:
SOT223, 2.30mm pitch; 4 pin, 3.50mm W X 7.0mm L, IPC Medium Density

Part Description:
1.8V, 1.5 A Low Dropout Linear Regulator


PackageDescription:
SON, 0.80mm Pitch, 8 Pin, 4mm X 4mm X 1.00mm H Body (w/Thermal Tab 2.21 X 2.39mm),  IPC Medium Density

Part Description:
5V, 1.5A, Very Low-Dropout (VLDO) Fast Transient Response Regulator


PackageDescription:
SON, 0.50mm pitch, 6 pin, 2.0mm X 1.8mm X 0.6mm H body,  ON SEMICONDUCTOR Case 517BA-01


PackageDescription:
SOT, 0.95mm Pitch; 5 Pin, 1.50mm W X 3.00mm L X 1.10mm H Body, IPC Medium Density

Part Description:
3.3V 300mA, Ultra-Low Quiescent Current, IQ 12uA, Ultra-Low Noise, LDO Voltage Regulator


PackageDescription:
OKI-78SR Series, 3 Pin Non-Isolated Switching Regulator DC-DC , Body W 10.4mm x L 16.5mm H 7.6mm

Part Description:
7-36V to 3.3V, Iout (max) 1.5A, 4.95W Non-Isolated Switching Regulator DC-DC


PackageDescription:
LGA, 1.00mm pitch,rect.; 123 pin, 10 columns X 14 rows, 10.00mm X 14.00mm X 2.63mm H (w/Reversed Pins)

Part Description:
8V to 18V Input, 1.0V Output, 15A Cool-Power ZVS Buck Regulator (PICOR Cool-Power)


Part Description:
8V to 18V Input, 1.8V Output, 15A Cool-Power ZVS Buck Regulator (PICOR Cool-Power)


Part Description:
8V to 18V Input, 2.5V Output, 15A Cool-Power ZVS Buck Regulator (PICOR Cool-Power)


Part Description:
8V to 18V Input, 3.3V Output, 15A Cool-Power ZVS Buck Regulator (PICOR Cool-Power)


Part Description:
8V to 18V Input, 5.0V Output, 15A Cool-Power ZVS Buck Regulator (PICOR Cool-Power)


Part Description:
5V 3A Adjustable Positive Step-down Integrated Switching Regulator


Part Description:
10-A, 4.75-V to 14-V Input, Non-Isolated, Wide-Output, Digital POWERTRAIN Module


Part Description:
20-A, 4.75-V to 14-V Input, Non-Isolated, Wide-Output, Digital POWERTRAIN Module


Part Description:
Dual 10-A, 4.75-V to 14-V Input, Non-Isolated, Digital POWERTRAIN Module


Part Description:
6A, 2.2V to 5.5V Input, Non-Isolated, 0.69 to 3.6V Output, Adjustable Power Module With TurboTrans™


Part Description:
16A, 4.5V to 14V Input, Non-Isolated, 0.69V to 5.5V Output Adjustable Power Module With TurboTrans


Part Description:
10A, 4.5V to 14V Input, Non-Isolated, 0.69V to 5.5V Output Adjustable Power Module With TurboTrans


